DE1363573U - - Google Patents

Info

Publication number
DE1363573U
DE1363573U DENDAT1363573D DE1363573DU DE1363573U DE 1363573 U DE1363573 U DE 1363573U DE NDAT1363573 D DENDAT1363573 D DE NDAT1363573D DE 1363573D U DE1363573D U DE 1363573DU DE 1363573 U DE1363573 U DE 1363573U
Authority
DE
Germany
Prior art keywords
light fabric
bracket
zuffenhauaen
utstesohtn
nfreohtatehen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT1363573D
Other languages
German (de)
English (en)
Publication of DE1363573U publication Critical patent/DE1363573U/de
Active legal-status Critical Current

Links

Landscapes

  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Woven Fabrics (AREA)
DENDAT1363573D Active DE1363573U (cg-RX-API-DMAC10.html)

Publications (1)

Publication Number Publication Date
DE1363573U true DE1363573U (cg-RX-API-DMAC10.html)

Family

ID=677260

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1363573D Active DE1363573U (cg-RX-API-DMAC10.html)

Country Status (1)

Country Link
DE (1) DE1363573U (cg-RX-API-DMAC10.html)

Similar Documents

Publication Publication Date Title
DE1363573U (cg-RX-API-DMAC10.html)
JP2016040203A (ja) 基板反転搬送装置
TW201313645A (zh) 分斷裝置
JPH04105737A (ja) ハイブリッドｉｃのリードカット装置
JPH057937A (ja) 折曲機のワーク反転位置決め装置
JP2012142579A (ja) ボンディングのために基板を搬送する装置
JP2014080334A (ja) 基板分断装置
CN114906544A (zh) 一种直线灌装装置
CN113385798A (zh) 一种框架焊接生产线
JP2014080336A (ja) 基板分断装置
CN222699428U (zh) 一种集成电路板翻转送料设备
US20060163325A1 (en) Wire bonding apparatus and process
JP3400369B2 (ja) ワーク搬送装置
CN223238099U (zh) 一种堆叠输送装置
JP4569175B2 (ja) ワーク入替機構付き自動搬送装置
KR19990000650A (ko) 반도체 가공장치의 팩키지 적재시스템
US1078291A (en) Automatic card cutting, counting, and packaging machine.
US694696A (en) Lumber-conveyer for sawmills.
CN214152856U (zh) 一种微电子芯片的软焊料装片机
TW434079B (en) Apparatus and method for strip solder plating
JP2664951B2 (ja) 半導体製造装置
US384825A (en) coleman
CN108856958A (zh) 自动送焊环机构及自动套环机
DE1436979U (cg-RX-API-DMAC10.html)
JPH04294934A (ja) ワークの保持装置