DE112014004129T5 - Geklebte Wärmetauschermatrix und entsprechendes Klebeverfahren - Google Patents

Geklebte Wärmetauschermatrix und entsprechendes Klebeverfahren Download PDF

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Publication number
DE112014004129T5
DE112014004129T5 DE112014004129.7T DE112014004129T DE112014004129T5 DE 112014004129 T5 DE112014004129 T5 DE 112014004129T5 DE 112014004129 T DE112014004129 T DE 112014004129T DE 112014004129 T5 DE112014004129 T5 DE 112014004129T5
Authority
DE
Germany
Prior art keywords
adhesive
matrix
components
primer
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112014004129.7T
Other languages
German (de)
English (en)
Inventor
Gaëtan Joël Berguin
Thierry MAZET
Salima Bouti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fives Cryo SAS
Original Assignee
Fives Cryo SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fives Cryo SAS filed Critical Fives Cryo SAS
Publication of DE112014004129T5 publication Critical patent/DE112014004129T5/de
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0093—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
    • F25J5/00—Arrangements of cold exchangers or cold accumulators in separation or liquefaction plants
    • F25J5/002—Arrangements of cold exchangers or cold accumulators in separation or liquefaction plants for continuously recuperating cold, i.e. in a so-called recuperative heat exchanger
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
    • F25J2290/00—Other details not covered by groups F25J2200/00 - F25J2280/00
    • F25J2290/42—Modularity, pre-fabrication of modules, assembling and erection, horizontal layout, i.e. plot plan, and vertical arrangement of parts of the cryogenic unit, e.g. of the cold box
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25J—LIQUEFACTION, SOLIDIFICATION OR SEPARATION OF GASES OR GASEOUS OR LIQUEFIED GASEOUS MIXTURES BY PRESSURE AND COLD TREATMENT OR BY BRINGING THEM INTO THE SUPERCRITICAL STATE
    • F25J2290/00—Other details not covered by groups F25J2200/00 - F25J2280/00
    • F25J2290/44—Particular materials used, e.g. copper, steel or alloys thereof or surface treatments used, e.g. enhanced surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
DE112014004129.7T 2013-09-09 2014-08-22 Geklebte Wärmetauschermatrix und entsprechendes Klebeverfahren Pending DE112014004129T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1358657 2013-09-09
FR1358657A FR3010513B1 (fr) 2013-09-09 2013-09-09 Matrice d'echangeur de chaleur collee et procede de collage correspondant
PCT/EP2014/067878 WO2015032631A1 (fr) 2013-09-09 2014-08-22 Matrice d'échangeur de chaleur collée et procédé de collage correspondant

Publications (1)

Publication Number Publication Date
DE112014004129T5 true DE112014004129T5 (de) 2016-05-25

Family

ID=50478475

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014004129.7T Pending DE112014004129T5 (de) 2013-09-09 2014-08-22 Geklebte Wärmetauschermatrix und entsprechendes Klebeverfahren

Country Status (7)

Country Link
US (1) US20160216039A1 (zh)
JP (1) JP6487443B2 (zh)
KR (1) KR20160058099A (zh)
CN (1) CN105705900B (zh)
DE (1) DE112014004129T5 (zh)
FR (1) FR3010513B1 (zh)
WO (1) WO2015032631A1 (zh)

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US10775054B2 (en) 2009-03-13 2020-09-15 Treau, Inc. Modular air conditioning system
US10533810B2 (en) 2015-05-20 2020-01-14 Other Lab, Llc Near-isothermal compressor/expander
CN107782181A (zh) * 2016-08-31 2018-03-09 航天海鹰(哈尔滨)钛业有限公司 一种新型换热器芯部
EP3561434B1 (en) 2016-12-21 2023-03-29 Mitsubishi Electric Corporation Heat exchanger, method for manufacturing same, and refrigeration cycle device
EP3473961B1 (en) 2017-10-20 2020-12-02 Api Heat Transfer, Inc. Heat exchanger
JP6888211B2 (ja) * 2018-07-13 2021-06-16 株式会社三井Ｅ＆Ｓマシナリー 気化器
CN112424464B (zh) * 2018-07-13 2021-07-06 三井易艾斯机械有限公司 气化器
JP6740289B2 (ja) * 2018-07-13 2020-08-12 株式会社三井Ｅ＆Ｓマシナリー 気化器
JP7166153B2 (ja) * 2018-11-30 2022-11-07 昭和電工パッケージング株式会社 熱交換器
JP7274325B2 (ja) * 2019-03-28 2023-05-16 株式会社レゾナック・パッケージング 熱交換器
JP7239370B2 (ja) * 2019-03-28 2023-03-14 株式会社レゾナック・パッケージング 熱交換器
JP7221136B2 (ja) * 2019-05-28 2023-02-13 株式会社レゾナック・パッケージング 熱交換器
CN113669892B (zh) * 2019-08-01 2022-10-14 浙江三花智能控制股份有限公司 换热器
US20210404749A1 (en) * 2020-06-30 2021-12-30 Treau, Inc. Multilayer sheets for heat exchangers

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DE1551495A1 (de) * 1967-04-13 1970-03-05 Roggenkamp Hanns Th Leichtmetall-Waermetauscher
DE2611398A1 (de) * 1976-03-18 1977-09-22 M & D Klima System Ag Waermetauscher
JPS60101592U (ja) * 1983-12-15 1985-07-11 住友軽金属工業株式会社 積層型熱交換器コア
EP0288258A3 (en) * 1987-04-24 1989-03-08 Alcan International Limited Process for making metal surfaces hydrophilic and novel products thus produced
JPH02146497A (ja) * 1988-11-26 1990-06-05 Kajima Corp 可撓膜形熱交換器
US5490559A (en) * 1994-07-20 1996-02-13 Dinulescu; Horia A. Heat exchanger with finned partition walls
US5863671A (en) * 1994-10-12 1999-01-26 H Power Corporation Plastic platelet fuel cells employing integrated fluid management
US20020144808A1 (en) * 2001-04-04 2002-10-10 Jones Bart R. Adhesively bonded radiator assembly
NL1020483C1 (nl) * 2002-04-26 2003-10-28 Oxycell Holding Bv Warmtewisselaar en werkwijze voor het vervaardigen daarvan.
JP4026503B2 (ja) * 2002-05-16 2007-12-26 株式会社デンソー 熱交換器の製造方法
JP2005316401A (ja) * 2004-03-30 2005-11-10 Furukawa Sky Kk コールドプレートおよびその製造方法
JP2006284009A (ja) * 2005-03-31 2006-10-19 Mitsubishi Electric Corp 捩り管形熱交換器の製造方法
US7776963B2 (en) * 2005-05-03 2010-08-17 Illinois Tool Works Inc. Acrylic adhesives for metal bonding applications
JP5536971B2 (ja) * 2006-01-23 2014-07-02 ソマール株式会社 多層接着シート、熱交換器形成用材料及び熱交換器
US7510174B2 (en) * 2006-04-14 2009-03-31 Kammerzell Larry L Dew point cooling tower, adhesive bonded heat exchanger, and other heat transfer apparatus
CN201444005U (zh) * 2009-04-29 2010-04-28 刘哲 纳米覆膜技术的热交换器
JP5191961B2 (ja) * 2009-06-24 2013-05-08 大成プラス株式会社 １液性エポキシ接着剤及び接着方法
JP2012533723A (ja) * 2009-07-17 2012-12-27 ロッキード マーティン コーポレーション 熱交換器及びその製造方法
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CN103429982B (zh) * 2011-02-04 2016-06-29 洛克希德马丁公司 具有泡沫翅片的换热器
US20140093723A1 (en) * 2011-05-27 2014-04-03 Masaki Takeuchi Substrate, method for producing same, heat-releasing substrate, and heat-releasing module
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US9520378B2 (en) * 2012-12-21 2016-12-13 Intel Corporation Thermal matched composite die

Also Published As

Publication number Publication date
CN105705900A (zh) 2016-06-22
FR3010513A1 (fr) 2015-03-13
US20160216039A1 (en) 2016-07-28
JP2016530477A (ja) 2016-09-29
CN105705900B (zh) 2017-11-14
KR20160058099A (ko) 2016-05-24
FR3010513B1 (fr) 2015-10-16
JP6487443B2 (ja) 2019-03-20
WO2015032631A1 (fr) 2015-03-12

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