DE1916568B2 - Vorrichtung zum bestuecken von halbleiter traegerplatten - Google Patents

Vorrichtung zum bestuecken von halbleiter traegerplatten

Info

Publication number
DE1916568B2
DE1916568B2 DE19691916568 DE1916568A DE1916568B2 DE 1916568 B2 DE1916568 B2 DE 1916568B2 DE 19691916568 DE19691916568 DE 19691916568 DE 1916568 A DE1916568 A DE 1916568A DE 1916568 B2 DE1916568 B2 DE 1916568B2
Authority
DE
Germany
Prior art keywords
equipment
carrier plates
semiconductor carrier
semiconductor
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19691916568
Other languages
German (de)
English (en)
Other versions
DE1916568A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1916568A1 publication Critical patent/DE1916568A1/de
Publication of DE1916568B2 publication Critical patent/DE1916568B2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/16—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine controlled in conjunction with the operation of the tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q39/00—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation
    • B23Q39/04—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps
    • B23Q39/042—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps with circular arrangement of the sub-assemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H10W72/0711—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/534—
    • H10W72/5434—
    • H10W72/884—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE19691916568 1968-04-15 1969-04-01 Vorrichtung zum bestuecken von halbleiter traegerplatten Withdrawn DE1916568B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US72132568A 1968-04-15 1968-04-15

Publications (2)

Publication Number Publication Date
DE1916568A1 DE1916568A1 (de) 1969-10-30
DE1916568B2 true DE1916568B2 (de) 1971-09-16

Family

ID=24897509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691916568 Withdrawn DE1916568B2 (de) 1968-04-15 1969-04-01 Vorrichtung zum bestuecken von halbleiter traegerplatten

Country Status (8)

Country Link
US (1) US3523352A (enExample)
BE (1) BE729755A (enExample)
CH (1) CH486823A (enExample)
DE (1) DE1916568B2 (enExample)
FR (1) FR2006223A1 (enExample)
GB (1) GB1268059A (enExample)
NL (2) NL160985B (enExample)
SE (1) SE353440B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3710479A (en) * 1971-03-01 1973-01-16 Ibm Component insertion apparatus
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
DE2818534A1 (de) * 1978-04-27 1979-11-08 Reinhold Schecker Grossgewaechshaus fuer freilandkulturen
NL8700445A (nl) * 1986-02-28 1987-09-16 Nippon Seiko Kk Positioneertafel voor een samengestelde beweging.
US4877174A (en) * 1988-12-21 1989-10-31 International Business Machines Corporation Tab device excise and lead form apparatus
CN107214538A (zh) * 2017-07-14 2017-09-29 芜湖德丰汽车零部件有限公司 一种万向装夹装置
CN108188457A (zh) * 2018-04-10 2018-06-22 沈阳百祥机械加工有限公司 控制长桁零件加工过程纵向变形加工装置及其工艺
CN108962813B (zh) * 2018-09-06 2023-07-18 重庆科技学院 一种可调式芯片卡具
CN109433999A (zh) * 2018-12-03 2019-03-08 广东盛茂达自动控制科技有限公司 伸缩架自动铆压系统
TWI743726B (zh) * 2019-04-15 2021-10-21 日商新川股份有限公司 封裝裝置
CN111703899A (zh) * 2020-08-12 2020-09-25 江西铭德半导体科技有限公司 一种用于激光器芯片挑晶的治具
CN112318160B (zh) * 2020-10-29 2022-07-15 贵州天义电器有限责任公司 一种高压接触器动触片专用铣加工夹具
CN112518670B (zh) * 2020-11-30 2022-04-26 九江检安石化工程有限公司 高压螺纹锁紧环换热器螺栓拆卸专用工装
CN114334783A (zh) * 2021-12-31 2022-04-12 深圳新益昌科技股份有限公司 晶片安装装置
CN114310113B (zh) * 2022-01-10 2023-11-17 合肥埃科光电科技股份有限公司 一种插座焊接的辅助装置
CN115942615B (zh) * 2022-12-16 2023-08-04 江苏迪飞达电子有限公司 多层金属基板钻孔方法
CN116581013B (zh) * 2023-04-07 2024-08-06 国仪量子技术(合肥)股份有限公司 离子阱芯片更换系统
CN117245388A (zh) * 2023-11-16 2023-12-19 济南二机床新光机电有限公司 一种端拾器组装系统及组装方法
CN118270306B (zh) * 2024-06-03 2024-08-30 沈阳和研科技股份有限公司 一种多排芯片导向装置及自动装管机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3307763A (en) * 1963-06-28 1967-03-07 Kulicke And Soffa Mfg Company Thermocompression wire bonding apparatus with scissors cut-off
US3239719A (en) * 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
US3226810A (en) * 1964-06-26 1966-01-04 Ibm Apparatus for positioning transistor header
GB1114393A (en) * 1964-12-23 1968-05-22 Ibm Improvements in or relating to apparatus for sensing the orientation of an object
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US3344900A (en) * 1965-05-27 1967-10-03 Ibm Chip orienting control circuit for a chip positioning machine

Also Published As

Publication number Publication date
FR2006223A1 (enExample) 1969-12-26
SE353440B (enExample) 1973-01-29
GB1268059A (en) 1972-03-22
DE1916568A1 (de) 1969-10-30
US3523352A (en) 1970-08-11
NL160985B (nl) 1979-07-16
BE729755A (enExample) 1969-08-18
CH486823A (de) 1970-02-28
NL160985C (enExample) 1900-01-01
NL6905594A (enExample) 1969-10-17

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Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee