CH456706A - Schaltungsanordnung mit elektronischen Schaltungselementen - Google Patents

Schaltungsanordnung mit elektronischen Schaltungselementen

Info

Publication number
CH456706A
CH456706A CH760767A CH760767A CH456706A CH 456706 A CH456706 A CH 456706A CH 760767 A CH760767 A CH 760767A CH 760767 A CH760767 A CH 760767A CH 456706 A CH456706 A CH 456706A
Authority
CH
Switzerland
Prior art keywords
circuit
elements
arrangement
electronic circuit
electronic
Prior art date
Application number
CH760767A
Other languages
English (en)
Inventor
Butler James Hoffmann
Im Samuel Sung-Soon
Laszlo Palfi Thomas
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH456706A publication Critical patent/CH456706A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CH760767A 1966-06-13 1967-05-29 Schaltungsanordnung mit elektronischen Schaltungselementen CH456706A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US557086A US3365620A (en) 1966-06-13 1966-06-13 Circuit package with improved modular assembly and cooling apparatus

Publications (1)

Publication Number Publication Date
CH456706A true CH456706A (de) 1968-07-31

Family

ID=24224001

Family Applications (1)

Application Number Title Priority Date Filing Date
CH760767A CH456706A (de) 1966-06-13 1967-05-29 Schaltungsanordnung mit elektronischen Schaltungselementen

Country Status (10)

Country Link
US (1) US3365620A (de)
JP (1) JPS4421015B1 (de)
BE (1) BE696771A (de)
CH (1) CH456706A (de)
DE (1) DE1591199B1 (de)
ES (1) ES341637A1 (de)
FR (1) FR1521039A (de)
GB (1) GB1178566A (de)
NL (1) NL151611B (de)
SE (1) SE323436B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
US3521128A (en) * 1967-08-02 1970-07-21 Rca Corp Microminiature electrical component having integral indexing means
GB1213726A (en) * 1968-01-26 1970-11-25 Ferranti Ltd Improvements relating to electrical circuit assemblies
JPS4826069B1 (de) * 1968-03-04 1973-08-04
US3619734A (en) * 1969-12-17 1971-11-09 Rca Corp Assembly of series connected semiconductor elements having good heat dissipation
US3621338A (en) * 1970-01-02 1971-11-16 Fairchild Camera Instr Co Diaphragm-connected, leadless package for semiconductor devices
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
US3697817A (en) * 1971-01-25 1972-10-10 Rca Corp Mounting attachment for a modular substrate
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US4193081A (en) * 1978-03-24 1980-03-11 Massachusetts Institute Of Technology Means for effecting cooling within elements for a solar cell array
US4292647A (en) * 1979-04-06 1981-09-29 Amdahl Corporation Semiconductor package and electronic array having improved heat dissipation
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
US4544989A (en) * 1980-06-30 1985-10-01 Sharp Kabushiki Kaisha Thin assembly for wiring substrate
DE3146504A1 (de) * 1981-11-24 1983-06-01 Siemens AG, 1000 Berlin und 8000 München Kuehlkonzept fuer bausteine mit hoher verlustleistung
EP0116396A3 (de) * 1983-01-06 1985-11-06 Crystalate Electronics Limited Elektrischer Zusammenbau
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
GB2135525B (en) * 1983-02-22 1986-06-18 Smiths Industries Plc Heat-dissipating chip carrier substrates
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
US4463409A (en) * 1983-03-22 1984-07-31 Westinghouse Electric Corp. Attitude independent evaporative cooling system
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4603345A (en) * 1984-03-19 1986-07-29 Trilogy Computer Development Partners, Ltd. Module construction for semiconductor chip
US4722914A (en) * 1984-05-30 1988-02-02 Motorola Inc. Method of making a high density IC module assembly
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
US4652065A (en) * 1985-02-14 1987-03-24 Prime Computer, Inc. Method and apparatus for providing a carrier termination for a semiconductor package
US4956749A (en) * 1987-11-20 1990-09-11 Hewlett-Packard Company Interconnect structure for integrated circuits
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
DE59101555D1 (de) * 1990-08-03 1994-06-09 Siemens Nixdorf Inf Syst Einbausystem für elektrische Funktionseinheiten insbesondere für die Datentechnik.
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
US5210440A (en) * 1991-06-03 1993-05-11 Vlsi Technology, Inc. Semiconductor chip cooling apparatus
US5315239A (en) * 1991-12-16 1994-05-24 Hughes Aircraft Company Circuit module connections
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
US6270262B1 (en) 1999-11-10 2001-08-07 Harris Corporation Optical interconnect module
JP3730968B2 (ja) * 2003-03-26 2006-01-05 Ｔｄｋ株式会社 スイッチング電源
US7538425B2 (en) * 2004-07-28 2009-05-26 Delphi Technologies, Inc. Power semiconductor package having integral fluid cooling
AT13232U1 (de) * 2011-12-28 2013-08-15 Austria Tech & System Tech Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte
US9721870B2 (en) 2014-12-05 2017-08-01 International Business Machines Corporation Cooling structure for electronic boards

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL178165B (nl) * 1953-05-07 1900-01-01 Bristol Myers Co Werkwijze voor het bereiden of vervaardigen van een geneesmiddel met bloeddrukverlagende en/of bloedplaatjesaggregatie tegenwerkende activiteit; werkwijze voor het bereiden van een verbinding met een dergelijke activiteit.
DE1778242U (de) * 1958-09-23 1958-11-27 Metz Transformatoren & App Traegerplatte fuer gedruckte schaltungen.
NL250171A (de) * 1959-06-23
DE1139894B (de) * 1960-06-20 1962-11-22 Siemens Ag Einschubrahmen zur Aufnahme mehrerer Schaltungsplatten fuer Fernmeldeanlagen, insbesondere Fernsprechvermittlungsanlagen
US3157828A (en) * 1960-08-11 1964-11-17 Gen Motors Corp Encapsulated printed circuit module with heat transfer means
DE1150724B (de) * 1961-02-27 1963-06-27 Siemens Ag Blockfoermige Vorrichtung zum Halt fuer elektrische Bauelemente
US3239719A (en) * 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
DE1895660U (de) * 1963-11-13 1964-07-02 Siemens Ag Schutzkappe fuer elektrische bauelemente fuer fernmelde-, insbesondere fernsprechanlagen.

Also Published As

Publication number Publication date
GB1178566A (en) 1970-01-21
NL6708155A (de) 1967-12-14
US3365620A (en) 1968-01-23
ES341637A1 (es) 1968-07-01
JPS4421015B1 (de) 1969-09-09
BE696771A (de) 1967-09-18
DE1591199B1 (de) 1970-12-10
NL151611B (nl) 1976-11-15
SE323436B (de) 1970-05-04
FR1521039A (fr) 1968-04-12

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