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Adapterelement zum Anbinden eines Bauelements wie einer Laserdiode an einen Kühlkörper, ein System aus einer Laserdiode, einem Kühlkörper und einem Adapterelement und Verfahren zur Herstellung eines Adapterelements
Joining material comprising tin and at least one element capable of forming a compound with each of tin and carbon (titanium, zirconium or vanadium), fabrication method for semiconductor device using the joining material and corresponding semiconductor device