DE10344841A1 - Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems - Google Patents

Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems Download PDF

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Publication number
DE10344841A1
DE10344841A1 DE2003144841 DE10344841A DE10344841A1 DE 10344841 A1 DE10344841 A1 DE 10344841A1 DE 2003144841 DE2003144841 DE 2003144841 DE 10344841 A DE10344841 A DE 10344841A DE 10344841 A1 DE10344841 A1 DE 10344841A1
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Prior art keywords
chip
integrated
component
connections
semiconducting
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DE2003144841
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English (en)
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DE10344841B4 (de
Inventor
Hubert Rothleitner
Leo Aichriedler
Michael Breunig
Udo John
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Infineon Technologies AG
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Infineon Technologies AG
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Priority to DE2003144841 priority Critical patent/DE10344841B4/de
Priority to US10/950,193 priority patent/US7348687B2/en
Publication of DE10344841A1 publication Critical patent/DE10344841A1/de
Application granted granted Critical
Publication of DE10344841B4 publication Critical patent/DE10344841B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
    • B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
    • B60R21/017—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents including arrangements for providing electric power to safety arrangements or their actuating means, e.g. to pyrotechnic fuses or electro-mechanic valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Protection Of Static Devices (AREA)

Abstract

Die vorliegende Erfindung betrifft eine Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems, die folgende Merkmale aufweist: DOLLAR A - wenigstens ein erstes Halbleiterelement (HS; HS1, HS2) mit einem Steueranschluss (G) und einem ersten und zweiten Lastanschluss (D, S) und wenigstens ein zweites Halbleiterbauelement (LS; LS1, LS2) mit einem Steueranschluss (G) und einem ersten und zweiten Lastanschluss (D, S), DOLLAR A - wenigstens eine erste und eine zweite Anschlussklemme (K2, K3; K21, K22, K31, K32) zum Anschließen einer Last in Reihe zu dem wenigstens einen ersten und wenigstens einen zweiten Halbleiterbauelement, wobei das wenigstens eine erste Halbleiterbauelement (HS, HS1, HS2) in wenigstens einem ersten Halbleiterchip (IC1; IC11, IC12) und das wenigstens eine zweite Halbleiterbauelement (LS; LS1, LS2) in einem zweiten Halbleiterchip (IC2) integriert ist, die in einem gemeinsamen Gehäuse (PA) untergebracht sind, aus dem die wenigstens eine erste Anschlussklemme (K2; K21, K22) und die wenigstens eine zweite Anschlussklemme (K3; K31, K32) herausgeführt sind.
DE2003144841 2003-09-26 2003-09-26 Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems Expired - Fee Related DE10344841B4 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE2003144841 DE10344841B4 (de) 2003-09-26 2003-09-26 Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems
US10/950,193 US7348687B2 (en) 2003-09-26 2004-09-24 Driving circuit for an ignition element of a passenger protection system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003144841 DE10344841B4 (de) 2003-09-26 2003-09-26 Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems

Publications (2)

Publication Number Publication Date
DE10344841A1 true DE10344841A1 (de) 2005-05-04
DE10344841B4 DE10344841B4 (de) 2010-02-25

Family

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DE2003144841 Expired - Fee Related DE10344841B4 (de) 2003-09-26 2003-09-26 Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems

Country Status (2)

Country Link
US (1) US7348687B2 (de)
DE (1) DE10344841B4 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005003245A1 (de) * 2005-01-24 2006-08-10 Infineon Technologies Ag Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems
EP1767409A1 (de) * 2005-09-21 2007-03-28 Robert Bosch Gmbh Steuergerät zur Ansteuerung von Personenschutzmitteln
DE102006017579B3 (de) * 2006-04-13 2007-05-24 Infineon Technologies Ag Ansteuerschaltung für ein Zündelement eines Sicherheitssystems
WO2008139276A1 (en) * 2007-05-11 2008-11-20 Freescale Semiconductor, Inc. Digital squib driver circuit
DE102008040158B4 (de) 2008-07-03 2019-05-02 Robert Bosch Gmbh Verfahren und Steuergerät zur Ansteuerung von Personenschutzmitteln für ein Fahrzeug

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WO2007009482A1 (en) * 2005-07-18 2007-01-25 Freescale Semiconductor, Inc. Switch arrangement, integrated circuit, activation system
JP2011082449A (ja) 2009-10-09 2011-04-21 Elpida Memory Inc 半導体装置
JP5593053B2 (ja) * 2009-10-09 2014-09-17 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
US8138529B2 (en) 2009-11-02 2012-03-20 Transphorm Inc. Package configurations for low EMI circuits
US8648643B2 (en) 2012-02-24 2014-02-11 Transphorm Inc. Semiconductor power modules and devices
US9891640B2 (en) * 2013-06-14 2018-02-13 Infineon Technologies Ag Sensing element for semiconductor
US9590494B1 (en) 2014-07-17 2017-03-07 Transphorm Inc. Bridgeless power factor correction circuits
US10200030B2 (en) 2015-03-13 2019-02-05 Transphorm Inc. Paralleling of switching devices for high power circuits
US10431507B2 (en) * 2015-05-11 2019-10-01 Robert Bosch Gmbh Contact-via chain as corrosion detector
US10128173B2 (en) * 2016-10-06 2018-11-13 Infineon Technologies Americas Corp. Common contact leadframe for multiphase applications
US10056362B2 (en) 2016-10-06 2018-08-21 Infineon Technologies Americas Corp. Multi-phase power converter with common connections
US10147703B2 (en) * 2017-03-24 2018-12-04 Infineon Technologies Ag Semiconductor package for multiphase circuitry device
US10319648B2 (en) 2017-04-17 2019-06-11 Transphorm Inc. Conditions for burn-in of high power semiconductors
US11040638B2 (en) 2018-05-04 2021-06-22 Lear Corporation Track assembly
US10759308B2 (en) 2018-05-04 2020-09-01 Lear Corporation Support assembly
US10882420B2 (en) 2019-03-08 2021-01-05 Lear Corporation Track assembly
US11358497B2 (en) 2018-05-04 2022-06-14 Lear Corporation Track system having a rolling member
US10926667B2 (en) 2018-05-04 2021-02-23 Lear Corporation Track assembly
US11040639B2 (en) 2018-05-04 2021-06-22 Lear Corporation Track assembly
US10906431B2 (en) 2018-05-04 2021-02-02 Lear Corporation Track assembly
US11225201B2 (en) 2018-12-10 2022-01-18 Lear Corporation Track assembly
US11440482B2 (en) 2018-12-10 2022-09-13 Lear Corporation Track assembly
US11117538B2 (en) 2018-12-17 2021-09-14 Lear Corporation Electrical assembly
US11613220B2 (en) 2018-12-17 2023-03-28 Lear Corporation Electrical assembly
US10855037B2 (en) 2018-12-17 2020-12-01 Lear Corporation Support assembly with a support member and a track assembly
US10950977B2 (en) 2018-12-18 2021-03-16 Lear Corporation Track assembly for a vehicle component
US11975665B2 (en) 2019-02-20 2024-05-07 Lear Corporation Electrical assembly
US11040653B2 (en) 2019-02-25 2021-06-22 Lear Corporation Track assembly
US11807142B2 (en) 2019-03-06 2023-11-07 Lear Corporation Electrical track assembly
US11299075B2 (en) 2019-03-06 2022-04-12 Lear Corporation Electrical assembly
US11323114B2 (en) 2019-10-04 2022-05-03 Lear Corporation Electrical system
US11634101B2 (en) 2019-10-04 2023-04-25 Lear Corporation Removable component system
US11463083B2 (en) 2019-10-04 2022-10-04 Lear Corporation Electrical system
US12044301B2 (en) 2020-02-21 2024-07-23 Lear Corporation Track system with a support member
US11505141B2 (en) 2020-10-23 2022-11-22 Lear Corporation Electrical system with track assembly and support assembly

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WO1997032757A1 (de) * 1996-03-08 1997-09-12 Siemens Aktiengesellschaft Anordnung zum steuern eines rückhaltemittels, insbesondere für ein kraftfahrzeug
DE19815391A1 (de) * 1997-04-04 1998-10-08 Denso Corp Diagnosevorrichtung für Fahrgastschutzsysteme
DE19943146C1 (de) * 1999-09-09 2001-01-25 Infineon Technologies Ag Brückenschaltung zum Schalten hoher Ströme
DE10109620C1 (de) * 2001-02-28 2002-06-13 Bosch Gmbh Robert Vorrichtung zur Ansteuerung von Zündkreisen

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005003245A1 (de) * 2005-01-24 2006-08-10 Infineon Technologies Ag Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems
DE102005003245B4 (de) * 2005-01-24 2008-05-29 Infineon Technologies Ag Ansteuerschaltung für ein Zündelement eines Insassenschutzsystems
US7710704B2 (en) 2005-01-24 2010-05-04 Infineon Technolgies Ag Drive circuit for a firing element of an occupant protection system
EP1767409A1 (de) * 2005-09-21 2007-03-28 Robert Bosch Gmbh Steuergerät zur Ansteuerung von Personenschutzmitteln
DE102006017579B3 (de) * 2006-04-13 2007-05-24 Infineon Technologies Ag Ansteuerschaltung für ein Zündelement eines Sicherheitssystems
WO2008139276A1 (en) * 2007-05-11 2008-11-20 Freescale Semiconductor, Inc. Digital squib driver circuit
US8203822B2 (en) 2007-05-11 2012-06-19 Freescale Semiconductor, Inc. Digital squib driver circuit
DE102008040158B4 (de) 2008-07-03 2019-05-02 Robert Bosch Gmbh Verfahren und Steuergerät zur Ansteuerung von Personenschutzmitteln für ein Fahrzeug

Also Published As

Publication number Publication date
US7348687B2 (en) 2008-03-25
DE10344841B4 (de) 2010-02-25
US20050127755A1 (en) 2005-06-16

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee