DE112020004819A5 - Anzeigevorrichtung und Anzeigeeinheit - Google Patents
Anzeigevorrichtung und Anzeigeeinheit Download PDFInfo
- Publication number
- DE112020004819A5 DE112020004819A5 DE112020004819.5T DE112020004819T DE112020004819A5 DE 112020004819 A5 DE112020004819 A5 DE 112020004819A5 DE 112020004819 T DE112020004819 T DE 112020004819T DE 112020004819 A5 DE112020004819 A5 DE 112020004819A5
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5381—Crossover interconnections, e.g. bridge stepovers
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/06—Passive matrix structure, i.e. with direct application of both column and row voltages to the light emitting or modulating elements, other than LCD or OLED
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- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
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- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019126859.1 | 2019-10-07 | ||
DE102019126859.1A DE102019126859A1 (de) | 2019-10-07 | 2019-10-07 | Anzeigevorrichtung und Anzeigeeinheit |
PCT/EP2020/077853 WO2021069378A1 (de) | 2019-10-07 | 2020-10-05 | Anzeigevorrichtung und anzeigeeinheit |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112020004819A5 true DE112020004819A5 (de) | 2022-07-28 |
DE112020004819B4 DE112020004819B4 (de) | 2024-05-16 |
Family
ID=72752443
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102019126859.1A Withdrawn DE102019126859A1 (de) | 2019-10-07 | 2019-10-07 | Anzeigevorrichtung und Anzeigeeinheit |
DE112020004819.5T Active DE112020004819B4 (de) | 2019-10-07 | 2020-10-05 | Anzeigevorrichtung und Anzeigeeinheit |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102019126859.1A Withdrawn DE102019126859A1 (de) | 2019-10-07 | 2019-10-07 | Anzeigevorrichtung und Anzeigeeinheit |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220293577A1 (de) |
JP (1) | JP7392129B2 (de) |
DE (2) | DE102019126859A1 (de) |
WO (1) | WO2021069378A1 (de) |
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DE102021119155A1 (de) | 2021-07-23 | 2023-01-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum aufbringen eines elektrischen verbindungsmaterials oder flussmittels auf ein bauelement |
DE102021119707A1 (de) * | 2021-07-29 | 2023-02-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Träger mit eingebetteter elektrischer verbindung, bauelement und verfahren zur herstellung eines trägers |
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JP4516518B2 (ja) * | 2005-03-15 | 2010-08-04 | 株式会社フューチャービジョン | 薄膜トランジスタを用いた液晶表示装置及びその製造方法 |
US8619008B2 (en) * | 2009-02-13 | 2013-12-31 | Global Oled Technology Llc | Dividing pixels between chiplets in display device |
US8125418B2 (en) * | 2009-06-26 | 2012-02-28 | Global Oled Technology Llc | Passive-matrix chiplet drivers for displays |
EP2466631A1 (de) * | 2009-09-30 | 2012-06-20 | Sharp Kabushiki Kaisha | Substratmodul und herstellungsverfahren dafür |
JP5398455B2 (ja) * | 2009-09-30 | 2014-01-29 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
CN103155202B (zh) * | 2010-10-15 | 2016-06-08 | 全球Oled科技有限责任公司 | 具有多个无源矩阵控制器的芯片显示器 |
KR20120055261A (ko) * | 2010-11-23 | 2012-05-31 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
CN111261639A (zh) * | 2015-09-11 | 2020-06-09 | 夏普株式会社 | 图像显示装置以及图像显示元件的制造方法 |
US10153257B2 (en) | 2016-03-03 | 2018-12-11 | X-Celeprint Limited | Micro-printed display |
JP2017175093A (ja) * | 2016-03-25 | 2017-09-28 | デクセリアルズ株式会社 | 電子部品、接続体、電子部品の設計方法 |
US10475876B2 (en) * | 2016-07-26 | 2019-11-12 | X-Celeprint Limited | Devices with a single metal layer |
US10943946B2 (en) * | 2017-07-21 | 2021-03-09 | X Display Company Technology Limited | iLED displays with substrate holes |
US11189605B2 (en) * | 2018-02-28 | 2021-11-30 | X Display Company Technology Limited | Displays with transparent bezels |
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- 2020-10-05 DE DE112020004819.5T patent/DE112020004819B4/de active Active
- 2020-10-05 JP JP2022520996A patent/JP7392129B2/ja active Active
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DE102019126859A1 (de) | 2021-04-08 |
WO2021069378A1 (de) | 2021-04-15 |
DE112020004819B4 (de) | 2024-05-16 |
JP7392129B2 (ja) | 2023-12-05 |
US20220293577A1 (en) | 2022-09-15 |
JP2022551619A (ja) | 2022-12-12 |
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