DE1931245A1 - Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben - Google Patents

Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben

Info

Publication number
DE1931245A1
DE1931245A1 DE19691931245 DE1931245A DE1931245A1 DE 1931245 A1 DE1931245 A1 DE 1931245A1 DE 19691931245 DE19691931245 DE 19691931245 DE 1931245 A DE1931245 A DE 1931245A DE 1931245 A1 DE1931245 A1 DE 1931245A1
Authority
DE
Germany
Prior art keywords
components
spinel substrate
semiconductor components
individual
dividing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691931245
Other languages
German (de)
English (en)
Inventor
Richard Dipl-Phys Falckenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19691931245 priority Critical patent/DE1931245A1/de
Priority to NL7006367A priority patent/NL7006367A/xx
Priority to FR7020961A priority patent/FR2046933B1/fr
Priority to CH897870A priority patent/CH507589A/de
Priority to AT549370A priority patent/AT317301B/de
Priority to GB2976570A priority patent/GB1313003A/en
Priority to JP5291270A priority patent/JPS4827491B1/ja
Priority to SE861070A priority patent/SE351522B/xx
Publication of DE1931245A1 publication Critical patent/DE1931245A1/de
Priority to US00335739A priority patent/US3816906A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
DE19691931245 1969-06-20 1969-06-20 Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben Pending DE1931245A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE19691931245 DE1931245A1 (de) 1969-06-20 1969-06-20 Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben
NL7006367A NL7006367A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1969-06-20 1970-04-29
FR7020961A FR2046933B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1969-06-20 1970-06-08
CH897870A CH507589A (de) 1969-06-20 1970-06-15 Verfahren zum Herstellen einer Vielzahl von Halbleiterbauelementen
AT549370A AT317301B (de) 1969-06-20 1970-06-18 Verfahren zum Zerteilen von mehreren Halbleiteranordnungen
GB2976570A GB1313003A (en) 1969-06-20 1970-06-19 Manufacture of semiconductor structures
JP5291270A JPS4827491B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1969-06-20 1970-06-19
SE861070A SE351522B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1969-06-20 1970-06-22
US00335739A US3816906A (en) 1969-06-20 1973-02-26 Method of dividing mg-al spinel substrate wafers coated with semiconductor material and provided with semiconductor components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931245 DE1931245A1 (de) 1969-06-20 1969-06-20 Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben

Publications (1)

Publication Number Publication Date
DE1931245A1 true DE1931245A1 (de) 1971-07-08

Family

ID=5737496

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691931245 Pending DE1931245A1 (de) 1969-06-20 1969-06-20 Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben

Country Status (8)

Country Link
JP (1) JPS4827491B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) AT317301B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH507589A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE1931245A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2046933B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1313003A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7006367A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE351522B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2648274B1 (fr) * 1989-06-07 1994-07-29 Commissariat Energie Atomique Procede et dispositif de marquage et de clivage de plaquettes de materiaux semi-conducteurs monocristallins

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169837A (en) * 1963-07-31 1965-02-16 Int Rectifier Corp Method of dicing semiconductor wafers
BE668918A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1965-08-27 1900-01-01
DE1652512B2 (de) * 1967-05-29 1976-08-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbauelementen

Also Published As

Publication number Publication date
SE351522B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-11-27
JPS4827491B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-08-23
FR2046933B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-09-20
NL7006367A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1970-12-22
GB1313003A (en) 1973-04-11
CH507589A (de) 1971-05-15
FR2046933A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1971-03-12
AT317301B (de) 1974-08-26

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