DE10357822A1 - Schneidvorrichtung - Google Patents

Schneidvorrichtung Download PDF

Info

Publication number
DE10357822A1
DE10357822A1 DE10357822A DE10357822A DE10357822A1 DE 10357822 A1 DE10357822 A1 DE 10357822A1 DE 10357822 A DE10357822 A DE 10357822A DE 10357822 A DE10357822 A DE 10357822A DE 10357822 A1 DE10357822 A1 DE 10357822A1
Authority
DE
Germany
Prior art keywords
cutting
force
wire
cutting blade
determined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10357822A
Other languages
German (de)
English (en)
Inventor
Hans Jürgen Dr.-Ing. Hesse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hesse and Knipps GmbH
Original Assignee
Hesse and Knipps GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse and Knipps GmbH filed Critical Hesse and Knipps GmbH
Priority to DE10357822A priority Critical patent/DE10357822A1/de
Priority to EP04803474A priority patent/EP1701827A1/fr
Priority to PCT/EP2004/013745 priority patent/WO2005058562A1/fr
Priority to CNA2004800365217A priority patent/CN1890068A/zh
Publication of DE10357822A1 publication Critical patent/DE10357822A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Sawing (AREA)
DE10357822A 2003-12-09 2003-12-09 Schneidvorrichtung Withdrawn DE10357822A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE10357822A DE10357822A1 (de) 2003-12-09 2003-12-09 Schneidvorrichtung
EP04803474A EP1701827A1 (fr) 2003-12-09 2004-12-03 Appareil de coupage et controle de l'appareil de coupage
PCT/EP2004/013745 WO2005058562A1 (fr) 2003-12-09 2004-12-03 Dispositif de coupe et commande du dispositif de coupe
CNA2004800365217A CN1890068A (zh) 2003-12-09 2004-12-03 切割设备和切割设备的控制

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10357822A DE10357822A1 (de) 2003-12-09 2003-12-09 Schneidvorrichtung

Publications (1)

Publication Number Publication Date
DE10357822A1 true DE10357822A1 (de) 2005-07-07

Family

ID=34638585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10357822A Withdrawn DE10357822A1 (de) 2003-12-09 2003-12-09 Schneidvorrichtung

Country Status (4)

Country Link
EP (1) EP1701827A1 (fr)
CN (1) CN1890068A (fr)
DE (1) DE10357822A1 (fr)
WO (1) WO2005058562A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006049625A1 (de) * 2006-10-20 2008-04-24 Hesse & Knipps Gmbh Ultraschallbonder
CN102320052B (zh) * 2011-09-19 2013-10-02 中国大冢制药有限公司 组合盖切割装置
MX2016003690A (es) * 2013-09-20 2016-12-14 Gerber Tech Inc Aparato sensor de cuchilla para cortar material en hoja.
CN111590678B (zh) * 2020-05-22 2021-11-05 广东博智林机器人有限公司 一种墙纸裁切装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4016720A1 (de) * 1989-08-11 1991-02-14 Orthodyne Electronics Corp Verfahren und vorrichtung zum ultraschallbonden
DE19752319A1 (de) * 1996-11-27 1998-05-28 Orthodyne Electronics Corp Ultraschall-Drahtbondingvorrichtung mit einer Einrichtung zum Prüfen einer Bondverbindung und Verfahren zum Prüfen einer mittels eines Ultraschall-Drahtbondingwerkzeugs hergestellten Bondverbindung
WO2001037382A1 (fr) * 1999-11-16 2001-05-25 Tyco Electronics Logistics, Ag Matrice d'application pour ensemble de borne et fil
US20010045012A1 (en) * 1992-10-19 2001-11-29 Beaman Brian Samuel Angled flying lead wire bonding process
WO2002103871A1 (fr) * 2001-06-15 2002-12-27 Schleuniger Holding Ag Dispositif de traitement destine a des cables ou fils
DE10207498A1 (de) * 1999-11-05 2003-09-11 Orthodyne Electronics Corp Bondkopf für dicken Draht

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3048690A (en) * 1960-11-02 1962-08-07 Bell Telephone Labor Inc Bonding apparatus
US5365657A (en) * 1993-02-01 1994-11-22 Advanced Interconnection Technology Method and apparatus for cutting wire
DE50211351D1 (de) * 2002-04-12 2008-01-24 F & K Delvotek Bondtechnik Bonddraht-Schneidvorrichtung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4016720A1 (de) * 1989-08-11 1991-02-14 Orthodyne Electronics Corp Verfahren und vorrichtung zum ultraschallbonden
US20010045012A1 (en) * 1992-10-19 2001-11-29 Beaman Brian Samuel Angled flying lead wire bonding process
DE19752319A1 (de) * 1996-11-27 1998-05-28 Orthodyne Electronics Corp Ultraschall-Drahtbondingvorrichtung mit einer Einrichtung zum Prüfen einer Bondverbindung und Verfahren zum Prüfen einer mittels eines Ultraschall-Drahtbondingwerkzeugs hergestellten Bondverbindung
DE10207498A1 (de) * 1999-11-05 2003-09-11 Orthodyne Electronics Corp Bondkopf für dicken Draht
WO2001037382A1 (fr) * 1999-11-16 2001-05-25 Tyco Electronics Logistics, Ag Matrice d'application pour ensemble de borne et fil
WO2002103871A1 (fr) * 2001-06-15 2002-12-27 Schleuniger Holding Ag Dispositif de traitement destine a des cables ou fils

Also Published As

Publication number Publication date
EP1701827A1 (fr) 2006-09-20
WO2005058562A1 (fr) 2005-06-30
CN1890068A (zh) 2007-01-03

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8139 Disposal/non-payment of the annual fee