DE112023005272T5 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE112023005272T5
DE112023005272T5 DE112023005272.7T DE112023005272T DE112023005272T5 DE 112023005272 T5 DE112023005272 T5 DE 112023005272T5 DE 112023005272 T DE112023005272 T DE 112023005272T DE 112023005272 T5 DE112023005272 T5 DE 112023005272T5
Authority
DE
Germany
Prior art keywords
section
die pad
semiconductor device
support conductor
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023005272.7T
Other languages
German (de)
English (en)
Inventor
Hiroaki Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of DE112023005272T5 publication Critical patent/DE112023005272T5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/433—Shapes or dispositions of deformation-absorbing parts, e.g. leads having meandering shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
DE112023005272.7T 2022-12-21 2023-12-06 Halbleiterbauelement Pending DE112023005272T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022204281 2022-12-21
JP2022-204281 2022-12-21
PCT/JP2023/043583 WO2024135356A1 (ja) 2022-12-21 2023-12-06 半導体装置

Publications (1)

Publication Number Publication Date
DE112023005272T5 true DE112023005272T5 (de) 2025-12-11

Family

ID=91588346

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023005272.7T Pending DE112023005272T5 (de) 2022-12-21 2023-12-06 Halbleiterbauelement

Country Status (5)

Country Link
US (1) US20250309068A1 (https=)
JP (1) JPWO2024135356A1 (https=)
CN (1) CN120476473A (https=)
DE (1) DE112023005272T5 (https=)
WO (1) WO2024135356A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3535328B2 (ja) * 1996-11-13 2004-06-07 株式会社ルネサステクノロジ リードフレームとこれを用いた半導体装置
US8441325B2 (en) * 2004-06-03 2013-05-14 Silicon Laboratories Inc. Isolator with complementary configurable memory
JP6522402B2 (ja) * 2015-04-16 2019-05-29 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
CN120476473A (zh) 2025-08-12
JPWO2024135356A1 (https=) 2024-06-27
WO2024135356A1 (ja) 2024-06-27
US20250309068A1 (en) 2025-10-02

Similar Documents

Publication Publication Date Title
DE112014005622B4 (de) Halbleitervorrichtung
DE69308691T2 (de) Halbleiterbauelement mit reduzierter Schaltinduktanz und Verfahren zu seiner Herstellung
DE112018002137B4 (de) Halbleiterbauteil
DE112019005155B4 (de) Halbleitervorrichtung
DE112019003540T5 (de) Halbleiterbauteil
DE102016000264B4 (de) Halbleiterchipgehäuse, das sich lateral erstreckende Anschlüsse umfasst, und Verfahren zur Herstellung desselben
DE112019003664T5 (de) Halbleiterbauteil und verfahren zur herstellung eines halbleiterbauteils
DE102020125705A1 (de) Leistungs-Halbleitervorrichtung
DE112014006073T5 (de) Halbleitervorrichtung und Herstellungsverfahren hierfür
DE112022000855T5 (de) Halbleiterbauteil
DE112021006079B4 (de) Halbleiteranordnung
DE102019121229B4 (de) Elektronische Vorrichtungen mit elektrisch isolierten Lastelektroden und zugehörige Herstellungsverfahren
DE112022005438T5 (de) Halbleiterbauteil und Verfahren zur Herstellung des Halbleiterbauteils
DE102005039165A1 (de) Halbleiterleistungsbauteil mit vertikalem Strompfad durch einen Halbleiterleistungschip und Verfahren zu dessen Herstellung
DE112022006100T5 (de) Halbleitervorrichtung
DE112022001601T5 (de) Halbleiterbauteil und herstellungsverfahren für das halbleiterbauteil
DE112022001264T5 (de) Isolator, isoliermodul und gate-treiber
DE112021003557T5 (de) Halbleiterbauteil
DE112021006152T5 (de) Halbleiterausrüstung
DE112023005272T5 (de) Halbleiterbauelement
DE112021006144T5 (de) Halbleiterbauteil
DE112022005155T5 (de) Halbleiterbauteil
DE112022001273T5 (de) Halbleiterbauteil
DE112024000610T5 (de) Halbleiterbauteil und fahrzeug
DE112022000183T5 (de) Halbleiterbauelement

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023495000

Ipc: H10W0070400000