DE1639176B2 - Integrierte festkoerperschaltung mit lediglich zwei elektrodenzuleitungen - Google Patents

Integrierte festkoerperschaltung mit lediglich zwei elektrodenzuleitungen

Info

Publication number
DE1639176B2
DE1639176B2 DE1968D0055410 DED0055410A DE1639176B2 DE 1639176 B2 DE1639176 B2 DE 1639176B2 DE 1968D0055410 DE1968D0055410 DE 1968D0055410 DE D0055410 A DED0055410 A DE D0055410A DE 1639176 B2 DE1639176 B2 DE 1639176B2
Authority
DE
Germany
Prior art keywords
electrode lines
solid wire
wire circuit
integrated solid
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1968D0055410
Other languages
German (de)
English (en)
Other versions
DE1639176A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority claimed from DE19681639176 external-priority patent/DE1639176C3/de
Publication of DE1639176A1 publication Critical patent/DE1639176A1/de
Publication of DE1639176B2 publication Critical patent/DE1639176B2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/211—Design considerations for internal polarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
DE1968D0055410 1968-02-23 1968-02-23 Integrierte festkoerperschaltung mit lediglich zwei elektrodenzuleitungen Granted DE1639176B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681639176 DE1639176C3 (de) 1968-02-23 1968-02-23 Temperaturkompensierte Z-Diodenanordnung in Form einer Halbleiterschaltung

Publications (2)

Publication Number Publication Date
DE1639176A1 DE1639176A1 (de) 1970-08-20
DE1639176B2 true DE1639176B2 (de) 1971-02-25

Family

ID=5683973

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1968D0055410 Granted DE1639176B2 (de) 1968-02-23 1968-02-23 Integrierte festkoerperschaltung mit lediglich zwei elektrodenzuleitungen

Country Status (7)

Country Link
CH (1) CH493097A (cg-RX-API-DMAC10.html)
DE (1) DE1639176B2 (cg-RX-API-DMAC10.html)
ES (1) ES363985A1 (cg-RX-API-DMAC10.html)
FR (1) FR2002487A1 (cg-RX-API-DMAC10.html)
GB (1) GB1230880A (cg-RX-API-DMAC10.html)
NL (1) NL6902799A (cg-RX-API-DMAC10.html)
SE (1) SE358050B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6473669A (en) * 1987-09-14 1989-03-17 Fujitsu Ltd Semiconductor integrated circuit
JP2737334B2 (ja) * 1989-01-23 1998-04-08 モトローラ・インコーポレーテッド 電力集積回路用基板電力供給接点
JPH02210860A (ja) * 1989-02-09 1990-08-22 Fujitsu Ltd 半導体集積回路装置
DE4143209A1 (de) * 1991-12-30 1993-07-01 Hoefflinger Bernd Prof Dr Integrierte schaltung
US5965930A (en) * 1997-11-04 1999-10-12 Motorola, Inc. High frequency bipolar transistor and method of forming the same

Also Published As

Publication number Publication date
FR2002487A1 (cg-RX-API-DMAC10.html) 1969-10-17
DE1639176A1 (de) 1970-08-20
GB1230880A (cg-RX-API-DMAC10.html) 1971-05-05
SE358050B (cg-RX-API-DMAC10.html) 1973-07-16
NL6902799A (cg-RX-API-DMAC10.html) 1969-08-26
ES363985A1 (es) 1971-01-01
CH493097A (de) 1970-06-30

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
8320 Willingness to grant licences declared (paragraph 23)