DE19536454A1 - Optoelektronisches Halbleiter-Bauelement - Google Patents
Optoelektronisches Halbleiter-BauelementInfo
- Publication number
- DE19536454A1 DE19536454A1 DE19536454A DE19536454A DE19536454A1 DE 19536454 A1 DE19536454 A1 DE 19536454A1 DE 19536454 A DE19536454 A DE 19536454A DE 19536454 A DE19536454 A DE 19536454A DE 19536454 A1 DE19536454 A1 DE 19536454A1
- Authority
- DE
- Germany
- Prior art keywords
- chip carrier
- radiation
- carrier part
- trough
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 230000005693 optoelectronics Effects 0.000 title 1
- 230000005855 radiation Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 10
- 230000002000 scavenging effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Description
Claims (9)
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19549818A DE19549818B4 (de) | 1995-09-29 | 1995-09-29 | Optoelektronisches Halbleiter-Bauelement |
PCT/DE1996/001730 WO1997012386A2 (de) | 1995-09-29 | 1996-09-13 | Optoelektronisches halbleiter-bauelement |
US09/043,840 US6459130B1 (en) | 1995-09-29 | 1996-09-13 | Optoelectronic semiconductor component |
EP01127563A EP1199753A3 (de) | 1995-09-29 | 1996-09-13 | Optoelektronisches Halbleiter-Bauelement |
DE59609374T DE59609374D1 (de) | 1995-09-29 | 1996-09-13 | Optoelektronisches halbleiter-bauelement |
EP96942999A EP0852816B1 (de) | 1995-09-29 | 1996-09-13 | Optoelektronisches halbleiter-bauelement |
TW085111461A TW315528B (de) | 1995-09-29 | 1996-09-19 | |
MYPI96004006A MY115210A (en) | 1995-09-29 | 1996-09-27 | Optoelectronic semiconductor component |
US10/173,055 US6927469B2 (en) | 1995-09-29 | 2002-06-17 | Surface mountable light emitting or receiving device |
US10/819,638 US6975011B2 (en) | 1995-09-29 | 2004-04-06 | Optoelectronic semiconductor component having multiple external connections |
US11/002,959 US7199454B2 (en) | 1995-09-29 | 2004-12-02 | Optoelectronic semiconductor component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19549818A DE19549818B4 (de) | 1995-09-29 | 1995-09-29 | Optoelektronisches Halbleiter-Bauelement |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19536454A1 true DE19536454A1 (de) | 1997-04-03 |
DE19536454B4 DE19536454B4 (de) | 2006-03-09 |
Family
ID=35871000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19536454A Expired - Lifetime DE19536454B4 (de) | 1995-09-29 | 1995-09-29 | Optoelektronisches Halbleiter-Bauelement |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19536454B4 (de) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999007023A1 (de) * | 1997-07-29 | 1999-02-11 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelektronisches bauelement |
WO2000002262A1 (de) * | 1998-06-30 | 2000-01-13 | Osram Opto Semiconductors Gmbh & Co. Ohg | Strahlungaussendendes und/oder -empfangendes bauelement |
DE19947044A1 (de) * | 1999-09-30 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
DE10117890A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines strahlungsempfangenden und/oder emittierenden Halbleiterbauelements und strahlungsempfangendes und/oder -emittierendes Halbleiterbauelement |
WO2003002909A1 (en) * | 2001-06-27 | 2003-01-09 | Showers International Pty Ltd | Lamp mounting assembly for solid state light devices |
DE10308917A1 (de) * | 2003-02-28 | 2004-09-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil mit metallisiertem Reflektor |
US6900511B2 (en) | 2002-06-28 | 2005-05-31 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing it |
DE102004040468A1 (de) * | 2004-05-31 | 2005-12-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Gehäuse-Grundkörper für ein derartiges Bauelement |
US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
DE19963264B4 (de) * | 1999-12-17 | 2007-05-31 | Optotransmitter-Umweltschutz-Technologie E.V. | Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement |
DE102006033470A1 (de) * | 2006-01-19 | 2007-07-26 | Everlight Electronics Co., Ltd. | Leuchtdioden-Gehäusestruktur |
EP2073280A1 (de) | 2007-12-20 | 2009-06-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Reflektive Sekundäroptik und Halbleiterbaugruppe sowie Verfahren zu dessen Herstellung |
WO2009086909A2 (en) * | 2008-01-11 | 2009-07-16 | Ledon Lighting Jennersdorf Gmbh | Led assembly with a protective frame |
DE102008049399A1 (de) * | 2008-09-29 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, optoelektronische Vorrichtung und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102004057804B4 (de) * | 2004-11-30 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Gehäusekörper für einen Halbleiterchip aus gegossener Keramik mit reflektierender Wirkung und Verfahren zu dessen Herstellung |
US7851812B2 (en) | 2006-02-24 | 2010-12-14 | Osram Opto Semiconductors Gmbh | Housed optoelectronic component |
US8029152B2 (en) | 2005-03-24 | 2011-10-04 | Kyocera Corporation | Package for light-emitting device, light-emitting apparatus, and illuminating apparatus |
US8735930B2 (en) | 2004-03-23 | 2014-05-27 | Osram Opto Semiconductors Gmbh | Optoelectronic component with multi-part housing body |
US8975646B2 (en) | 2004-05-31 | 2015-03-10 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor component and housing base for such a component |
JP2019017734A (ja) * | 2017-07-18 | 2019-02-07 | 新日本無線株式会社 | 発光装置及びその製造方法 |
US10333032B2 (en) | 2013-09-19 | 2019-06-25 | Osram Opto Semiconductors Gmbh | Optoelectronic light-emitting component and leadframe assemblage |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007040874A1 (de) | 2007-08-29 | 2009-03-05 | Osram Opto Semiconductors Gmbh | Lichtabstrahlendes Halbleiterbauelement |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3820237A (en) * | 1971-05-17 | 1974-06-28 | Northern Electric Co | Process for packaging light emitting devices |
US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
US4255688A (en) * | 1977-12-15 | 1981-03-10 | Tokyo Shibaura Denki Kabushiki Kaisha | Light emitter mounted on reflector formed on end of lead |
US5298768A (en) * | 1992-02-14 | 1994-03-29 | Sharp Kabushiki Kaisha | Leadless chip-type light emitting element |
DE4232644A1 (de) * | 1992-09-29 | 1994-03-31 | Siemens Ag | Optoelektronisches Halbleiterbauelement |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3129996A1 (de) * | 1981-07-29 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Optokoppler |
DE3148843C2 (de) * | 1981-12-10 | 1986-01-02 | Telefunken electronic GmbH, 7100 Heilbronn | Mehrfach-Leuchtdiodenanordnung |
EP0400176B1 (de) * | 1989-05-31 | 2000-07-26 | Osram Opto Semiconductors GmbH & Co. OHG | Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements |
-
1995
- 1995-09-29 DE DE19536454A patent/DE19536454B4/de not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3820237A (en) * | 1971-05-17 | 1974-06-28 | Northern Electric Co | Process for packaging light emitting devices |
US3914786A (en) * | 1974-04-19 | 1975-10-21 | Hewlett Packard Co | In-line reflective lead-pair for light-emitting diodes |
US4255688A (en) * | 1977-12-15 | 1981-03-10 | Tokyo Shibaura Denki Kabushiki Kaisha | Light emitter mounted on reflector formed on end of lead |
US5298768A (en) * | 1992-02-14 | 1994-03-29 | Sharp Kabushiki Kaisha | Leadless chip-type light emitting element |
DE4232644A1 (de) * | 1992-09-29 | 1994-03-31 | Siemens Ag | Optoelektronisches Halbleiterbauelement |
Non-Patent Citations (1)
Title |
---|
"Siemens Components" 28 (1990) H. 6, S. 254 * |
Cited By (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7005311B2 (en) | 1993-09-30 | 2006-02-28 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7288831B2 (en) | 1993-09-30 | 2007-10-30 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7102212B2 (en) | 1993-09-30 | 2006-09-05 | Osram Gmbh | Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof |
US7508002B2 (en) | 1997-07-29 | 2009-03-24 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
US6376902B1 (en) | 1997-07-29 | 2002-04-23 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelectronic structural element |
EP2267798A1 (de) | 1997-07-29 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
EP2267797A1 (de) | 1997-07-29 | 2010-12-29 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
WO1999007023A1 (de) * | 1997-07-29 | 1999-02-11 | Osram Opto Semiconductors Gmbh & Co. Ohg | Optoelektronisches bauelement |
US6759733B2 (en) | 1997-07-29 | 2004-07-06 | Osram Opto Semiconductors Gmbh | Optoelectric surface-mountable structural element |
EP1566846A3 (de) * | 1997-07-29 | 2009-08-19 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
JP2009152639A (ja) * | 1997-07-29 | 2009-07-09 | Osram Opto Semiconductors Gmbh | 表面実装可能な光電素子 |
EP1566846A2 (de) * | 1997-07-29 | 2005-08-24 | Osram Opto Semiconductors GmbH | Optoelektronisches Bauelement |
US6469321B2 (en) | 1997-07-29 | 2002-10-22 | Osram Opto Semiconductors Gmbh & Co. Ohg | Surface-mountable light-emitting diode structural element |
US7183632B2 (en) | 1997-07-29 | 2007-02-27 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
US7102215B2 (en) | 1997-07-29 | 2006-09-05 | Osram Gmbh | Surface-mountable light-emitting diode structural element |
WO2000002262A1 (de) * | 1998-06-30 | 2000-01-13 | Osram Opto Semiconductors Gmbh & Co. Ohg | Strahlungaussendendes und/oder -empfangendes bauelement |
US7105862B2 (en) | 1998-06-30 | 2006-09-12 | Osram Gmbh | Diode housing |
US7696590B2 (en) | 1998-06-30 | 2010-04-13 | Osram Gmbh | Diode housing |
US7138301B2 (en) | 1998-06-30 | 2006-11-21 | Osram Gmbh | Diode housing |
DE19947044A1 (de) * | 1999-09-30 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben |
DE19947044B4 (de) * | 1999-09-30 | 2006-11-16 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben |
DE19947044B9 (de) * | 1999-09-30 | 2007-09-13 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement mit Reflektor und Verfahren zur Herstellung desselben |
DE19963264B4 (de) * | 1999-12-17 | 2007-05-31 | Optotransmitter-Umweltschutz-Technologie E.V. | Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement |
DE10117890A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines strahlungsempfangenden und/oder emittierenden Halbleiterbauelements und strahlungsempfangendes und/oder -emittierendes Halbleiterbauelement |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
US8097937B2 (en) | 2001-04-10 | 2012-01-17 | Osram Ag | Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
DE10117890B4 (de) * | 2001-04-10 | 2007-06-28 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines strahlungsempfangenden und/oder -emittierenden Halbleiterbauelements und strahlungsempfangendes und/oder -emittierendes Halbleiterbauelement |
WO2003002909A1 (en) * | 2001-06-27 | 2003-01-09 | Showers International Pty Ltd | Lamp mounting assembly for solid state light devices |
US7429758B2 (en) | 2002-06-28 | 2008-09-30 | Osram Opto Semiconductor Gmbh | Optoelectronic component and method for producing it |
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