DE1965397A1 - Verfahren zur Herstellung von elektrischen Anschluessen - Google Patents
Verfahren zur Herstellung von elektrischen AnschluessenInfo
- Publication number
- DE1965397A1 DE1965397A1 DE19691965397 DE1965397A DE1965397A1 DE 1965397 A1 DE1965397 A1 DE 1965397A1 DE 19691965397 DE19691965397 DE 19691965397 DE 1965397 A DE1965397 A DE 1965397A DE 1965397 A1 DE1965397 A1 DE 1965397A1
- Authority
- DE
- Germany
- Prior art keywords
- conductor
- insulation
- pin
- exposed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Multi-Conductor Connections (AREA)
- Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78821968A | 1968-12-31 | 1968-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1965397A1 true DE1965397A1 (de) | 1970-07-23 |
Family
ID=25143811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19691965397 Pending DE1965397A1 (de) | 1968-12-31 | 1969-12-30 | Verfahren zur Herstellung von elektrischen Anschluessen |
Country Status (4)
| Country | Link |
|---|---|
| BE (1) | BE743759A (https=) |
| DE (1) | DE1965397A1 (https=) |
| FR (1) | FR2027447A1 (https=) |
| GB (1) | GB1295270A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004058691A1 (de) * | 2004-12-06 | 2006-06-14 | Robert Bosch Gmbh | Anordung einer elektrischen Verbindung und Verfahren zur Herstellung derselben |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2018036B (en) * | 1978-03-31 | 1982-08-25 | Vishay Intertechnology Inc | Precision resistors subassemblies therefor and their manufacture |
-
1969
- 1969-12-15 GB GB1295270D patent/GB1295270A/en not_active Expired
- 1969-12-29 BE BE743759D patent/BE743759A/xx unknown
- 1969-12-30 FR FR6945361A patent/FR2027447A1/fr not_active Withdrawn
- 1969-12-30 DE DE19691965397 patent/DE1965397A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004058691A1 (de) * | 2004-12-06 | 2006-06-14 | Robert Bosch Gmbh | Anordung einer elektrischen Verbindung und Verfahren zur Herstellung derselben |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1295270A (https=) | 1972-11-08 |
| BE743759A (https=) | 1970-05-28 |
| FR2027447A1 (https=) | 1970-09-25 |
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