DE1072323B - - Google Patents
Info
- Publication number
- DE1072323B DE1072323B DENDAT1072323D DE1072323DA DE1072323B DE 1072323 B DE1072323 B DE 1072323B DE NDAT1072323 D DENDAT1072323 D DE NDAT1072323D DE 1072323D A DE1072323D A DE 1072323DA DE 1072323 B DE1072323 B DE 1072323B
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
- H01J5/22—Vacuum-tight joints between parts of vessel
- H01J5/28—Vacuum-tight joints between parts of vessel between conductive parts of vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
- H01J2893/0044—Direct connection between two metal elements, in particular via material a connecting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49938—Radially expanding part in cavity, aperture, or hollow body
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL359789X | 1957-04-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1072323B true DE1072323B (xx) |
Family
ID=19785356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DENDAT1072323D Pending DE1072323B (xx) | 1957-04-16 |
Country Status (6)
Country | Link |
---|---|
US (1) | US3024299A (xx) |
BE (1) | BE566767A (xx) |
CH (1) | CH359789A (xx) |
DE (1) | DE1072323B (xx) |
FR (1) | FR1194674A (xx) |
GB (1) | GB826823A (xx) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1210489B (de) * | 1961-08-10 | 1966-02-10 | Siemens Ag | Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement |
DE1218620B (de) * | 1962-02-05 | 1966-06-08 | Siemens Ag | Anwendung des elektrischen Widerstandsloetens auf das vakuumdichte Verschliessen einer Halbleiteranordnung |
DE1228721B (de) * | 1960-10-26 | 1966-11-17 | Asea Ab | Halbleiteranordnung mit einem gasdichten Gehaeuse |
DE1237695B (de) * | 1961-10-24 | 1967-03-30 | Siemens Ag | Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement |
DE1514473A1 (de) * | 1965-06-05 | 1969-11-13 | Siemens Ag | Halbleiterbauelementeanordnung |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3191268A (en) * | 1958-02-28 | 1965-06-29 | Gen Motors Corp | Process for encapsulating transistors |
US3125709A (en) * | 1960-10-17 | 1964-03-17 | Housing assembly | |
NL270996A (xx) * | 1960-11-09 | |||
NL132800C (xx) * | 1960-11-16 | |||
US3203083A (en) * | 1961-02-08 | 1965-08-31 | Texas Instruments Inc | Method of manufacturing a hermetically sealed semiconductor capsule |
US3197843A (en) * | 1961-05-19 | 1965-08-03 | Nippert Electric Products Comp | Method of forming a mount for semiconductors |
US3242555A (en) * | 1961-06-08 | 1966-03-29 | Gen Motors Corp | Method of making a semiconductor package |
US3217216A (en) * | 1962-07-12 | 1965-11-09 | Gianni A Dotto | Rotary capacitor apparatus |
US3249982A (en) * | 1963-01-07 | 1966-05-10 | Hughes Aircraft Co | Semiconductor diode and method of making same |
US3358152A (en) * | 1963-07-22 | 1967-12-12 | Nicholas G Alexakis | Temperature compensated transistor and means for controlling |
US3268779A (en) * | 1963-11-06 | 1966-08-23 | Int Rectifier Corp | Hermetically sealed semiconductor device |
US3422320A (en) * | 1965-12-23 | 1969-01-14 | Gen Motors Corp | Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices |
US3937383A (en) * | 1975-03-24 | 1976-02-10 | Continental Can Company, Inc. | High speed room temperature seam bonding of metal sheets |
US4037749A (en) * | 1976-03-15 | 1977-07-26 | Bell Telephone Laboratories, Incorporated | Hermetically sealed envelope and method of making the same |
GB2132601B (en) * | 1982-12-23 | 1986-08-20 | Ferranti Plc | Joining articles of materials of different expansion coefficients |
US6507147B1 (en) * | 2000-08-31 | 2003-01-14 | Intevac, Inc. | Unitary vacuum tube incorporating high voltage isolation |
US20130167482A1 (en) * | 2011-09-08 | 2013-07-04 | Advanced Numicro Systems, Inc. | Vacuum sealing process of a mems package |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1512298A (en) * | 1919-11-12 | 1924-10-21 | Adolph Mueller | Pipe coupling |
US1783791A (en) * | 1928-11-08 | 1930-12-02 | New Departure Mfg Co | Method of assembling antifriction bearings |
US2342422A (en) * | 1942-05-05 | 1944-02-22 | Walworth Patents Inc | High pressure joint |
CH243668A (de) * | 1944-04-29 | 1946-07-31 | Sulzer Ag | Aus einzelnen Scheiben zusammengefügter Trommelläufer und Verfahren zu dessen Herstellung. |
US2763708A (en) * | 1950-07-11 | 1956-09-18 | Joseph B Brennan | Closure, terminal and mounting constructions for electrical devices |
US2701483A (en) * | 1950-07-12 | 1955-02-08 | Gen Electric Co Ltd | Method of securing inserts in ductile metal members by pressure welding |
US2754065A (en) * | 1952-04-25 | 1956-07-10 | Jesse E Hawley | Railroad rail joint construction |
US2825014A (en) * | 1953-11-30 | 1958-02-25 | Philips Corp | Semi-conductor device |
BE546710A (xx) * | 1955-06-08 | 1900-01-01 | ||
NL209559A (xx) * | 1955-08-09 | |||
US2808543A (en) * | 1956-01-30 | 1957-10-01 | Hughes Aircraft Co | Mounting means for semiconductor crystal body |
BE563190A (xx) * | 1956-09-10 |
-
0
- DE DENDAT1072323D patent/DE1072323B/de active Pending
- BE BE566767D patent/BE566767A/xx unknown
-
1958
- 1958-03-26 US US725774A patent/US3024299A/en not_active Expired - Lifetime
- 1958-04-14 CH CH359789D patent/CH359789A/de unknown
- 1958-04-14 FR FR1194674D patent/FR1194674A/fr not_active Expired
- 1958-04-15 GB GB11944/58A patent/GB826823A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1228721B (de) * | 1960-10-26 | 1966-11-17 | Asea Ab | Halbleiteranordnung mit einem gasdichten Gehaeuse |
DE1210489B (de) * | 1961-08-10 | 1966-02-10 | Siemens Ag | Halbleiterbauelement mit einem in einem Gehaeuse gasdicht eingeschlossenen Halbleiterelement |
DE1237695B (de) * | 1961-10-24 | 1967-03-30 | Siemens Ag | Halbleiteranordnung mit einem in ein gasdichtes Gehaeuse eingeschlossenen Halbleiterelement |
DE1218620B (de) * | 1962-02-05 | 1966-06-08 | Siemens Ag | Anwendung des elektrischen Widerstandsloetens auf das vakuumdichte Verschliessen einer Halbleiteranordnung |
DE1514473A1 (de) * | 1965-06-05 | 1969-11-13 | Siemens Ag | Halbleiterbauelementeanordnung |
Also Published As
Publication number | Publication date |
---|---|
US3024299A (en) | 1962-03-06 |
GB826823A (en) | 1960-01-20 |
FR1194674A (fr) | 1959-11-12 |
CH359789A (de) | 1962-01-31 |
BE566767A (xx) |