DE1251874B - - Google Patents

Info

Publication number
DE1251874B
DE1251874B DENDAT1251874D DE1251874DA DE1251874B DE 1251874 B DE1251874 B DE 1251874B DE NDAT1251874 D DENDAT1251874 D DE NDAT1251874D DE 1251874D A DE1251874D A DE 1251874DA DE 1251874 B DE1251874 B DE 1251874B
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1251874D
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of DE1251874B publication Critical patent/DE1251874B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DENDAT1251874D 1960-10-17 Pending DE1251874B (h)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6320260A 1960-10-17 1960-10-17

Publications (1)

Publication Number Publication Date
DE1251874B true DE1251874B (h)

Family

ID=22047644

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1251874D Pending DE1251874B (h) 1960-10-17

Country Status (3)

Country Link
US (1) US3125709A (h)
CH (1) CH397090A (h)
DE (1) DE1251874B (h)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1263190B (de) * 1961-07-12 1968-03-14 Siemens Ag Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
FR2453500A1 (fr) * 1979-04-04 1980-10-31 Sev Alternateurs Dispositif redresseur pour alternateur de vehicule automobile
GB2146174B (en) * 1983-09-06 1987-04-23 Gen Electric Hermetic power chip packages

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2129089A (en) * 1936-01-25 1938-09-06 Mallory & Co Inc P R Electrolytic condenser
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
BE541624A (h) * 1954-08-23 1900-01-01
NL207356A (h) * 1955-05-23
US2794942A (en) * 1955-12-01 1957-06-04 Hughes Aircraft Co Junction type semiconductor devices and method of making the same
DE1072323B (h) * 1957-04-16
US2864980A (en) * 1957-06-10 1958-12-16 Gen Electric Sealed current rectifier
US2972096A (en) * 1957-11-26 1961-02-14 Smith Corp A O Protection of a temperature sensitive device
DE1054585B (de) * 1958-03-18 1959-04-09 Eberle & Co Appbau Ges Halbleiterbauelement, z. B. Diode oder Transistor
US2947922A (en) * 1958-10-27 1960-08-02 Sarkes Tarzian Semiconductor device
US3015760A (en) * 1959-06-10 1962-01-02 Philips Corp Semi-conductor devices

Also Published As

Publication number Publication date
CH397090A (de) 1965-08-15
US3125709A (en) 1964-03-17

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