DE112008000914A5 - Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung - Google Patents

Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung Download PDF

Info

Publication number
DE112008000914A5
DE112008000914A5 DE112008000914T DE112008000914T DE112008000914A5 DE 112008000914 A5 DE112008000914 A5 DE 112008000914A5 DE 112008000914 T DE112008000914 T DE 112008000914T DE 112008000914 T DE112008000914 T DE 112008000914T DE 112008000914 A5 DE112008000914 A5 DE 112008000914A5
Authority
DE
Germany
Prior art keywords
connector
kinkable
producing
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112008000914T
Other languages
English (en)
Inventor
Gerhard Katheder
Dirk Dr. Riese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112008000914A5 publication Critical patent/DE112008000914A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239Electronic boxes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/003Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an integrally preformed housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0026Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0191Dielectric layers wherein the thickness of the dielectric plays an important role
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/046Planar parts of folded PCBs making an angle relative to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228Cutting, sawing, milling or shearing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE112008000914T 2007-04-27 2008-03-01 Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung Withdrawn DE112008000914A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200710020466 DE102007020466A1 (de) 2007-04-27 2007-04-27 Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung
DE102007020466.5 2007-04-27
PCT/DE2008/000367 WO2008131711A1 (de) 2007-04-27 2008-03-01 Leiterplatte mit abknickbarer steckverbindung und das verfahren zur herstellung derartiger steckverbindung

Publications (1)

Publication Number Publication Date
DE112008000914A5 true DE112008000914A5 (de) 2010-01-21

Family

ID=39687079

Family Applications (2)

Application Number Title Priority Date Filing Date
DE200710020466 Withdrawn DE102007020466A1 (de) 2007-04-27 2007-04-27 Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung
DE112008000914T Withdrawn DE112008000914A5 (de) 2007-04-27 2008-03-01 Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE200710020466 Withdrawn DE102007020466A1 (de) 2007-04-27 2007-04-27 Leiterplatte mit abknickbarer Steckverbindung und das Verfahren zur Herstellung derartiger Steckverbindung

Country Status (3)

Country Link
EP (1) EP2165579A1 (de)
DE (2) DE102007020466A1 (de)
WO (1) WO2008131711A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007058095A1 (de) * 2007-12-03 2009-06-04 Robert Bosch Gmbh Leiterplatte mit daran angeschlossenen Kontaktstiften
DE102009048527B4 (de) * 2009-10-07 2021-12-09 Vitesco Technologies Germany Gmbh Anordnung von mehreren Schaltungsträgern und Verfahren zur Herstellung einer derartigen Anordnung
DE102009054234A1 (de) * 2009-11-21 2011-05-26 Bayerische Motoren Werke Aktiengesellschaft Elektrisches Steuergerät
DE102013209296B4 (de) * 2013-05-21 2024-04-18 Vitesco Technologies GmbH Elektronisches Modul, insbesondere Steuergerät für ein Fahrzeug
DE102018010157B4 (de) * 2018-12-28 2021-05-06 Joynext Gmbh Baugruppe mit einem elektronischen Gerät und einer Kupplung sowie Verfahren zum Montieren der Baugruppe
CN114554694B (zh) * 2022-02-22 2022-11-11 珠海精实测控技术股份有限公司 一种相对折弯机构、折弯定型载板模组及折弯定型装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2636492B1 (fr) * 1988-09-15 1994-04-15 Peugeot Automobiles Boitier pour circuits electroniques notamment pour vehicule automobile
DE4300899A1 (de) * 1993-01-15 1994-07-21 Diehl Gmbh & Co Elektronikeinrichtung und Verfahren zur Herstellung einer solchen Elektronikeinrichtung
FR2746736B1 (fr) * 1996-03-28 1998-06-19 Valeo Electronique Unite de gestion de vehicule automobile
EP1575344B1 (de) * 2004-03-11 2007-05-30 Siemens Aktiengesellschaft Steuergerät
JP4289207B2 (ja) * 2004-04-27 2009-07-01 株式会社デンソー 電子制御装置

Also Published As

Publication number Publication date
EP2165579A1 (de) 2010-03-24
WO2008131711A1 (de) 2008-11-06
DE102007020466A1 (de) 2008-11-06

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20111001