DE112020004486T5 - Messvorrichtung für eine physikalische Größe - Google Patents

Messvorrichtung für eine physikalische Größe Download PDF

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Publication number
DE112020004486T5
DE112020004486T5 DE112020004486.6T DE112020004486T DE112020004486T5 DE 112020004486 T5 DE112020004486 T5 DE 112020004486T5 DE 112020004486 T DE112020004486 T DE 112020004486T DE 112020004486 T5 DE112020004486 T5 DE 112020004486T5
Authority
DE
Germany
Prior art keywords
passage
circuit board
physical quantity
sub
mounting surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112020004486.6T
Other languages
German (de)
English (en)
Inventor
Hiroyuki AKUZAWA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of DE112020004486T5 publication Critical patent/DE112020004486T5/de
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F5/00—Measuring a proportion of the volume flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6842—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow with means for influencing the fluid flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L15/00—Devices or apparatus for measuring two or more fluid pressure values simultaneously
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Volume Flow (AREA)
DE112020004486.6T 2019-09-23 2020-08-07 Messvorrichtung für eine physikalische Größe Withdrawn DE112020004486T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019172384A JP2021050943A (ja) 2019-09-23 2019-09-23 物理量計測装置
JP2019-172384 2019-09-23
PCT/JP2020/030378 WO2021059778A1 (ja) 2019-09-23 2020-08-07 物理量計測装置

Publications (1)

Publication Number Publication Date
DE112020004486T5 true DE112020004486T5 (de) 2022-06-23

Family

ID=75157567

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020004486.6T Withdrawn DE112020004486T5 (de) 2019-09-23 2020-08-07 Messvorrichtung für eine physikalische Größe

Country Status (4)

Country Link
US (1) US20220170771A1 (https=)
JP (1) JP2021050943A (https=)
DE (1) DE112020004486T5 (https=)
WO (1) WO2021059778A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379994B2 (ja) 2019-09-23 2023-11-15 株式会社デンソー 流量検出装置およびその流量検出装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016121179A1 (ja) 2015-01-30 2016-08-04 日立オートモティブシステムズ株式会社 物理量検出装置および電子装置
JP2019172384A (ja) 2018-03-26 2019-10-10 株式会社沖データ 画像形成装置および画像形成開始時期の調整方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000357768A (ja) * 1999-06-17 2000-12-26 Hitachi Ltd 半導体装置及びその製造方法
JP2004028631A (ja) * 2002-06-21 2004-01-29 Mitsubishi Electric Corp 流量センサ
JP5098498B2 (ja) * 2007-08-06 2012-12-12 株式会社デンソー 電子装置
JP4589428B2 (ja) * 2008-08-19 2010-12-01 アルプス電気株式会社 半導体チップモジュール
JP6184915B2 (ja) * 2014-07-30 2017-08-23 日立オートモティブシステムズ株式会社 物理量検出装置
US10879194B2 (en) * 2017-05-25 2020-12-29 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device package and method of manufacturing the same
JP6847266B2 (ja) * 2017-12-20 2021-03-24 三菱電機株式会社 半導体パッケージおよびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016121179A1 (ja) 2015-01-30 2016-08-04 日立オートモティブシステムズ株式会社 物理量検出装置および電子装置
JP2019172384A (ja) 2018-03-26 2019-10-10 株式会社沖データ 画像形成装置および画像形成開始時期の調整方法

Also Published As

Publication number Publication date
US20220170771A1 (en) 2022-06-02
JP2021050943A (ja) 2021-04-01
WO2021059778A1 (ja) 2021-04-01

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee