DE1439427A1 - Halbleiteranordnung und Verfahren zu deren Herstellung - Google Patents

Halbleiteranordnung und Verfahren zu deren Herstellung

Info

Publication number
DE1439427A1
DE1439427A1 DE19641439427 DE1439427A DE1439427A1 DE 1439427 A1 DE1439427 A1 DE 1439427A1 DE 19641439427 DE19641439427 DE 19641439427 DE 1439427 A DE1439427 A DE 1439427A DE 1439427 A1 DE1439427 A1 DE 1439427A1
Authority
DE
Germany
Prior art keywords
production
semiconductor device
proportionate
inclusion
metal layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19641439427
Other languages
English (en)
Inventor
Lob Dipl-Ing Udo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DES68563A external-priority patent/DE1185728B/de
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE1439427A1 publication Critical patent/DE1439427A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01032—Germanium [Ge]
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01042—Molybdenum [Mo]
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    • H01L2924/01051—Antimony [Sb]
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    • H01L2924/01066—Dysprosium [Dy]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

  • Halbleiteranordnung und Verfahren zu deren Herstellung
    dotierten Bereichen versehene Halbleiterkörper, der mit den Hilfsträgerplatten über geeignete Lot- bzw. Metallschichten einheitlich verbunden ist, an seiner äußeren Mantelfläche vor dem Einschluß seiner Mantelfläche und seiner anteiligen Stirn-

Claims (1)

  1.
DE19641439427 1960-05-18 1964-08-08 Halbleiteranordnung und Verfahren zu deren Herstellung Pending DE1439427A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES68563A DE1185728B (de) 1960-05-18 1960-05-18 Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
DES0092533 1964-08-08

Publications (1)

Publication Number Publication Date
DE1439427A1 true DE1439427A1 (de) 1969-06-26

Family

ID=63144755

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19641439427 Pending DE1439427A1 (de) 1960-05-18 1964-08-08 Halbleiteranordnung und Verfahren zu deren Herstellung

Country Status (5)

Country Link
CH (1) CH422168A (de)
DE (1) DE1439427A1 (de)
FR (1) FR88680E (de)
GB (1) GB1104515A (de)
NL (1) NL6510283A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2102512A5 (de) * 1970-08-06 1972-04-07 Liaison Electr Silec

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2630320A1 (de) * 1976-07-06 1978-01-12 Licentia Gmbh Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse
DE3136730A1 (de) * 1981-09-16 1983-03-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterdiode
FR2839952B1 (fr) 2002-05-24 2004-08-06 Oreal Dispositif de distribution destine a equiper un recipient muni d'une valve
DE102017203132A1 (de) * 2017-02-06 2018-08-09 Siemens Aktiengesellschaft Leistungsmodul

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2102512A5 (de) * 1970-08-06 1972-04-07 Liaison Electr Silec

Also Published As

Publication number Publication date
CH422168A (de) 1966-10-15
FR88680E (fr) 1967-03-10
GB1104515A (en) 1968-02-28
NL6510283A (de) 1966-02-09

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