DE1621206A1 - Process for coating sliding, rubbing, workpieces subject to wear and tear - Google Patents
Process for coating sliding, rubbing, workpieces subject to wear and tearInfo
- Publication number
- DE1621206A1 DE1621206A1 DE19671621206 DE1621206A DE1621206A1 DE 1621206 A1 DE1621206 A1 DE 1621206A1 DE 19671621206 DE19671621206 DE 19671621206 DE 1621206 A DE1621206 A DE 1621206A DE 1621206 A1 DE1621206 A1 DE 1621206A1
- Authority
- DE
- Germany
- Prior art keywords
- bath
- electroless
- rubbing
- tear
- wear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/1266—O, S, or organic compound in metal component
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
VERFAHREN ZUJR BiSSCHICHTUNG GLEITEND. HEIBEND. .."' AUF VERSCnIJ)ISS BEANSPRUCHTER TraRKSTÜCKE" Λ; PROCESS SLIDING TO BITE STRATIFICATION. HEATING. .. "' ON VERSCnIJ) ISS CLAIMED TRACK PIECES" Λ;
Es ist seit längerem bekannt , dass man metallischeoder ;It has long been known that one can use metallic or;
nichtmetallische Feststoffe verschiedenstenElektrolyten, z.B. elektrolytischen Nickelbädern, zusetzen kann und dass diese während der i/lektrplyse in den Niederschlag mit eingelagert T/erd.en können, . : "-.--; ^non-metallic solids of various electrolytes, e.g. electrolytic nickel baths, and that these are stored in the precipitation during the electrolysis T / earth,. : "-.--; ^
Durch die Iwkorporation yön Feststoffteilcheix köririen die physikalischen, ,cheraisehen und elektrochemischen Eigen>scliaften des abgeschiedenen il^talls erheblich beeinflusst werden, beispielsweise Härte, Verschleissfestigkeit, Reibuntjskoeffiiaient, Temperäturbeständigkeit, Oxydatipnsbe- i sfiändigkeit, Eorrosionsbeständigkeit t Reflexionseigenschaften, \ G-lana» ■ ■ . .. _; -'■- -'■..=-■ ■"■".■.■. .7-- ■ _; ;:- -,..-■-. - : By Iwkorporation yön Feststoffteilcheix the physical, cheraisehen and electro-chemical properties> köririen scliaften the deposited il ^ are talls significantly affected, such as hardness, wear resistance, Reibuntjskoeffiiaient, Temperäturbeständigkeit, Oxydatipnsbe- i sfiändigkeit, Eorrosionsbeständigkeit t reflection properties, \ G-lana "■ ■ . .. _ ; - '■ - -' ■ .. = - ■ ■ "■". ■. ■. . 7 - ■ _ ; ;: - -, ..- ■ -. - :
Nach diesem Verfahren hergestellte Hatallüberzügehaiwn; jedoch den Wacht eil ι dass bei dickeren Schichten, wie, sie für technis&he Zwecke angewendet werden, selbst nach Anwendung von gerichteten Innenanoden aiifvrendige Nachbearbeitungs- , prozesse, wie bcnleifoperationen, erforderlich sind*Hatall coverings made according to this process; However, the watch is on the fact that with thicker layers, like them be used for technical purposes, even after application post-processing of directional internal anodes, processes, such as grinding operations, are required *
Eb Unfalls oelcännt sind/Bäder oder Verfahren zur stBomloseii: Abscheidung iron Ketallnlederpchlägen* ν 'In the event of an accident / baths or procedures for stBomloseii: Separation of iron Ketallnlederpchlägen * ν '
In der Literatur, wird ausdrü"ök|.ich darauf hingewiesen, dass die stromlosen Bäder von allen Verunreinigungen durch I'eat·- : stofftoiXciien freizuhaltejl seien, da sie sich anderenfalls infolge Keimbildung; zersötzen wtlrdien. l·In the literature, the term ec |. I indicates that the electroless baths from all impurities by I'eat - : StofftoiXciien are to be kept free, otherwise they are as a result of nucleation; disintegrate. l
JSs hat sich; nun überrasclieiiidörweise gezeigt, dass stromlosen ; J5äderii-eine lieihe von uiiibHlichen^ beüw* schwerlöslichen Teilchen entsprecheiider Reinheit und beträchtlicher TeilohengrtJsse zugesottit werden können, dio in den Nledersohlag eingebaut worden, DiosoTeiXchen kb'Jinen im Bad Z · B.»durch Rühren, Umpumpen, Einleitan von Gtä^en (z.B. Luft, Stiokatöff^) oder in 8uBpenai.ön gehalten werden* - iJSs has; now surprisingly shown that electroless ; J5äderii-a number of usual, slightly soluble particles of corresponding purity and considerable partial size can be added, which have been built into the leather sole, dioso parts kb'jinen in the bath, e.g. Air, Stiokatöff ^) or be kept in 8uBpenai.ön * - i
Inzwischen ist ein stromloser Nickel-Elektrolyt in der Literatur bekannt geworden, dem kleine Feststoffpartikelchen zugesetzt werden sollen zwecks Abscheidung einer dünnen Nickelschicht ο Nach einer Yerühromuhg soll eine mikroporöse Ghromschicht erzielt werden, um eine gesteigerte Korrosionsschutzwirkung des Niederschlages zu erreichen« (Patentschrift DDR kl ko6)„ ■In the meantime, an electroless nickel electrolyte has become known in the literature, to which small solid particles are to be added for the purpose of depositing a thin nickel layer ο After a Yerühromuhg a microporous chromium layer is to be achieved in order to achieve an increased corrosion protection effect of the precipitate «(Patent GDR kl ko6) "■
Die vorliegende Erfindung bezieht sich auf die "stromlose" Abscheidung verhältnismässig dioker "dispersionsgehärteter11 Metallüberzüge. Der Ausdruck "stromlöse Abscheidung", wie er hier verwendet wird, bezieht sich auf die Abscheidung von ρ Metallüberzügen ohne äussere Stromquelle, vorzugsweise durch chemische Reduktion„The present invention refers to the "electroless" deposition relatively dioker "dispersion hardened 11 metal coatings. The term" current-solvent deposition "as used herein, refers to the deposition of ρ metal coatings without external power source, preferably by chemical reduction"
Als "dispersionsgehärtet" bezeichnen wir Metallüberzüge, in die Bei der Abscheidung inerte Feststoffteilchen eingebettet wurden. Dabei können diese Teilchen vom Metall teilweise oder vollkommen eingeschlossen sein«We refer to metal coatings as "dispersion hardened", in embedded in solid particles that are inert during deposition became. These particles of metal can be partially or to be completely enclosed "
Nach.dem erfindungsgemäßen Verfahren ist es möglich, auch relativ grosse Partikelchen (O,O1 ·-■ IQO Mikron) stromlos arbeitenden Bädern zuzusetzen und die entsprechenden Ab-' Scheidungen auch im kontinuierlichen Betrieb zu erhalten, so dass ζ.B* Niederschläge zwischen 5 ■* 2GO Mikron erhalten werden können. Diese dispersionsgehärteten Metallüberzüge haben gegenüber den elektrolytisch hergestellten den Vorteil, dass die Maßhaltigkeit bis zur vollen Schichtstärke erhalten bleibt und eine Bearbeitung der Sohichten nach der Abscheidung gänzlich entfallen bezw. auf ein Minimum beschränkt werden kann.Nach.dem method according to the invention, it is also possible relatively large particles (O, O1 · - ■ IQO microns) without current to add working baths and the corresponding waste ' To get divorces even in continuous operation, like that that ζ.B * precipitates between 5 ■ * 2GO microns are obtained can. These dispersion hardened metal coatings have opposite the electrolytically produced the advantage that the Dimensional accuracy is maintained up to the full layer thickness and a processing of the layers after the deposition completely omitted or can be kept to a minimum.
Bin weiterer Vorteil der stromlos abgeschiedenen, dispörsionsgehärteten Metallüberzüge ist der, dass die Schichten, die ■ duroh die !Einlagerung der Feststoffteilchen in den meisten Fällen schon eine Härtesteigerung erfahren haben, durch Temperatureinwlrkung noch weIter gehärtet werden können (1000 bis 1100 HV).> Solche Härten könnon bei elektrolytisch äbgesohledenen Schichten nicht erreicht werden«Another advantage of the electroless deposited, dispersion hardened Metal coatings are the layers that ■ duroh the! Intercalation of solid particles in most Cases have already experienced an increase in hardness Temperature effect can be hardened even further (1000 to 1100 HV).> Such hardnesses can be electrolytic the bottom of the layers cannot be reached "
109823/1360- C 3 "109823 / 1360- C 3 "
Nacli dem erj?dGftdmigsrgViiiasseii ;Ve~rf alireii Ιερίΐίΐθ'ΐΐ'Vot^eUAfter the hej? DGftdmigs r gViiiasseii ; Ve ~ rf alireii Ιερίΐίΐθ'ΐΐ'Vot ^ eU
alle Te lie-"-Ib^eIS Etiideit' worden,' 'uiie rth. "der Praxis' 'gleitend b'e-all Te lie- "- Ib ^ eIS Etiideit 'been,''uiie rth. " of practice''slidingb'e-
ansprudit wercfeii', z.B. ll ^Ansprudit wercfeii ', e.g. ll ^
Als Matrix lcäiin ije'ispUelswei'se7 verwendet* .werdeiij ' *Used as matrix lcäiin ije'ispUelswei'se 7 * .werdeiij '*
Tabelle 1 ' ; ;% -·' '^- Table 1 ';;% - · '' ^ -
I Nickel'- ? :VI nickel'-? : V
30 'g/l' ^iclce'lclilörid '"' ' ;15 g/l .. Natriumacetat. ,. -· ,-,30 'g / l' ^ iclce'lclilörid '"' ' ; 15 g / l .. sodium acetate. ,. - ·, -,
10 g/l Natriniiiliypopliospliit pH 4" "'.' '." '""■-■ ■'■'■_■■■- ri. '■'■-·;:10 g / l sodium hypoplasia pH 4 ""'.''."'""■ - ■ ■ '■' ■ _ ■■■ - ri . '■' ■ - · ;:
950C ■'-;;'' ■/.-*' ;;■'95 0 C ■ '- ;;''■/.-*';; ■ '
>'3Q g/l- Nicke lsulf at - ... ,.„■ tüÖ g/l Natriumcitrat " - "> '3Q g / l- Nickel sulfate - ...,. "■ tüÖ g / l sodium citrate "-"
-50 vg/l > Aaimioniuiiiclalorid ' ■ : -50 v g / l> Aaimioniuiiiclalorid '■ :
10 g/l10 g / l
pn a-10pn a-10
^iökelGlilorid , /ί < : <.^ iökelGlilorid, / ί < : <.
10 vg/ls ..Natrivuncitra-fc . . \10 v g / l s ..Natrivuncitra-fc. . \
Zq 'g/l ■""' Na-triumacetafc " """"' '" '. Zq 'g / l ■ ""' Sodium acetafc """""''"'.
20 g/l' Natriumsucciinat ·" .· 3 ml/1 Nz-JDiatixylborazaii20 g / l 'sodium succinate · ". · 3 ml / 1 Nz-JDiatixylborazaii
0,01 g/l BIe i clil or id pH 50 mi^l'Hetliäiiöi ' ' ' 65 C 0.01 g / l BIe i clil or id pH 50 mi ^ l'Hetliäiiöi '''65 C
II Kupfer .II copper.
a) 20,g/1 Kupfersulfat ■ " 100' g/l Tr'iiläa) 20, g / 1 copper sulfate ■ "100 'g / l Tr'iilä
20 ml/1 Formaldehyd20 ml / 1 formaldehyde
^öde-r Sefgnettesalz ibeztf. EDTA als Komplexbildner)^ ore-r Sefgnettesalz ibeztf. EDTA as Complexing agent)
III KobaltIII cobalt
a) , 35.g/l· λ Kobaltclilprid.^'. ; : '20 g/l Natriumacetat 1^/ Natriuirihypopliospliit ·a), 35.g / l · λ cobalt clilprid. ^ '. ; : '20 g / l sodium acetate 1 ^ / sodium hypopliospliit ·
t OSf 8Z3 4 1 3;^%t OSf 8Z3 4 1 3 ; ^%
b) 30 g/l Kobaltsulfat 110 g/l Nätriumcitrat *K5 g/l Ammoniumehlorid 12 g/l Natriumhypophosphitb) 30 g / l cobalt sulphate 110 g / l sodium citrate * K5 g / l ammonium chloride 12 g / l sodium hypophosphite
95 c95 c
Nickel/Kobalt a) 20 g/l NiekelchioridNickel / cobalt a) 20 g / l Niekelchiorid
10 g/l Kobaltchiorid 20 g/l Natriumeitrat 10 g/l Natriumhypophosphit10 g / l cobalt chloride 20 g / l sodium citrate 10 g / l sodium hypophosphite
95 C95 C
b) 25 g/l Nickelsulfat. 5 g/l Kobaltchioridb) 25 g / l nickel sulphate. 5 g / l cobalt chloride
60 g/l Ammoniumclilorid60 g / l ammonium chloride
15 g/l Natrlunihypophosphit15 g / l sodium hypophosphite
PHo9i5 95 CPH o 9i5 95 C
, l) In diesen Grundlösungen sind Peststoffe nach Tabelle II suspendiörte Atisserdera können Glanzbildner zugesetzt τί-erden», l) These basic solutions contain pesticides according to Table II Suspended Atisserdera can add brighteners τί-earth »
Als Feststoffe können z.B. allein oder in Kombination verwendet werden:As solids, for example, they can be used alone or in combination will:
Kaolin ·Kaolin
Glasraehl Talkum Graphit Kunststoffe DiamantGlasraehl talc graphite Plastics diamond
Oxide, Carbide, Nitride, Boride, Suizide, Sulfide, Silikate, Sulfate, Carbonate, Phosphate t Oxalate, Fluoride vonOxides, carbides, nitrides, borides, suicides, sulfides, silicates, sulfates, carbonates, phosphates t oxalates, fluorides of
Aluminium MagnesiumAluminum magnesium
Bor CalciumBoron calcium
Chrom : BariumChromium: barium
Hafnium StrontiumHafnium strontium
Molybdän CerMolybdenum cerium
Silizium : Bisen 'Titan ManganSilicon: Bisen 'Titan Manganese
TantalTantalum
Vanadin r Vanadium r
. Wolfram Zirkon Nickel. Tungsten zirconium nickel
Der Durchmesser der Feststoffteilchen kann je nach Verwendungs~ zweck der Niederschläge in der Größenordnung von 0,01 bis IQOThe diameter of the solid particles can vary depending on the application Purpose of precipitation in the range of 0.01 to IQO
Mikron liegen. 109 8 2 37 1 3 ßO SADOMGiNALMicrons. 109 8 2 37 1 3 ßO SADOMGiNAL
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB0090776 | 1967-01-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE1621206A1 true DE1621206A1 (en) | 1971-06-03 |
DE1621206B2 DE1621206B2 (en) | 1971-12-16 |
Family
ID=6985469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19671621206 Ceased DE1621206B2 (en) | 1967-01-18 | 1967-01-18 | PROCESS FOR COATING WITH SLIDING FRICTION ON WORKPIECES STRESSED BY WEAR |
Country Status (5)
Country | Link |
---|---|
US (1) | US3617363A (en) |
BE (1) | BE709470A (en) |
DE (1) | DE1621206B2 (en) |
FR (1) | FR1551555A (en) |
GB (1) | GB1219813A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4547407A (en) * | 1982-08-09 | 1985-10-15 | Surface Technology, Inc. | Electroless metal coatings incorporating particulate matter of varied nominal sizes |
USRE33767E (en) * | 1971-12-15 | 1991-12-10 | Surface Technology, Inc. | Method for concomitant particulate diamond deposition in electroless plating, and the product thereof |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3853094A (en) * | 1971-01-25 | 1974-12-10 | Du Pont | Electroless plating apparatus |
US3920410A (en) * | 1971-04-28 | 1975-11-18 | Sherritt Gordon Mines Ltd | Cobalt coated composite powder |
USRE29285E (en) * | 1973-03-15 | 1977-06-28 | E. I. Du Pont De Nemours And Company | Method for concomitant particulate diamond deposition in electroless plating, and the product thereof |
US3936577A (en) * | 1971-12-15 | 1976-02-03 | E. I. Du Pont De Nemours & Company | Method for concomitant particulate diamond deposition in electroless plating, and the product thereof |
US3798056A (en) * | 1972-04-05 | 1974-03-19 | Bell Telephone Labor Inc | Electroless plating process |
GB1426829A (en) * | 1973-06-09 | 1976-03-03 | Vaq Fos Ltd | Metal plating |
US3886925A (en) * | 1973-06-20 | 1975-06-03 | Barrie F Regan | Cutting wheel |
US3867176A (en) * | 1973-10-12 | 1975-02-18 | Atomic Energy Commission | Method for plating race-type assemblies |
DE2443238C3 (en) * | 1974-09-10 | 1987-07-09 | FAG Kugelfischer Georg Schäfer KGaA, 8720 Schweinfurt | Friction rotor for friction false twisting of synthetic threads |
US3996114A (en) * | 1975-12-17 | 1976-12-07 | John L. Raymond | Electroplating method |
US4153453A (en) * | 1976-03-01 | 1979-05-08 | The International Nickel Company, Inc. | Composite electrodeposits and alloys |
US4043878A (en) * | 1976-06-14 | 1977-08-23 | John L. Raymond | Electroplating method |
DE2634633C2 (en) * | 1976-07-31 | 1984-07-05 | Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover | Continuous casting mold made of a copper material, especially for continuous casting of steel |
US4219004A (en) * | 1978-11-20 | 1980-08-26 | Chemet Research, Inc. | Flexible, self-supporting blade for cutting electronic crystals and substrates or the like |
DE2909739A1 (en) * | 1979-03-13 | 1980-09-18 | Stahlecker Fritz | Open=end spinning rotor - is made of steel for cladding with a wear-resistant material |
US4861626A (en) * | 1979-04-21 | 1989-08-29 | Ngk Insulators, Ltd. | Extrusion die, method of producing the same and method of reclaiming the same |
DE3003484A1 (en) * | 1980-01-31 | 1981-08-06 | VMEI Lenin, Sofia | Prodn. of abrasive surface, e.g. for a tool - by contacting surface with abrasive particles with simultaneous electroless deposition of nickel |
US6306466B1 (en) | 1981-04-01 | 2001-10-23 | Surface Technology, Inc. | Stabilizers for composite electroless plating |
US5863616A (en) * | 1981-04-01 | 1999-01-26 | Surface Technology, Inc. | Non-ionic stabilizers in composite electroless plating |
US5145517A (en) * | 1981-04-01 | 1992-09-08 | Surface Technology, Inc. | Composite electroless plating-solutions, processes, and articles thereof |
US5300330A (en) * | 1981-04-01 | 1994-04-05 | Surface Technology, Inc. | Stabilized composite electroless plating compositions |
JPS60197880A (en) * | 1984-03-19 | 1985-10-07 | Aisin Seiki Co Ltd | Composite plated sliding surface |
DE3675419D1 (en) * | 1985-04-13 | 1990-12-13 | Licentia Gmbh | METHOD FOR THE WET CHEMICAL PRODUCTION OF A METAL LAYER. |
US4716059A (en) * | 1987-02-26 | 1987-12-29 | Allied Corporation | Composites of metal with carbon fluoride and method of preparation |
US4997686A (en) * | 1987-12-23 | 1991-03-05 | Surface Technology, Inc. | Composite electroless plating-solutions, processes, and articles thereof |
EP0458827A1 (en) * | 1989-02-17 | 1991-12-04 | Polymetals Technology Limited | Plating composition and process |
US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
JPH06235057A (en) * | 1992-12-07 | 1994-08-23 | Ford Motor Co | Combined metallizing line and method for use thereof |
US5674631A (en) * | 1993-01-19 | 1997-10-07 | Surface Technology, Inc. | Selective codeposition of particulate matter and composite plated articles thereof |
US5707725A (en) * | 1993-01-19 | 1998-01-13 | Surface Technology, Inc. | Composite plating having a gradient in density of codeposited particles |
JPH07102383A (en) * | 1993-10-01 | 1995-04-18 | Fuji Electric Co Ltd | Mechanism element |
US5721055A (en) * | 1995-01-03 | 1998-02-24 | Surface Technology, Inc. | Lubricated textile spinning machinery parts |
SE519466C2 (en) * | 2000-12-07 | 2003-03-04 | Swedev Ab | Schaber or razor blade with nickel coating including abrasion-resistant particles and method of manufacture |
US6635188B1 (en) * | 2002-04-18 | 2003-10-21 | Board Of Trustees Of Michigan State University | Windshield washer and deicer |
DE202004020372U1 (en) * | 2003-04-16 | 2005-06-02 | AHC-Oberflächentechnik GmbH | object |
WO2004092444A2 (en) * | 2003-04-16 | 2004-10-28 | Ahc Oberflächentechnik Gmbh & Co. Ohg | Use of an object as an electronic component |
BRPI0506625A (en) * | 2004-02-11 | 2007-05-02 | Diamond Innovations Inc | article and method for producing a shaped object |
US7562858B2 (en) * | 2005-03-16 | 2009-07-21 | Diamond Innovations, Inc. | Wear and texture coatings for components used in manufacturing glass light bulbs |
US20060251910A1 (en) * | 2005-05-06 | 2006-11-09 | Lancsek Thomas S | Composite electroless plating |
US20090011136A1 (en) * | 2005-05-06 | 2009-01-08 | Thomas Steven Lancsek | Composite electroless plating |
US20070184271A1 (en) * | 2006-02-08 | 2007-08-09 | Feldstein Michael D | Coated textile machinery parts |
US20070196642A1 (en) * | 2006-02-17 | 2007-08-23 | Feldstein Michael D | Coating for biological rejuvenation |
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DE102006049062A1 (en) * | 2006-10-13 | 2008-04-17 | Christian Pluta | Wear-resistant coating |
US20090286104A1 (en) * | 2008-05-16 | 2009-11-19 | General Electric Company | Multi-layered nickel-phosphorous coatings and processes for forming the same |
DK2449154T3 (en) | 2009-06-29 | 2022-01-10 | Cirrus Mat Science Limited | Method of plating or coating for the production of metal-ceramic coating on a substrate |
DE102010012309A1 (en) * | 2010-03-23 | 2011-09-29 | Sms Siemag Ag | Mold element and method for its coating |
IT201800020827A1 (en) * | 2018-12-21 | 2020-06-21 | Gianluca Taroni | CODEPOSITE NICKEL AND SILICON CARBIDE |
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Publication number | Priority date | Publication date | Assignee | Title |
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NL290590A (en) * | ||||
US2694017A (en) * | 1952-09-16 | 1954-11-09 | Gen American Transporation Cor | Process of chemical nickel plating of aluminum and its alloys and baths therefor |
US2837445A (en) * | 1956-04-06 | 1958-06-03 | Gen Am Transport | Continuous processes of chemical nickel plating |
US3061525A (en) * | 1959-06-22 | 1962-10-30 | Platecraft Of America Inc | Method for electroforming and coating |
US3326700A (en) * | 1963-06-12 | 1967-06-20 | Rudolph J Zeblisky | Electroless copper plating |
NL125957C (en) * | 1960-07-26 | |||
DE1254935B (en) * | 1960-12-31 | 1967-11-23 | Bayer Ag | Aqueous bath for chemical deposition of boron-containing metal coatings |
US3077421A (en) * | 1961-03-13 | 1963-02-12 | Gen Am Transport | Processes of producing tin-nickelphosphorus coatings |
US3152009A (en) * | 1962-05-17 | 1964-10-06 | Dow Chemical Co | Electroless nickel plating |
GB1041753A (en) * | 1964-04-01 | 1966-09-07 | Res Holland Nv | Improved method of depositing bright-nickel/chromium |
US3378400A (en) * | 1965-07-30 | 1968-04-16 | Ralph E. Sickles | Autocatalytic deposition of nickel, cobalt and alloys thereof |
-
1967
- 1967-01-18 DE DE19671621206 patent/DE1621206B2/en not_active Ceased
-
1968
- 1968-01-16 US US698129A patent/US3617363A/en not_active Expired - Lifetime
- 1968-01-17 BE BE709470D patent/BE709470A/xx not_active IP Right Cessation
- 1968-01-17 GB GB2632/68A patent/GB1219813A/en not_active Expired
- 1968-01-17 FR FR1551555D patent/FR1551555A/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE33767E (en) * | 1971-12-15 | 1991-12-10 | Surface Technology, Inc. | Method for concomitant particulate diamond deposition in electroless plating, and the product thereof |
US4547407A (en) * | 1982-08-09 | 1985-10-15 | Surface Technology, Inc. | Electroless metal coatings incorporating particulate matter of varied nominal sizes |
Also Published As
Publication number | Publication date |
---|---|
DE1621206B2 (en) | 1971-12-16 |
FR1551555A (en) | 1968-12-27 |
BE709470A (en) | 1968-07-17 |
GB1219813A (en) | 1971-01-20 |
US3617363A (en) | 1971-11-02 |
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