DE1072323B - - Google Patents

Info

Publication number
DE1072323B
DE1072323B DENDAT1072323D DE1072323DA DE1072323B DE 1072323 B DE1072323 B DE 1072323B DE NDAT1072323 D DENDAT1072323 D DE NDAT1072323D DE 1072323D A DE1072323D A DE 1072323DA DE 1072323 B DE1072323 B DE 1072323B
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1072323D
Other languages
German (de)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of DE1072323B publication Critical patent/DE1072323B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49938—Radially expanding part in cavity, aperture, or hollow body

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DENDAT1072323D 1957-04-16 Pending DE1072323B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL359789X 1957-04-16

Publications (1)

Publication Number Publication Date
DE1072323B true DE1072323B (zh)

Family

ID=19785356

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1072323D Pending DE1072323B (zh) 1957-04-16

Country Status (6)

Country Link
US (1) US3024299A (zh)
BE (1) BE566767A (zh)
CH (1) CH359789A (zh)
DE (1) DE1072323B (zh)
FR (1) FR1194674A (zh)
GB (1) GB826823A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1210489B (de) * 1961-08-10 1966-02-10 Siemens Ag Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement
DE1218620B (de) * 1962-02-05 1966-06-08 Siemens Ag Anwendung des elektrischen Widerstandsloetens auf das vakuumdichte Verschliessen einer Halbleiteranordnung
DE1228721B (de) * 1960-10-26 1966-11-17 Asea Ab Halbleiteranordnung mit einem gasdichten Gehaeuse
DE1237695B (de) * 1961-10-24 1967-03-30 Siemens Ag Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement
DE1514473A1 (de) * 1965-06-05 1969-11-13 Siemens Ag Halbleiterbauelementeanordnung

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3191268A (en) * 1958-02-28 1965-06-29 Gen Motors Corp Process for encapsulating transistors
US3125709A (en) * 1960-10-17 1964-03-17 Housing assembly
NL270996A (zh) * 1960-11-09
NL270517A (zh) * 1960-11-16
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3197843A (en) * 1961-05-19 1965-08-03 Nippert Electric Products Comp Method of forming a mount for semiconductors
US3242555A (en) * 1961-06-08 1966-03-29 Gen Motors Corp Method of making a semiconductor package
US3217216A (en) * 1962-07-12 1965-11-09 Gianni A Dotto Rotary capacitor apparatus
US3249982A (en) * 1963-01-07 1966-05-10 Hughes Aircraft Co Semiconductor diode and method of making same
US3358152A (en) * 1963-07-22 1967-12-12 Nicholas G Alexakis Temperature compensated transistor and means for controlling
US3268779A (en) * 1963-11-06 1966-08-23 Int Rectifier Corp Hermetically sealed semiconductor device
US3422320A (en) * 1965-12-23 1969-01-14 Gen Motors Corp Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices
US3937383A (en) * 1975-03-24 1976-02-10 Continental Can Company, Inc. High speed room temperature seam bonding of metal sheets
US4037749A (en) * 1976-03-15 1977-07-26 Bell Telephone Laboratories, Incorporated Hermetically sealed envelope and method of making the same
GB2132601B (en) * 1982-12-23 1986-08-20 Ferranti Plc Joining articles of materials of different expansion coefficients
US6507147B1 (en) * 2000-08-31 2003-01-14 Intevac, Inc. Unitary vacuum tube incorporating high voltage isolation
US20130167482A1 (en) * 2011-09-08 2013-07-04 Advanced Numicro Systems, Inc. Vacuum sealing process of a mems package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1512298A (en) * 1919-11-12 1924-10-21 Adolph Mueller Pipe coupling
US1783791A (en) * 1928-11-08 1930-12-02 New Departure Mfg Co Method of assembling antifriction bearings
US2342422A (en) * 1942-05-05 1944-02-22 Walworth Patents Inc High pressure joint
CH243668A (de) * 1944-04-29 1946-07-31 Sulzer Ag Aus einzelnen Scheiben zusammengefügter Trommelläufer und Verfahren zu dessen Herstellung.
US2763708A (en) * 1950-07-11 1956-09-18 Joseph B Brennan Closure, terminal and mounting constructions for electrical devices
US2701483A (en) * 1950-07-12 1955-02-08 Gen Electric Co Ltd Method of securing inserts in ductile metal members by pressure welding
US2754065A (en) * 1952-04-25 1956-07-10 Jesse E Hawley Railroad rail joint construction
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
BE546710A (zh) * 1955-06-08 1900-01-01
NL104068C (zh) * 1955-08-09
US2808543A (en) * 1956-01-30 1957-10-01 Hughes Aircraft Co Mounting means for semiconductor crystal body
BE563190A (zh) * 1956-09-10

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1228721B (de) * 1960-10-26 1966-11-17 Asea Ab Halbleiteranordnung mit einem gasdichten Gehaeuse
DE1210489B (de) * 1961-08-10 1966-02-10 Siemens Ag Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement
DE1237695B (de) * 1961-10-24 1967-03-30 Siemens Ag Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement
DE1218620B (de) * 1962-02-05 1966-06-08 Siemens Ag Anwendung des elektrischen Widerstandsloetens auf das vakuumdichte Verschliessen einer Halbleiteranordnung
DE1514473A1 (de) * 1965-06-05 1969-11-13 Siemens Ag Halbleiterbauelementeanordnung

Also Published As

Publication number Publication date
US3024299A (en) 1962-03-06
BE566767A (zh)
FR1194674A (fr) 1959-11-12
CH359789A (de) 1962-01-31
GB826823A (en) 1960-01-20

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