DE112016002046A5 - Rohrtarget - Google Patents

Rohrtarget Download PDF

Info

Publication number
DE112016002046A5
DE112016002046A5 DE112016002046.5T DE112016002046T DE112016002046A5 DE 112016002046 A5 DE112016002046 A5 DE 112016002046A5 DE 112016002046 T DE112016002046 T DE 112016002046T DE 112016002046 A5 DE112016002046 A5 DE 112016002046A5
Authority
DE
Germany
Prior art keywords
tube target
target
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112016002046.5T
Other languages
English (en)
Inventor
André Dronhofer
Christian Linke
Elisabeth Eidenberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plansee SE
Original Assignee
Plansee SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee SE filed Critical Plansee SE
Publication of DE112016002046A5 publication Critical patent/DE112016002046A5/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/342Hollow targets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • H01J37/3408Planar magnetron sputtering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3414Targets
    • H01J37/3426Material
    • H01J37/3429Plural materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE112016002046.5T 2015-05-06 2016-04-28 Rohrtarget Pending DE112016002046A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ATGM108/2015U AT14911U1 (de) 2015-05-06 2015-05-06 Rohrtarget
ATGM108/2015 2015-05-06
PCT/AT2016/000044 WO2016176696A1 (de) 2015-05-06 2016-04-28 Rohrtarget

Publications (1)

Publication Number Publication Date
DE112016002046A5 true DE112016002046A5 (de) 2018-03-01

Family

ID=56564973

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112016002046.5T Pending DE112016002046A5 (de) 2015-05-06 2016-04-28 Rohrtarget

Country Status (8)

Country Link
US (1) US11367599B2 (de)
JP (1) JP6543728B2 (de)
KR (1) KR101998498B1 (de)
CN (1) CN107969159B (de)
AT (1) AT14911U1 (de)
DE (1) DE112016002046A5 (de)
TW (1) TWI695414B (de)
WO (1) WO2016176696A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110747438B (zh) * 2019-12-02 2021-11-23 广西晶联光电材料有限责任公司 一种高贴合强度旋转靶材的绑定方法
JP7228612B2 (ja) * 2020-03-27 2023-02-24 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法及びプログラム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1007535A3 (nl) * 1993-09-24 1995-07-25 Innovative Sputtering Tech Gelaagde metaalstructuur.
JP4614037B2 (ja) * 2000-09-08 2011-01-19 Agcセラミックス株式会社 円筒状ターゲット
EP1321537A4 (de) 2000-09-08 2006-06-07 Asahi Glass Co Ltd Zylindrisches target und herstellungsverfahren für zylindrisches target
DE10102493B4 (de) 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
DE602004020599D1 (de) * 2003-03-25 2009-05-28 Bekaert Advanced Coatings Universelle vakuumskupplung für ein zylindrisches aufnahmeteil
DE102004058316A1 (de) 2004-12-02 2006-06-08 W.C. Heraeus Gmbh Rohrförmiges Sputtertarget
PT1752556E (pt) 2005-08-02 2008-01-22 Applied Materials Gmbh & Co Kg Cátodo tubular para aplicação em processo de pulverização catódica
US20150090587A1 (en) 2011-12-09 2015-04-02 Applied Materials, Inc. Rotatable sputter target
AT13609U1 (de) * 2012-09-17 2014-04-15 Plansee Se Rohrförmiges Target
DE102013103472B4 (de) * 2013-04-08 2018-08-09 VON ARDENNE Asset GmbH & Co. KG Vakuumbetriebskomponente und Vakuumprozessanordnung

Also Published As

Publication number Publication date
CN107969159A (zh) 2018-04-27
US20180144913A1 (en) 2018-05-24
KR20180004723A (ko) 2018-01-12
AT14911U1 (de) 2016-08-15
WO2016176696A1 (de) 2016-11-10
KR101998498B1 (ko) 2019-07-09
TW201707043A (zh) 2017-02-16
TWI695414B (zh) 2020-06-01
CN107969159B (zh) 2020-06-19
US11367599B2 (en) 2022-06-21
JP6543728B2 (ja) 2019-07-10
JP2018514652A (ja) 2018-06-07

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R016 Response to examination communication