CN1890068A - 切割设备和切割设备的控制 - Google Patents
切割设备和切割设备的控制 Download PDFInfo
- Publication number
- CN1890068A CN1890068A CNA2004800365217A CN200480036521A CN1890068A CN 1890068 A CN1890068 A CN 1890068A CN A2004800365217 A CNA2004800365217 A CN A2004800365217A CN 200480036521 A CN200480036521 A CN 200480036521A CN 1890068 A CN1890068 A CN 1890068A
- Authority
- CN
- China
- Prior art keywords
- cutting
- cutting knife
- motion device
- main motion
- closing line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/086—Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2614—Means for mounting the cutting member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7855—Mechanical means, e.g. for severing, pressing, stamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Sawing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10357822A DE10357822A1 (de) | 2003-12-09 | 2003-12-09 | Schneidvorrichtung |
DE10357822.6 | 2003-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1890068A true CN1890068A (zh) | 2007-01-03 |
Family
ID=34638585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2004800365217A Pending CN1890068A (zh) | 2003-12-09 | 2004-12-03 | 切割设备和切割设备的控制 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1701827A1 (fr) |
CN (1) | CN1890068A (fr) |
DE (1) | DE10357822A1 (fr) |
WO (1) | WO2005058562A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106794588A (zh) * | 2013-09-20 | 2017-05-31 | 格伯技术公司 | 用于切割片材的刀具传感器设备 |
CN111590678A (zh) * | 2020-05-22 | 2020-08-28 | 广东博智林机器人有限公司 | 一种墙纸裁切装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006049625A1 (de) * | 2006-10-20 | 2008-04-24 | Hesse & Knipps Gmbh | Ultraschallbonder |
CN102320052B (zh) * | 2011-09-19 | 2013-10-02 | 中国大冢制药有限公司 | 组合盖切割装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3048690A (en) * | 1960-11-02 | 1962-08-07 | Bell Telephone Labor Inc | Bonding apparatus |
US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
US6295729B1 (en) * | 1992-10-19 | 2001-10-02 | International Business Machines Corporation | Angled flying lead wire bonding process |
US5365657A (en) * | 1993-02-01 | 1994-11-22 | Advanced Interconnection Technology | Method and apparatus for cutting wire |
US5894981A (en) * | 1996-11-27 | 1999-04-20 | Orthodyne Electronics Corporation | Integrated pull tester with an ultrasonic wire bonder |
US6439448B1 (en) * | 1999-11-05 | 2002-08-27 | Orthodyne Electronics Corporation | Large wire bonder head |
US6301777B1 (en) * | 1999-11-16 | 2001-10-16 | Autoliv Asp, Inc. | Applicator die for wire-to-terminal assembly |
WO2002103871A1 (fr) * | 2001-06-15 | 2002-12-27 | Schleuniger Holding Ag | Dispositif de traitement destine a des cables ou fils |
DE50211351D1 (de) * | 2002-04-12 | 2008-01-24 | F & K Delvotek Bondtechnik | Bonddraht-Schneidvorrichtung |
-
2003
- 2003-12-09 DE DE10357822A patent/DE10357822A1/de not_active Withdrawn
-
2004
- 2004-12-03 WO PCT/EP2004/013745 patent/WO2005058562A1/fr not_active Application Discontinuation
- 2004-12-03 CN CNA2004800365217A patent/CN1890068A/zh active Pending
- 2004-12-03 EP EP04803474A patent/EP1701827A1/fr not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106794588A (zh) * | 2013-09-20 | 2017-05-31 | 格伯技术公司 | 用于切割片材的刀具传感器设备 |
CN111590678A (zh) * | 2020-05-22 | 2020-08-28 | 广东博智林机器人有限公司 | 一种墙纸裁切装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1701827A1 (fr) | 2006-09-20 |
WO2005058562A1 (fr) | 2005-06-30 |
DE10357822A1 (de) | 2005-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |