DE1953678A1 - Schaltungstraeger fuer elektrische Schaltungselemente und -bestandteile,sowie Verfahren zu dessen Herstellung - Google Patents
Schaltungstraeger fuer elektrische Schaltungselemente und -bestandteile,sowie Verfahren zu dessen HerstellungInfo
- Publication number
- DE1953678A1 DE1953678A1 DE19691953678 DE1953678A DE1953678A1 DE 1953678 A1 DE1953678 A1 DE 1953678A1 DE 19691953678 DE19691953678 DE 19691953678 DE 1953678 A DE1953678 A DE 1953678A DE 1953678 A1 DE1953678 A1 DE 1953678A1
- Authority
- DE
- Germany
- Prior art keywords
- film
- conductive pattern
- circuit elements
- contact
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/077—Connecting of TAB connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE14398/68A SE343430B (https=) | 1968-10-24 | 1968-10-24 | |
| SE03255/69A SE350649B (https=) | 1969-03-10 | 1969-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1953678A1 true DE1953678A1 (de) | 1970-04-30 |
Family
ID=26654427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19691953678 Pending DE1953678A1 (de) | 1968-10-24 | 1969-10-24 | Schaltungstraeger fuer elektrische Schaltungselemente und -bestandteile,sowie Verfahren zu dessen Herstellung |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1953678A1 (https=) |
| FR (1) | FR2021484A1 (https=) |
| NL (1) | NL6915992A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3836405A1 (de) * | 1988-10-26 | 1990-05-03 | Teves Gmbh Alfred | Platinenanordnung, insbesondere fuer einen ventilblock einer schlupfgeregelten hydraulischen bremsanlage |
| US6094330A (en) * | 1998-01-14 | 2000-07-25 | General Electric Company | Circuit interrupter having improved current sensing apparatus |
| DE102011089639A1 (de) * | 2011-12-22 | 2013-06-27 | Siemens Aktiengesellschaft | Schaltungsträger mit einer separaten HF-Schaltung und Verfahren zum Bestücken eines solchen Schaltungsträgers |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7704773A (nl) * | 1977-05-02 | 1978-11-06 | Philips Nv | Hybrideschakeling voorzien van een halfgeleider- schakeling. |
| US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
| US5375041A (en) * | 1992-12-02 | 1994-12-20 | Intel Corporation | Ra-tab array bump tab tape based I.C. package |
-
1969
- 1969-10-23 FR FR6936449A patent/FR2021484A1/fr not_active Withdrawn
- 1969-10-23 NL NL6915992A patent/NL6915992A/xx unknown
- 1969-10-24 DE DE19691953678 patent/DE1953678A1/de active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3836405A1 (de) * | 1988-10-26 | 1990-05-03 | Teves Gmbh Alfred | Platinenanordnung, insbesondere fuer einen ventilblock einer schlupfgeregelten hydraulischen bremsanlage |
| US6094330A (en) * | 1998-01-14 | 2000-07-25 | General Electric Company | Circuit interrupter having improved current sensing apparatus |
| DE102011089639A1 (de) * | 2011-12-22 | 2013-06-27 | Siemens Aktiengesellschaft | Schaltungsträger mit einer separaten HF-Schaltung und Verfahren zum Bestücken eines solchen Schaltungsträgers |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2021484A1 (https=) | 1970-07-24 |
| NL6915992A (https=) | 1970-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3177304T2 (de) | Metallschichten zur Verwendung in einem Verbindungssystem für elektronische Schaltung. | |
| DE69711735T2 (de) | Gedruckte Schaltungsplatte oder Halbleitervorrichtung mit anisotrop leitenden Platten | |
| DE2840514C2 (https=) | ||
| DE3125518C2 (de) | Verfahren zur Herstellung einer dünnen Verdrahtungsanordnung | |
| DE2810054A1 (de) | Elektronische schaltungsvorrichtung und verfahren zu deren herstellung | |
| DE19509441C2 (de) | Integrierte Hybrid-Leistungsschaltungsvorrichtung | |
| EP0218069A1 (de) | Verfahren zum Verschweissen mittels Laserlicht | |
| DE2314731A1 (de) | Halbleiterbauteil mit vorspruengen und verfahren zur herstellung desselben | |
| DE19828489A1 (de) | Halbleiterbauelement | |
| DE2536316A1 (de) | Elektrische schaltungsanordnung in kompaktbauweise | |
| DE1956501C3 (de) | Integrierte Schaltungsanordnung | |
| EP2170026A1 (de) | Metall-Keramik-Substrat für elektrische Schaltkreise- oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat | |
| EP0841668B1 (de) | Elektrischer Widerstand und Verfahren zu seiner Herstellung | |
| DE2202802B2 (de) | Halbleiteranordnung | |
| DE2315711A1 (de) | Verfahren zum kontaktieren von in einem halbleiterkoerper untergebrachten integrierten schaltungen mit hilfe eines ersten kontaktierungsrahmens | |
| DE202020101197U1 (de) | Temperatursensorverbund | |
| DE1953678A1 (de) | Schaltungstraeger fuer elektrische Schaltungselemente und -bestandteile,sowie Verfahren zu dessen Herstellung | |
| DE10103084B4 (de) | Halbleitermodul und Verfahren zu seiner Herstellung | |
| DE10105920A1 (de) | Halbleiterbaustein | |
| DE1199344B (de) | Verfahren zur Herstellung einer gedruckten Schaltungsplatte | |
| DE2136201C3 (de) | Verfahren zum Anbringen metallischer Zuleitungen an einem elektrischen Festkörper-Bauelement | |
| DE2546443C3 (de) | Zusammengesetzte Mikroschaltung und Verfahren zu ihrer Herstellung | |
| EP0278413A2 (de) | Verfahren zur Herstellung einer Verbindung zwischen einem Bonddraht und einer Kontaktfläche bei hybriden Dickschicht-Schaltkreisen | |
| DE69303837T2 (de) | Gedruckter Schaltungsträger mit vorspringender Elektrode und Verbindungsverfahren | |
| DE1564444C3 (de) | Halbleiteranordnung mit einem isolierenden Träger |