DE112013000145A5 - Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung - Google Patents

Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung Download PDF

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Publication number
DE112013000145A5
DE112013000145A5 DE112013000145.4T DE112013000145T DE112013000145A5 DE 112013000145 A5 DE112013000145 A5 DE 112013000145A5 DE 112013000145 T DE112013000145 T DE 112013000145T DE 112013000145 A5 DE112013000145 A5 DE 112013000145A5
Authority
DE
Germany
Prior art keywords
electrical connections
semiconductor circuit
multiple signal
potential assignment
assignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112013000145.4T
Other languages
English (en)
Inventor
Gerhard Kahmen
Thomas Dabrowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohde and Schwarz GmbH and Co KG
Original Assignee
Rohde and Schwarz GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohde and Schwarz GmbH and Co KG filed Critical Rohde and Schwarz GmbH and Co KG
Publication of DE112013000145A5 publication Critical patent/DE112013000145A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0008—Arrangements for reducing power consumption
    • H03K19/0016—Arrangements for reducing power consumption by using a control or a clock signal, e.g. in order to apply power supply
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
    • H03K19/1731—Optimisation thereof
    • H03K19/1732—Optimisation thereof by limitation or reduction of the pin/gate ratio
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
DE112013000145.4T 2012-03-08 2013-02-19 Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung Pending DE112013000145A5 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE202012002379 2012-03-08
DE202012002379.9 2012-03-08
DE202012004532U DE202012004532U1 (de) 2012-03-08 2012-05-07 Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung
DE202012004532.6 2012-05-07
PCT/EP2013/053277 WO2013131742A1 (de) 2012-03-08 2013-02-19 Halbleiterschaltung mit elektrischen anschlüssen mit mehrfacher signal- oder potentialbelegung

Publications (1)

Publication Number Publication Date
DE112013000145A5 true DE112013000145A5 (de) 2014-04-17

Family

ID=48784017

Family Applications (2)

Application Number Title Priority Date Filing Date
DE202012004532U Expired - Lifetime DE202012004532U1 (de) 2012-03-08 2012-05-07 Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung
DE112013000145.4T Pending DE112013000145A5 (de) 2012-03-08 2013-02-19 Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE202012004532U Expired - Lifetime DE202012004532U1 (de) 2012-03-08 2012-05-07 Halbleiterschaltung mit elektrischen Anschlüssen mit mehrfacher Signal- oder Potentialbelegung

Country Status (4)

Country Link
US (1) US9177946B2 (de)
CN (1) CN103891146B (de)
DE (2) DE202012004532U1 (de)
WO (1) WO2013131742A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104767514B (zh) * 2015-03-16 2018-04-13 福州大学 集成电路引脚多状态表示方法及其外接电路
CN105223492B (zh) * 2015-10-23 2018-08-28 英特格灵芯片(天津)有限公司 一种芯片管脚配置系统及其方法
CN107329417B (zh) * 2016-04-28 2023-08-15 深圳市博巨兴微电子科技有限公司 一种微控制器及其输入输出引脚映射电路
CN110164488A (zh) * 2019-04-08 2019-08-23 苏州汇峰微电子有限公司 一种支持多元存储配置的存储器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69326284T2 (de) * 1992-06-10 2000-03-23 Nec Corp Halbleiteranordnung mit anschlusswählender Schaltung
US5646451A (en) * 1995-06-07 1997-07-08 Lucent Technologies Inc. Multifunctional chip wire bonds
JPH10303366A (ja) * 1997-04-30 1998-11-13 Mitsubishi Electric Corp 半導体装置
US6509632B1 (en) 1998-01-30 2003-01-21 Micron Technology, Inc. Method of fabricating a redundant pinout configuration for signal enhancement in an IC package
US6385756B1 (en) * 1999-03-23 2002-05-07 Conexant Systems, Inc. Selection of functions within an integrated circuit
DE10238812B4 (de) 2002-08-23 2005-05-25 Infineon Technologies Ag Halbleiterspeichervorrichtung mit veränderbarer Kontaktbelegung und entsprechende Halbleitervorrichtung
US7276932B2 (en) 2004-08-26 2007-10-02 International Business Machines Corporation Power-gating cell for virtual power rail control
US7696649B2 (en) 2007-08-13 2010-04-13 Arm Limited Power control circuitry and method
JP5347249B2 (ja) * 2007-08-20 2013-11-20 富士通株式会社 半導体装置

Also Published As

Publication number Publication date
US9177946B2 (en) 2015-11-03
CN103891146B (zh) 2017-03-29
DE202012004532U1 (de) 2013-06-10
WO2013131742A1 (de) 2013-09-12
US20140225664A1 (en) 2014-08-14
CN103891146A (zh) 2014-06-25

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