DE1765774A1 - Process for applying thick film resistance layers to a substrate - Google Patents

Process for applying thick film resistance layers to a substrate

Info

Publication number
DE1765774A1
DE1765774A1 DE19681765774 DE1765774A DE1765774A1 DE 1765774 A1 DE1765774 A1 DE 1765774A1 DE 19681765774 DE19681765774 DE 19681765774 DE 1765774 A DE1765774 A DE 1765774A DE 1765774 A1 DE1765774 A1 DE 1765774A1
Authority
DE
Germany
Prior art keywords
substrate
burn
resistance layers
thick film
tur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681765774
Other languages
German (de)
Inventor
Egon Dr Thiel
Konrad Walch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ROEDERSTEIN KONDENSATOREN
Ernst Roederstein Spezialfabrik fuer Kondensatoren GmbH
Original Assignee
ROEDERSTEIN KONDENSATOREN
Ernst Roederstein Spezialfabrik fuer Kondensatoren GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROEDERSTEIN KONDENSATOREN, Ernst Roederstein Spezialfabrik fuer Kondensatoren GmbH filed Critical ROEDERSTEIN KONDENSATOREN
Priority to DE19681765774 priority Critical patent/DE1765774A1/en
Publication of DE1765774A1 publication Critical patent/DE1765774A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Description

Verfahren zum Aufbringen von Dickschicht-Widerstandsschichten auf ein Substrat Die Erfindung betrifft ein Verfahren zum Aufbringen von unterschiedlichen Dickschicht-Widerstandsschichten auf ein glasiertes, keramisches Substrat unter Verwendung von zwei: Widerstandspasten, die auf das Substrat vorzugsweise mittels Siebdruck - zu drucken und dort mit unterschiedlichem Temperatur-Z'eit-I.,dtegral einzubrennen sind.Method for applying thick-film resistance layers on a substrate The invention relates to a method for applying different thick-film resistance layers on a glazed, ceramic substrate using two: Resistance pastes, which are preferably screen - printed onto the substrate - and there at different temperatures -Time-I., Dtegrally are to be branded.

Aufgabe der Erfindung ist es, unterschiedliche Widerstandspasten rationell zu verarbeiten. Zur Lösung dieser Aufgabe ist das Verfahren dadurch gekennzeichnet, daß zunächst die Widerstandspaste mit dem größeren Einbrenn-Temperatur-Zeit-Integral auf das Substrat gedruckt und dort teilweise eingebran nt wird, und daß dann die Widerstandspaste mit dem kleineren Einbre'nn-Temperatur-Zeit-Integral auf das "-,)ubstrat gedruclit und dort ganz eingebrannt wird, wobei das Temperatur-Zeit-Integral des ersten Einbrennvorgangs so gewählt CD CD wird, daß der erste Einbrennvorgang durch den zweiten Einbrennvorgang abgeschlossen wird.The object of the invention is to efficiently process different resistor pastes. To achieve this object, the method is characterized in that the resistor paste with the larger burn-in temperature-time integral is first printed on the substrate and partially burned in there, and then the resistance paste with the smaller burn-in temperature-time -Integrally on the "-,) substrate is pressed and completely burned in there, the temperature-time integral of the first burn-in process CD CD is chosen so that the first burn-in process is completed by the second burn-in process.

Bei AusfUhrung der Lehre der Erfindung wird die Verfahrensdauer auf die Dauer des Einbrennens der Widerstandspaste mit dem größten Einbrenn-Temperatur-Zeit-Integral beschränkt. Dennoch erhalten aber beide Arten von Dickschicht-Widerstandsschichten optimale Eigenschaften.When carrying out the teaching of the invention, the duration of the process is increased the duration of the stoving of the resistor paste with the largest stoving-temperature-time integral limited. However, both types of thick film resistive layers are preserved optimal properties.

Besonders vorteilhaft ist die Anwendung des erfindLingsgemäßen Verfahrens dann, wenn die Widerstandsschichten auf einander gegenüberliegende Seit-en eines platten- oder blattförmigen Substrates aufgebracht werden.The use of the method according to the invention is particularly advantageous when the resistive layers are on opposite sides of one plate or sheet-shaped substrate are applied.

Claims (1)

i'ate,.,itan.-,pr,'jche 1 Verfahren zum Aufbringeri von untuerjichiedlichen auf ein glasiertes, Icor,ain-'scheK-- Substrat uniler Ver,.-!endung von z"-"ei- ul d s p"-,.ste-"i, die auf das Substrat - vir-.u«--s#,ieis(-# mit- tels Siebdruck - zu drucken und dort unterschied- lichem Teir.pera-tur-,-ue-Lt-In'U-egr-,"# e-inzubrennen sind, da- durch 7"elii:ennze-*chiiet, da..,' zun;ichst die Wide--s-t,-a-nds#"aste MI k, dem crößeren 1-,'i-nbrenn-Te#-,.iiera'Uur- Zie L.-Integril auf das Substrat iredruckt und dort teilweise eingebr'annt 'JA d und d, -ii3 dann die Widerstandspaste v mit (1 dem kleineren Bir#brenn-1.Penperatur-,7"eit-In'tiegral auf das Substrat ge- druchtt und dDrt ganz eingebrannt wird, vobei das Teimpera- tur-Zeit-Integral des ersten Einbrennvorgangs so gewählt wird, da;3 der erste Einbrennvorgang durch den zw-eiten Einbrennvorgang abgeschlossen wird. d. Verfahren nach Anspruch 1, dadurch gekennzeichnet, -daß die '.#iiderstandsschichten auf e*nander gegenüberliegen- r3 de Seiten eines platten- oder blattförmigen Substrates auf- gebracht werden.
i'ate,., itan .-, pr, 'jche 1 Procedure for applying by irrelevant on a glazed, Icor, ain-'scheK-- substrate of unile ver, .-! Ending of z "-" a- ul ds p "-,. ste-" i, which on the substrate - vir-.u «- s #, ieis (- # with- by means of screen printing - to print and there Lichem Teir.pera-tur -, - ue-Lt-In'U-egr -, "# e-in are to be burned, that through 7 "elii: ennze- * chiiet, da .., 'first; Ichst die Wide - st, -a-nds #" aste MI k, the larger 1 -, 'i-nbrenn-Te # -,. Iiera'Uur- Zie L.-Integril on the substrate is printed and partially baked there 'JA d and d, -ii3 then the resistor paste v with (1 the smaller Bir # Brenn-1.Penperatur-, 7 "eit-In'tiegral on the substrate druchtt and dDrt is completely burned in, whereby the Teimpera- tur-time integral of the first burn-in process selected in this way is because; 3 the first burn-in process through the second Burn-in process is completed. d. Method according to claim 1, characterized in that -that the '. # resistance layers are on opposite sides of each other- r3 de sides of a plate or sheet-shaped substrate to be brought.
DE19681765774 1968-07-17 1968-07-17 Process for applying thick film resistance layers to a substrate Pending DE1765774A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19681765774 DE1765774A1 (en) 1968-07-17 1968-07-17 Process for applying thick film resistance layers to a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681765774 DE1765774A1 (en) 1968-07-17 1968-07-17 Process for applying thick film resistance layers to a substrate

Publications (1)

Publication Number Publication Date
DE1765774A1 true DE1765774A1 (en) 1971-08-26

Family

ID=5698604

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681765774 Pending DE1765774A1 (en) 1968-07-17 1968-07-17 Process for applying thick film resistance layers to a substrate

Country Status (1)

Country Link
DE (1) DE1765774A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1102089B (en) * 1958-06-09 1961-03-16 Boehler & Weber K G Corrosion protection arrangement in chemical cleaning machines for textiles
EP0208808A1 (en) * 1985-07-11 1987-01-21 Zhu Hanxiong Printed resistor, method for making same and application thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1102089B (en) * 1958-06-09 1961-03-16 Boehler & Weber K G Corrosion protection arrangement in chemical cleaning machines for textiles
EP0208808A1 (en) * 1985-07-11 1987-01-21 Zhu Hanxiong Printed resistor, method for making same and application thereof

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