DE102021212394A1 - OPTICAL SYSTEM, LITHOGRAPHY EQUIPMENT AND PROCESS - Google Patents

Abstract

An optical system, comprising: a plurality of optical components (101) for guiding radiation (16) in the optical system (100), a plurality N1 of arrays (111-114), with N1 > 2, each of the N1 arrays (111 - 114) comprises at least one actuator/sensor device (102), which is assigned to one of the optical components (101), and a number N2 of control units (130, 130A, 130B) for controlling the plurality N1 of arrangements (111 - 114), with N2 > 1, wherein each of the N2 control units (130, 130A, 130B) is assigned at least two of the N1 arrangements (111 - 114), and wherein an interface (140) for electrically coupling the respective control unit (130, 130A, 130B) with the arrangements (111 - 114) assigned to the drive unit (130, 130A, 130B) for transmitting respective electrical signals between the drive unit (130, 130A, 130B) and the respective devices assigned to the drive unit (130, 130A, 130B). Arrangements (111 - 114) are provided, the respective electrical signals comprising a data signal and/or electrical energy for operating the respective arrangement (111 - 114), and the interface (140) for each of the control units (130, 130A, 130B) associated arrangements (111 - 114) has a respective bundle (B1 - B6) of electrical lines.

Description

The present invention relates to an optical system, a lithography system with such an optical system, and a method for producing such an optical system and a method for operating such an optical system.

Microlithography is used to produce microstructured components such as integrated circuits. The microlithography process is carried out using a lithography system which has an illumination system and a projection system. The image of a mask (reticle) illuminated by the illumination system is projected by the projection system onto a substrate coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, for example a silicon wafer, in order to place the mask structure on the light-sensitive coating of the substrate transferred to.

Driven by the striving for ever smaller structures in the manufacture of integrated circuits, EUV lithography systems are currently being developed which use light with a wavelength in the range from 0.1 nm to 30 nm, in particular 13.5 nm. Since most materials absorb light of this wavelength, reflective optics, ie mirrors, must be used in such EUV lithography systems instead of—as before—refractive optics, ie lenses.

The mirrors can B. on a support frame (engl .: force frame) and designed to be at least partially manipulated or tilted in order to allow a movement of a respective mirror in up to six degrees of freedom and thus a highly precise positioning of the mirrors to each other, especially in the pm range . Thus, changes in the optical properties that occur during operation of the lithography system, e.g. B. due to thermal influences are corrected.

To move the mirrors, in particular in the six degrees of freedom, these actuators are assigned, which are controlled via a control loop. A device for monitoring the tilting angle of a respective mirror is provided as part of the control loop.

For example from the WO 2009/100856 A1 a facet mirror for a projection exposure system of a lithography system is known, which has a multiplicity of individually displaceable individual mirrors. In order to ensure the optical quality of a projection exposure system, a very precise positioning of the displaceable individual mirrors is necessary.

To position the displaceable individual mirrors, actuator devices for displacing the individual mirrors and sensor devices for determining the positions of the individual mirrors are used.

A central control device arranged in the vacuum housing of the lithography system is used to control the actuator devices and the sensor devices. A disadvantage of the central control device is that failure of this one central control device causes failure of the entire system. Due to the arrangement of the central control device in the vacuum housing of the lithography system, the repair time for such a single error is also very long.

From the DE 10 2015 224 742 B4 is an optical system with a tree-like structure electronics, which has several identical subsystems, known. A respective subsystem has a limited range of functions, so that if the subsystem fails, only the relevant part of the optical system is affected. A subsystem is, for example, an individual actuator/sensor device, a driver circuit for controlling a plurality of actuator/sensor devices or also a control circuit for controlling a plurality of driver circuits. This means that the optical system can continue to be operated despite the failure. The electronic structure of the optical system can also be described as modular. For reasons of space, interfaces between the hierarchical subsystems, via which control signals, data and electrical power are transmitted, are often designed as shared hardware. This means that several identical subsystems share a single interface, for example. This can mean that an error in the interface can lead to the failure of several subsystems at the same time.

Against this background, it is an object of the present invention to provide an improved optical system.

• einer Mehrzahl von optischen Bauelementen zur Führung von Strahlung in dem optischen System,
• einer Mehrzahl N1 von Anordnungen, mit N1 > 2, wobei jede der N1 Anordnungen zumindest eine Aktor-/Sensor-Einrichtung umfasst, welche einem der optischen Bauelemente zugeordnet ist, und
• einer Anzahl N2 von Ansteuereinheiten zum Ansteuern der Mehrzahl N1 von Anordnungen, mit N2 > 1, wobei jeder der N2 Ansteuereinheiten zumindest zwei der N1 Anordnungen zugeordnet sind, und wobei eine Schnittstelle zum elektrischen Koppeln der jeweiligen Ansteuereinheit mit den der Ansteuereinheit zugeordneten Anordnungen zum Übertragen jeweiliger elektrischer Signale zwischen der Ansteuereinheit und den jeweiligen der Ansteuereinheit zugeordneten Anordnungen vorgesehen ist, wobei die jeweiligen elektrischen Signale ein Datensignal und/oder elektrische Energie zum Betrieb der jeweiligen Anordnung umfassen, und wobei die Schnittstelle für jede der der Ansteuereinheit zugeordneten Anordnungen ein jeweiliges Bündel von elektrischen Leitungen aufweist.

Accordingly, an optical system is proposed with:

• a plurality of optical components for guiding radiation in the optical system,
• a plurality N1 of arrangements, with N1 > 2, each of the N1 arrangements comprising at least one actuator/sensor device which is assigned to one of the optical components, and
• a number N2 of drive units for driving the plurality N1 of arrangements, with N2 > 1, with each of the N2 drive units being assigned at least two of the N1 arrangements, and with an interface for electrically coupling the respective drive unit with the arrangements assigned to the drive unit for transmitting respective electrical signals is provided between the control unit and the respective arrangements assigned to the control unit, wherein the respective electrical signals comprise a data signal and/or electrical energy for operating the respective arrangement, and the interface for each of the arrangements assigned to the control unit comprises a respective bundle of electrical has lines.

This optical system has the advantage that the modularity present in the arrangements and control units is also present at the interface level, ie the level of signal transmission between individual modules. Dedicated electrical lines are therefore available for each arrangement, via which the respective arrangement is connected to the control unit. This has the advantage over conventional optical systems in which, for example, signal and/or operating voltage lines are shared by a number of arrangements (e.g. in a bus system) that if a line is defective, not a number of arrangements are affected by the defect, only the arrangement in whose bundle of electrical lines the defect occurred. It can also be said that a dedicated bundle of electrical lines is provided for each arrangement. With four associated arrangements, for example, the interface also includes four separate bundles of electrical lines. If a defect occurs in one of the bundles, then this only affects the arrangement that is coupled to the control unit via the affected bundle.

The optical system thus offers the advantage that a defect in the signal transmission path provided by the interface does not paralyze the entire optical system, so that it has to be serviced, but the optical system can continue to be operated despite such a defect, for example with a partially restricted range of functions. Expensive downtime and time-consuming maintenance of the optical system can thus be avoided.

The optical system is in particular a multi-mirror system, such as a multi-mirror arrangement or a micro-mirror arrangement (MMA: micro-mirror array) or a lithography system.

The arrangement with a number of actuator/sensor devices can also be referred to as a group of actuator/sensor devices.

The optical components can be, for example, mirrors, in particular micromirrors, i.e. mirrors with a side length of less than 1 mm, or lenses or optical gratings and/or filters. A respective optical component is in particular displaceable. A respective mirror or micromirror can in particular be part of a multi-mirror arrangement or a micromirror arrangement. Such an arrangement can comprise more than 100, in particular more than 1,000, in particular more than 10,000, particularly preferably more than 100,000 such mirrors. In particular, they can be mirrors for reflecting EUV radiation.

The fact that the optical components are set up for guiding radiation in the optical system means in particular that the respective optical component is set up for manipulating the radiation, in particular by deflecting or deflecting the radiation by means of reflection or refraction. The respective optical component can also change or influence other properties of the radiation, such as a polarization, a phase and/or a wavelength.

The optical system is preferably projection optics of the projection exposure system. However, the optical system can also be an illumination system. The projection exposure system can be an EUV lithography system. EUV stands for "Extreme Ultraviolet" and designates a working light wavelength between 0.1 nm and 30 nm. The projection exposure system can also be a DUV lithography system. DUV stands for "Deep Ultraviolet" and describes a working light wavelength between 30 nm and 250 nm.

The optical system can also be a component of a superordinate optical system, such as a beam shaping and lighting system of a lithography system, for example the optical system is designed as an MMA module that is arranged in the beam shaping and lighting system. In this case, the optical system is arranged in particular in a chamber that can be evacuated or in a vacuum housing.

The control unit can be implemented in terms of hardware. In a hardware implementation, the control unit as a device or as part of a device, for example be designed as a computer or as a microprocessor or as a control computer or as an embedded system.

The interface for electrically coupling the drive unit to the multiple arrangements associated with the drive unit comprises a plurality of bundles of electrical lines. In particular, a dedicated bundle is provided for each arrangement. A respective bundle of electrical lines includes a plurality of electrical lines via which electrical signals can be transmitted from the control unit to the arrangement or vice versa. In the present case, the term electrical signals is understood to mean digital or also analog electrical signals, with an operating voltage, by means of which electrical energy is provided for the operation of the arrangement, also representing an electrical signal. The electrical signal can in particular include a data signal, which can include a control signal for controlling the arrangement, in particular the actuator/sensor device, or also a measurement data signal from the actuator/sensor device.

The electrical signals are provided by the control unit individually for each of the arrangements and are transmitted via the interface. The electrical lines run separately along the entire signal transmission path from the control unit to the respective arrangement, so that there is a strict separation of the electrical signals. The signal transmission in a first bundle thus remains unaffected by the signal transmission in a second bundle; in particular, a defect in a specific bundle of electrical lines is limited to the specific bundle and has no effect on other bundles.

The interface thus includes any section of the signal transmission path between the control unit and the respective arrangement. If, for example, the drive unit includes a processor for determining individual drive signals for the arrangements, then the signal transmission path begins at the processor, which outputs the individual drive signals. This means that the respective electrical line, which transmits the respective control signal, begins at the processor and from here runs separately from other electrical lines, even if the respective electrical line runs in sections on a circuit board of the control unit. The interface therefore not only includes a section that runs from an output of the control unit to an input of a respective arrangement, but can also include sections within the control unit and/or the respective arrangement.

According to one embodiment of the optical system, a respective bundle of electrical lines is set up for transmitting the electrical signals exclusively from the control unit to the arrangement coupled by means of the bundle.

This means that only electrical signals can be transmitted via a specific bundle to the arrangement coupled via the specific bundle.

According to a further embodiment of the optical system, the N1 arrangements have the same structure and the bundles of the interface include the same number of electrical lines for each of the arrangements assigned to the drive unit.

The fact that the N1 arrangements have the same structure means that they are modules of the same type, in particular with the same electrical and electronic components and in the same circuitry. Furthermore, each of the arrangements has the same range of functions. Thus, electrical signals of the same type are necessary for driving each arrangement, for example the same operating voltage and control signals of the same type (which, however, can differ between the different arrangements due to their respective information). Each arrangement can therefore be connected via a bundle of electrical lines of the same type, in particular bundles with the same number of electrical lines and the same properties, such as a cross section and/or a load limit, of the electrical lines. It can also be said that each bundle includes corresponding electrical lines.

It should be noted that, despite the same structure, the arrangements can differ due to different settings, such as switch positions (jumpers) or the like. Furthermore, a mechanical structure of the arrangements can be different, for example a spatial arrangement of electrical or electronic components can be different.

According to a further embodiment of the optical system, a respective bundle of electrical lines comprises a number of operating voltage lines and a number of data signal lines.

The number of operating voltage lines is preferably two, three, four, or five, the number depending on how many different voltages for the operation of the respective arrangement tion are needed. The number can also be greater than five.

According to a further embodiment of the optical system, the interface comprises a printed circuit board with a number of separate electrical levels and the electrical lines of a respective bundle are designed as conductor tracks on the printed circuit board, with the respective bundle of electrical lines being arranged in a respective level.

The printed circuit board can in particular be a printed circuit board of the control unit and/or one of the arrangements. Sections of the printed circuit board can include a flexible printed circuit board. The separate electrical levels can also be referred to as circuit board layers.

A separate circuit board layer can be assigned to each bundle. For example, the control unit is set up to control four arrangements. The interface then includes four bundles of electrical lines that run from the control unit to the respective arrangement. A printed circuit board of the control unit and/or a printed circuit board integrating the four arrangements then comprises, for example, four printed circuit board layers for the four bundles of electrical lines.

The control unit and the arrangements can be arranged on a common printed circuit board.

According to a further embodiment of the optical system, the interface comprises a printed circuit board and the electrical lines of the respective bundle are designed as conductor tracks on the printed circuit board, and a distance between the conductor tracks of a first bundle and the conductor tracks of a second bundle is greater than a distance between two conductor tracks is within a bundle.

The distance between two conductor tracks of different bundles is in particular at least twice, preferably three times, more preferably four times, five times and up to ten times the distance between two conductor tracks within a bundle. The greater the spacing, the greater the separation between bundles, reducing the likelihood of crosstalk. However, this increases the space requirement of the bundles on the printed circuit board.

According to a further embodiment of the optical system, the interface has a separate plug connector for each arrangement assigned to the control unit, the respective separate plug connector being set up for electrically connecting the number of electrical lines of the bundle between the control unit and the arrangement.

In particular, the connector comprises a plug and a socket, which can be coupled to one another and can be separated from one another.

For example, the control unit comprises a plug (or a socket) for each associated arrangement, which is set up for connection to a socket (or a plug) of a connecting cable, which can be designed as a flexible printed circuit board, the connecting cable being coupled to the respective arrangement is or can be coupled with it. In particular, the connecting cable includes the same number of electrical lines as the respective plug connector.

According to a further embodiment of the optical system, the interface has a connector that is common to a number of arrangements assigned to the control unit for electrically connecting the electrical lines of the number of bundles between the control unit and the number of arrangements, the common connector having a number K of contact pins, where K is greater than or equal to the sum of all electrical lines comprised by the plurality of bundles, and where
a distance between two adjacent contact pins is greater than a length of a respective contact pin, and/or
a pin assignment of the plug connector is such that an unassigned contact pin and/or a contact pin with a neutral reference potential is arranged between two contact pins which are assigned to electrical lines of different bundles.

In this embodiment, space can be saved on a circuit board of the control unit and/or a circuit board with multiple arrangements compared to separate plug connectors for each bundle.

A contact pin is in particular a metallic pin that is set up to establish an electrical connection with the lowest possible contact resistance. For this purpose, the contact pin is contacted by a corresponding receptacle when the plug is connected to the socket of the connector. The receptacle is preferably set up to clamp the contact pin.

If the distance between two contact pins is chosen to be greater than the length of a contact pin, a bent or kinked ter contact pin do not create a short circuit with another contact pin. The distance is preferably selected to be greater than twice the length of a contact pin.

The neutral reference potential is, for example, a ground potential, but can also be another specific potential that is defined as a neutral reference potential within the optical system.

According to a further embodiment of the optical system, the number of control units is N2 > 2 and the N2 control units have the same structure. Furthermore, the optical system has a number N3 of central control units for controlling the N2 control units, with N3 > 1, with each central control unit being assigned at least two of the N2 control units, and with a further interface for electrically coupling the respective central control unit to the assigned Control units for transmitting electrical signals between the central control unit and the control units have a bundle of electrical lines for each of the control units assigned to the central control unit, the bundles of the further interface for each of the control units assigned to the central control unit each comprising the same number of electrical lines.

In this embodiment, the central control unit is set up to control a plurality of control units, which are each set up to control a plurality of arrangements. For example, the central control unit is a central control computer that determines the target positions of the respective actuators of the arrangements and outputs them to the respective control unit. A respective control unit comprises in particular a driver circuit which drives the respective actuator or the respective actuators of an arrangement. It can also be said that the system is divided into several hierarchically ordered levels, with the central control units forming a higher level, the control units forming a subordinate level, and the arrangements forming a further level subordinate to the control units. According to this concept, the optical system can be expanded by further levels, for example by a level that is higher than the central control units.

For example, a central control unit, four control units and four arrangements per control unit, each with two actuator/sensor devices, are provided. This means that a total of 32 actuator/sensor devices in 16 arrangements can be controlled by the central control unit. The central control unit is connected to the four control units, for example via the further interface, by means of four bundles of electrical lines, one bundle being present for each control unit. Each drive unit is connected to a respective bundle of electrical lines with the four assemblies associated with the respective drive unit. A respective bundle of electrical lines, which connects the control unit to the respective arrangement, can in this case include separate lines for the two actuator/sensor devices of the arrangement.

A defect in one of the bundles from the central control unit to the respective control unit would therefore only lead to a failure of one control unit instead of a failure of all control units if they are connected to the central control unit via a common electrical line.

It should be noted that the central control unit and the control units can be arranged on a common circuit board or printed circuit board. In addition, all or some of the assemblies may also be located on the circuit board.

In embodiments, the optical system is designed as a multi-mirror arrangement comprising a plurality N4 of mirrors, with at least one actuator/sensor device being assigned to each of the N4 mirrors (with N4>2).

According to a further embodiment of the optical system, the central drive unit (with N3=1), the N2 drive units and the N1 devices are connected in a tree structure.

The tree structure is based in particular on a rooted tree, in which the central control unit forms the root, the control units form the branches and the arrangements or the actuator/sensor devices form the leaves.

The tree structure advantageously results in a direct connection and thus low latency times between the central control units and the control units and between the control units and the arrangements with their actuator/sensor devices.

Furthermore, due to the tree structure, if there is a defect in a certain part within the tree structure, only the downstream parts are affected by the defect. Elements of the same priority, for example two arrangements or two Control units cannot influence each other.

According to a further embodiment of the optical system, the actuator/sensor device is designed as an actuator device for displacing the optical component, as a sensor device for determining a position of the optical component or as an actuator and sensor device for displacing the optical component and designed to determine a position of the optical component.

A respective actuator is designed, for example, as a Lorenz actuator or an electrostrictive actuator. A respective sensor is designed, for example, as an eddy current sensor, an electrostrictive sensor or an optical sensor.

According to a second aspect, a lithography system is proposed which includes an optical system according to the first aspect.

The lithography system can include multiple optical systems according to the first aspect. A central control device can be provided, which is set up to control the multiple optical systems. A respective interface between higher-level elements of the lithography system and downstream elements of the lithography system can each be designed as explained with reference to the optical system.

The lithography system can include a beam shaping and illumination system and can include one or more evacuable chambers or vacuum housings. During operation of the lithography system, this chamber that can be evacuated can be evacuated in particular to a pressure of less than 50 Pa, in particular less than 20 Pa, in particular less than 10 Pa, in particular less than 5 Pa. In this case, this pressure indicates in particular the partial pressure of hydrogen in the evacuatable chamber. The beam shaping and illumination system includes in particular a radiation source, for example an EUV radiation source with emitted useful radiation in the range between 0.1 nm and 30 nm, preferably between 4 and 6 nm. It can be a plasma source, for example a GDPP source (Gas Discharge Produced Plasma) or an LPP (Laser-Produced Plasma) source. Other EUV radiation sources, for example based on a synchronous tone or on a free electron laser (Free Electron Laser, FEL), are also possible. The radiation generated by the radiation source can include high-energy photons. In particular, high-energy photons from the radiation source, in particular EUV photons, can lead to the generation of a plasma, in particular a hydrogen plasma. Alternatively, argon (Ar) or helium (He) can be used as a purge gas. Oxygen (O) and nitrogen (N), for example, can then be used as admixtures.

1. a) Bereitstellen Mehrzahl von optischen Bauelementen zur Führung von Strahlung in dem optischen System,
2. b) Bereitstellen einer Mehrzahl N1 von Anordnungen, mit N1 > 2, wobei jede der N1 Anordnungen zumindest eine Aktor-/Sensor-Einrichtung umfasst,
3. c) Zuordnen der Aktor-/Sensor-Einrichtungen der N1 Anordnungen zu den optischen Bauelementen,
4. d) Bereitstellen einer Anzahl N2 von Ansteuereinheiten zum Ansteuern der Anzahl N1 von Anordnungen, mit N2 > 1,
5. e) Zuordnen der N1 Anordnungen zu den N2 Ansteuereinheiten, und
6. f) Koppeln der N1 Anordnungen mit den N2 Ansteuereinheiten zum Übertragen elektrischer Signale zwischen der jeweiligen Ansteuereinheit und den der Ansteuereinheit zugeordneten Anordnungen, wobei für jede der N1 Anordnungen ein jeweiliges Bündel von elektrischen Leitungen verwendet wird.

According to a third aspect, a method for producing an optical system for a lithography system is proposed. The procedure includes the steps:

1. a) providing a plurality of optical components for guiding radiation in the optical system,
2. b) providing a plurality N1 of arrangements, with N1 > 2, each of the N1 arrangements comprising at least one actuator/sensor device,
3. c) assignment of the actuator/sensor devices of the N1 arrangements to the optical components,
4. d) providing a number N2 of drive units for driving the number N1 of arrangements, with N2 > 1,
5. e) associating the N1 arrays with the N2 drive units, and
6. f) coupling the N1 arrays to the N2 drive units for transmitting electrical signals between the respective drive unit and the arrays associated with the drive unit, using a respective bundle of electrical wires for each of the N1 arrays.

In particular, the optical system produced in this way has the properties of the optical system according to the first aspect. The embodiments and features described for the optical system according to the first aspect apply correspondingly to the proposed production method and vice versa.

The provision of the respective arrangement and/or that of the respective control unit includes, for example, the production of the respective arrangement and/or that of the respective control unit, with the electrical lines required for step f) already being provided here, for example corresponding conductor tracks are integrated on a printed circuit board .

If the control unit and an arrangement are arranged on separate printed circuit boards and/or spatially separated from one another, step f) can also include connecting a plug to a socket of a plug connector that is designed to connect the electrical lines of the bundle.

• Übertragen eines ersten elektrischen Signals von einer Ansteuereinheit an eine erste Anordnung der Mehrzahl N1 von Anordnungen mittels der Schnittstelle, wobei das erste elektrische Signal ausschließlich über ein erstes Bündel von elektrischen Leitungen der Schnittstelle übertragen wird, und
• Übertragen eines zweiten elektrischen Signals von der Ansteuereinheit an eine zweite Anordnung der Mehrzahl N1 von Anordnungen mittels der Schnittstelle, wobei das zweite elektrische Signal ausschließlich über ein zweites Bündel von elektrischen Leitungen der Schnittstelle übertragen wird.

According to a further aspect, a method for operating an optical system according to the first aspect is proposed. The procedure includes the steps:

• transmitting a first electrical signal from a drive unit to a first arrangement of the plurality N1 of arrangements by means of the interface, the first electrical signal being transmitted exclusively via a first bundle of electrical lines of the interface, and
• Transmission of a second electrical signal from the drive unit to a second arrangement of the plurality N1 of arrangements by means of the interface, the second electrical signal being transmitted exclusively via a second bundle of electrical lines of the interface.

This method has the advantage that the first and the second electrical signal are transmitted via electrical lines of the respective bundle that are physically separate from one another, which is why a mutual influencing of the signal transmission is avoided. In particular, an effect of a failure and/or defect in a bundle or an electrical line in a bundle is limited to the arrangement connected via the affected bundle. All other arrangements can continue to be operated without interference or errors due to the physically separate signal routing.

The embodiments and features described for the optical system according to the first aspect apply correspondingly to the proposed operating method and vice versa.

• Erfassen eines elektrischen Defekts in einem bestimmten der mehreren Bündel von elektrischen Leitungen,
• Unterbrechen der Übertragung des elektrischen Signals über das bestimmte Bündel von elektrischen Leitungen, und
• Fortsetzen der Übertragung der jeweiligen elektrischen Signale über die mehreren Bündel von elektrischen Leitungen ohne das bestimmte Bündel von elektrischen Leitungen.

According to one embodiment of the method, a respective electrical signal is transmitted to a respective arrangement via a plurality of bundles. In addition, the following steps are carried out:

• detecting an electrical defect in a specific one of the multiple bundles of electrical lines,
• interrupting transmission of the electrical signal over the particular bundle of electrical wires, and
• continuing transmission of the respective electrical signals over the plurality of bundles of electrical wires without the particular bundle of electrical wires.

For example, the control unit includes logic or a sensor that is set up to monitor and/or check the signal transmission via a respective bundle of electrical lines. If an error in the signal transmission, in particular a short circuit between two electrical lines of a bundle or a short circuit between an electrical line and another component and/or conductive element of the control unit and/or arrangement, is detected, the signal transmission via the affected bundle is interrupted. This can lead to a failure of the arrangement controlled via the affected bundle.

In embodiments, redundant signal transmission paths can be provided, for example each bundle can include at least one additional electrical line that is initially not connected, which can take over the function of the failed electrical line if another electrical line in the bundle fails. This means that after the failure of another electrical line in the bundle, the respective additional electrical line is used to transmit the electrical signals that were previously transmitted via the failed electrical line.

On the one hand, this protects the electronics of the control unit and/or the arrangement, and on the other hand, this ensures that the other arrangements that are controlled by the control unit can continue to be operated error-free and trouble-free. For example, a multiplex unit is provided, which is set up for selectively connecting the respective additional electrical line.

"A" is not necessarily to be understood as being limited to exactly one element. Rather, a plurality of elements, such as two, three or more, can also be provided. Any other count word used here should also not be understood to mean that there is a restriction to precisely the stated number of elements. Rather, numerical deviations upwards and downwards are possible, unless otherwise stated.

Further possible implementations of the invention also include combinations of features or embodiments described above or below with regard to the exemplary embodiments that are not explicitly mentioned. The person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the invention.

• 1 zeigt einen schematischen Meridionalschnitt einer Projektionsbelichtungsanlage für die EUV-Projektionslithographie;
• 2 zeigt ein schematisches erstes Ausführungsbeispiel eines optisches Systems;
• 3 zeigt ein schematisches zweites Ausführungsbeispiel eines optisches Systems;
• 4 zeigt ein schematisches erstes Ausführungsbeispiel für eine Anordnung von Leitungen in einer Leiterplatte;
• 5 zeigt ein schematisches Ausführungsbeispiel für eine Anordnung von Kontaktpins eines Steckverbinders;
• 6 zeigt ein schematisches Ausführungsbeispiel für einen Verbindungsstecker,
• 7 zeigt ein schematisches zweites Ausführungsbeispiel für eine Anordnung von Leitungen in einer Leiterplatte;
• 8 zeigt ein schematisches drittes Ausführungsbeispiel eines optisches Systems;
• 9 zeigt eine schematische Ansicht eines Ausführungsbeispiels für ein optisches System, welches mehrere strukturelle und logische Ebenen aufweist;
• 10 zeigt ein schematisches Blockschaltbild eines Ausführungsbeispiels für ein Verfahren zum Herstellen eines optischen Systems; und
• 11 zeigt ein schematisches Blockschaltbild eines Ausführungsbeispiels für ein Verfahren zum Betreiben eines optischen Systems.

Further advantageous refinements and aspects of the invention are the subject matter of the dependent claims and of the exemplary embodiments of the invention described below. The invention is explained in more detail below on the basis of preferred embodiments with reference to the enclosed figures.

• 1 shows a schematic meridional section of a projection exposure system for EUV projection lithography;
• 2 shows a schematic first exemplary embodiment of an optical system;
• 3 shows a schematic second embodiment of an optical system;
• 4 shows a schematic first exemplary embodiment of an arrangement of lines in a printed circuit board;
• 5 shows a schematic embodiment of an arrangement of contact pins of a connector;
• 6 shows a schematic embodiment of a connector,
• 7 shows a schematic second exemplary embodiment of an arrangement of lines in a printed circuit board;
• 8th shows a schematic third exemplary embodiment of an optical system;
• 9 Figure 12 shows a schematic view of an embodiment of an optical system having multiple structural and logical levels;
• 10 shows a schematic block diagram of an embodiment of a method for producing an optical system; and
• 11 shows a schematic block diagram of an embodiment of a method for operating an optical system.

Elements that are the same or have the same function have been provided with the same reference symbols in the figures, unless otherwise stated. Furthermore, it should be noted that the representations in the figures are not necessarily to scale.

1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. One embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, illumination optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system 2. In this case, the lighting system 2 does not include the light source 3 .

A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8 . The reticle holder 8 can be displaced via a reticle displacement drive 9, in particular in a scanning direction.

In the 1 a Cartesian coordinate system with an x-direction x, a y-direction y and a z-direction z is drawn in for explanation. The x-direction x runs perpendicularly into the plane of the drawing. The y-direction y runs horizontally and the z-direction z runs vertically. The scanning direction is in the 1 along the y-direction y. The z-direction z runs perpendicular to the object plane 6.

The projection exposure system 1 includes projection optics 10. The projection optics 10 are used to image the object field 5 in an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, there is also an angle other than 0° between the object plane 6 and the Image plane 12 possible.

A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the region of the image field 11 in the image plane 12 . The wafer 13 is held by a wafer holder 14 . The wafer holder 14 can be displaced in particular along the y-direction y via a wafer displacement drive 15 . The displacement of the reticle 7 via the reticle displacement drive 9 on the one hand and the wafer 13 on the other hand via the wafer displacement drive 15 can be synchronized with one another.

The light source 3 is an EUV radiation source. The light source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light. The useful radiation 16 has in particular a wavelength in the range between 5 nm and 30 nm. The light source 3 can be a plasma source, for example an LPP source (Engl .: Laser Produced Plasma, plasma generated with the help of a laser) or a DPP (Gas Discharged Produced Plasma) source. It can also be a synchrotron-based radiation source. The light source 3 can be a free-electron laser (FEL).

The illumination radiation 16 emanating from the light source 3 is bundled by a collector 17 . The collector 17 can be a collector with one or more ellipsoidal and/or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be used in grazing incidence (GI), i.e. with angles of incidence greater than 45°, or in normal incidence (Normal Inci dence, NI), ie with angles of incidence smaller than 45°, are exposed to the illumination radiation 16. The collector 17 can be structured and/or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress stray light.

After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focus plane 18. The intermediate focus plane 18 can represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics 4.

The illumination optics 4 comprises a deflection mirror 19 and a first facet mirror 20 downstream of this in the beam path. The deflection mirror 19 can be a plane deflection mirror or alternatively a mirror with an effect that influences the bundle beyond the pure deflection effect. Alternatively or additionally, the deflection mirror 19 can be designed as a spectral filter, which separates a useful light wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first facet mirror 20 is arranged in a plane of the illumination optics 4 which is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field facet mirror. The first facet mirror 20 includes a multiplicity of individual first facets 21, which can also be referred to as field facets. Of these first facets 21 are in the 1 only a few shown as examples.

The first facets 21 can be embodied as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or part-circular edge contour. The first facets 21 can be embodied as planar facets or alternatively as convexly or concavely curved facets.

Like for example from the DE 10 2008 009 600 A1 is known, the first facets 21 themselves can each also be composed of a large number of individual mirrors, in particular a large number of micromirrors. The first facet mirror 20 can be embodied in particular as a microelectromechanical system (MEMS system). For details refer to the DE 10 2008 009 600 A1 referred.

The illumination radiation 16 runs horizontally between the collector 17 and the deflection mirror 19, ie along the y-direction y.

A second facet mirror 22 is arranged downstream of the first facet mirror 20 in the beam path of the illumination optics 4. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4 . In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006/0132747 A1 , the EP 1 614 008 B1 and the U.S. 6,573,978 .

The second facet mirror 22 includes a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

The second facets 23 can also be macroscopic facets, which can have round, rectangular or hexagonal borders, for example, or alternatively facets composed of micromirrors. In this regard, also on the DE 10 2008 009 600 A1 referred.

The second facets 23 can have plane or alternatively convexly or concavely curved reflection surfaces.

The illumination optics 4 thus forms a double-faceted system. This basic principle is also known as a honeycomb condenser (English: Fly's Eye Integrator).

It can be advantageous not to arrange the second facet mirror 22 exactly in a plane which is optically conjugate to a pupil plane of the projection optics 10 . In particular, the second facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as is the case, for example, in FIG DE 10 2017 220 586 A1 is described.

The individual first facets 21 are imaged in the object field 5 with the aid of the second facet mirror 22 . The second facet mirror 22 is the last beam-forming mirror or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.

In another embodiment of the illumination optics 4 that is not shown, transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5 , which particularly contributes to the imaging of the first facets 21 in the object field 5 . The transmission optics can have exactly one mirror, but alternatively also have two or more mirrors, which are arranged one behind the other in the beam path of the lighting processing optics 4 are arranged. The transmission optics can in particular comprise one or two mirrors for normal incidence (NI mirror, normal incidence mirror) and/or one or two mirrors for grazing incidence (GI mirror, gracing incidence mirror).

The illumination optics 4 has the version in which 1 shown, exactly three mirrors after the collector 17, namely the deflection mirror 19, the first facet mirror 20 and the second facet mirror 22.

In a further embodiment of the illumination optics 4, the deflection mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.

The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and transmission optics in the object plane 6 is generally only an approximate imaging.

The projection optics 10 includes a plurality of mirrors Mi, which are numbered consecutively according to their arrangement in the beam path of the projection exposure system 1 .

At the in the 1 example shown, the projection optics 10 includes six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible. The projection optics 10 are doubly obscured optics. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture which is greater than 0.5 and which can also be greater than 0.6 and which, for example, is 0.7 or 0.75.

Reflection surfaces of the mirrors Mi can be designed as free-form surfaces without an axis of rotational symmetry. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. Just like the mirrors of the illumination optics 4, the mirrors Mi can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

The projection optics 10 has a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction y can be about as large as a z-distance between the object plane 6 and the image plane 12.

The projection optics 10 can in particular be anamorphic. In particular, it has different imaging scales βx, βy in the x and y directions x, y. The two image scales βx, βy of the projection optics 10 are preferably at (6x, βy)=(+/−0.25, +/-0.125). A positive imaging scale 6 means imaging without image reversal. A negative sign for the imaging scale 6 means imaging with image inversion.

The projection optics 10 thus leads to a reduction in the ratio 4:1 in the x-direction x, ie in the direction perpendicular to the scanning direction.

The projection optics 10 lead to a reduction of 8:1 in the y-direction y, ie in the scanning direction.

Other imaging scales are also possible. Image scales with the same sign and absolutely the same in the x and y directions x, y, for example with absolute values of 0.125 or 0.25, are also possible.

The number of intermediate image planes in the x and y directions x, y in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, can be different. Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from U.S. 2018/0074303 A1 .

In each case one of the second facets 23 is assigned to precisely one of the first facets 21 in order to form a respective illumination channel for illuminating the object field 5 . In this way, in particular, lighting can result according to Köhler's principle. The far field is broken down into a large number of object fields 5 with the aid of the first facets 21 . The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to them.

The first facets 21 are each imaged onto the reticle 7 by an associated second facet 23 in a superimposed manner in order to illuminate the object field 5 . In particular, the illumination of the object field 5 is as homogeneous as possible. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

The illumination of the entrance pupil of the projection optics 10 can be defined geometrically by arranging the second facets 23 . The intensity distribution in the entrance pupil of the projection optics 10 can be set by selecting the illumination channels, in particular the subset of the second facets 23 that guide light. This intensity distribution is also referred to as illumination setting or illumination pupil filling.

A likewise preferred pupil uniformity in the area of defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by redistributing the illumination channels.

Further aspects and details of the illumination of the object field 5 and in particular the entrance pupil of the projection optics 10 are described below.

The projection optics 10 can in particular have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

The entrance pupil of the projection optics 10 cannot regularly be illuminated exactly with the second facet mirror 22 . When imaging the projection optics 10, which telecentrically images the center of the second facet mirror 22 onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found in which the distance between the aperture rays, which is determined in pairs, is minimal. This surface represents the entrance pupil or a surface conjugate to it in position space. In particular, this surface shows a finite curvature.

The projection optics 10 may have different positions of the entrance pupil for the tangential and for the sagittal beam path. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7 . With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.

At the in the 1 shown arrangement of the components of the illumination optics 4, the second facet mirror 22 is arranged in a conjugate to the entrance pupil of the projection optics 10 surface. The first facet mirror 20 is arranged tilted to the object plane 6 . The first facet mirror 20 is tilted relative to an arrangement plane that is defined by the deflection mirror 19 . The first facet mirror 20 is tilted relative to an arrangement plane that is defined by the second facet mirror 22 .

The first facet mirror 20, the second facet mirror 22 or each of the mirrors M1 - M6 are examples of a respective optical system 100 (see 2 , 3 , 8th or 9 ). The individual facets 21, 23 of the facet mirrors 20, 22 are examples of optical elements 101 (see 2 ) of the optical system 100. In the 1 several optical systems 100 form a superordinate optical system, such as the illumination optics 4 or the projection optics 10.

For the individual control of the facets 21, 22 or other displaceable optical elements 101 of the respective optical system 100, a modular electronic arrangement is provided, in particular, which has at least one control unit 130 (see FIG 2 , 3 , 8th or 9 ) and a plurality of assemblies 111 - 114 (see 2 , 3 , 8th or 9 ) which is connected via an interface 140 (see 2 , 3 , 8th or 9 ) are paired. This structure and in particular the coupling of the respective elements via the interface 140 is described below with reference to FIG 2 - 9 explained in detail.

2 shows a schematic first embodiment of an optical system 100, which for example in the projection exposure system 1 of 1 , In particular in the illumination optics 4 or the projection optics 10 can be used. The optical system 100 of 2 comprises in this example two optical elements 101, which are designed as micromirrors. It should be noted that the optical system 100 can include many of the elements shown and can form a micromirror arrangement including several hundred or several thousand micromirrors overall. The optical system 100 can also use one of the facet mirrors 20, 22 (see 1 ) form, the optical elements 101 then having the facets 21, 23 (see 1 ) form. The micromirrors 101 are arranged on a respective arrangement 111, 112, with a respective actuator/sensor device 102 being set up for displacing the respective micromirror 101 and/or for detecting a position of the respective micromirror 101. Furthermore, the optical system 100 includes a control unit 130, which is set up to control the two arrangements 111, 112 by means of corresponding electrical control signals. The control signals are electrical signals and can include a data signal and/or electrical energy for operating the respective arrangement 111, 112. The arrangements 111, 112 have the same structure in this case, see above that they are also controlled with electrical signals of the same type, which is why the bundles B1, B2 can also have the same structure. In this example, the control unit 130 is arranged on a printed circuit board LP.

The drive unit 130 is coupled to the arrangements 111, 112 via an interface 140. The interface 140 is set up to transmit the control signals from the control unit 130 to the respective arrangement 111, 112 and to transmit detected sensor signals of the respective actuator/sensor device 102 from the arrangements 111, 112 to the control unit 130. For each arrangement 111, 112, the interface 140 has a respective bundle B1, B2 of electrical lines. In particular, each bundle B1, B2 comprises a plurality of electrical lines, for example two live lines for transmitting electrical power for operating the respective arrangement 111, 112 and one or more signal lines via which analog and/or digital data signals are transmitted.

In this example, the interface 140 comprises two sections 140A, 140B. A first portion 140A runs on the circuit board LP of the driver unit 130 from the driver unit 130 to a connector CB1-2. A second portion 140B extends between the connector CB1-2 and a respective connector CB1, CB2 located on the respective assembly 111,112. A respective bundle B1, B2 of electrical lines, for example a respective cable, is formed in the second section 140B. In the first section 140A, the electrical lines of the two bundles B1, B2 run separately from one another on the printed circuit board LP, for example in different printed circuit board layers L1-L4 (see Fig 4 or 7 ) and/or clearly spaced apart, so that mutual interference is excluded.

In particular, the design of the bundles B1, B2 as dedicated line bundles for a respective arrangement 111, 112 throughout along the entire signal transmission path from the control unit 130 to the arrangements 111, 112 ensures that if there is a defect in one of the bundles B1, B2, such as for example a short circuit or a missing contact, which can occur in particular in the connector CB1-2 during the integration of the optical system, the respective other bundle B1, B2 being unaffected by this. A corresponding defect will therefore only have a limited effect, which means that only one of the two arrangements 111, 112 will be affected by the defect. On the other hand, a defect in at least a section-wise common line routing would result in both arrangements 111, 112 being affected and possibly failing.

It should be noted at this point that a modular design of the optical system 100 into subsystems with a limited range of functions, which only provide the range of functions required for the respective application together in a network, is familiar to the person skilled in the art. The modular design has the advantage that the failure of one subsystem does not affect the functionality of the other subsystems. In order to keep the complexity of the optical system 100 low, a layout that is as simple as possible, with as few electrical lines as possible, has been selected for signal transmission in order to keep the production and integration costs low and to save installation space, since the optical system 100 is cramped in a vacuum housing of a lithography system is used. Cost savings can possibly be achieved by such a layout that is as simple as possible, but a defect in one of the lines often leads to the failure of several subsystems at the same time, which runs counter to the advantages of the modular structure. This problem is overcome by the proposed structure of the optical system 100, in particular the design of the interface 140.

3 shows a schematic second embodiment of an optical system 100, which for example in the projection exposure system 1 of 1 , In particular in the illumination optics 4 or the projection optics 10 can be used. In this example, the optical system comprises four arrangements 111-114, each arrangement 111-114 having a respective actuator/sensor device 102 (see 2 ) and a respective associated optical element 101 (see 2 ) which, for the sake of clarity, is included in the 3 are not marked with a respective reference number. The four arrangements 111 - 114 are combined in a module 110 in this example. There is also a control unit 130 which is set up to control the four arrangements 111-114. The control unit 130 is connected to the four arrangements 111 - 114 via an interface 140 . The interface 140 comprises a separate bundle B1-B4 of electrical lines for each of the arrangements 111-114, with three separate lines per bundle B1-B4 being indicated schematically here. This number is merely an example and not restrictive; rather, a respective bundle B1-B4 can also include fewer or more than three lines.

In this example, the interface 140 has two sections 140A, 140B. The first portion 140A extends from a connector CB 1-4, the is arranged on the control unit 130, to a further connector CB 1-4, which is arranged on the module 110. Each connector CB 1-4 includes a plug and a socket (not shown separately). Between the connectors CB 1-4, the bundles B1-B4 run, for example, in separate cables, in a common cable or in a flexible printed circuit board FLB. The second section 140B runs in the module 110, which comprises, for example, a printed circuit board in which the bundles B1-B4 run separately from one another. This design of the interface 140 results in the same advantages as already based on the 2 described.

It should be noted that the optical system 100 can include multiple elements 110, 130, 140 shown and can form a micromirror arrangement including several hundred or several thousand micromirrors overall. The optical system 100 can also use one of the facet mirrors 20, 22 (see 1 ) form, the optical elements 101 then having the facets 21, 23 (see 1 ) form.

4 shows a schematic first exemplary embodiment of an arrangement of lines in a printed circuit board, which is a flexible printed circuit board FLB. In this example, the flexible printed circuit board FLB comprises four layers L1-L4 that are electrically separated from one another. In this case, the lines are designed as conductor tracks on the printed circuit board FLB. Conductor tracks that run in different layers L1 - L4 are electrically isolated from one another. Since the multiple bundles B1-B4 of electrical lines must run separately from one another, in particular electrically separately from one another, it is advantageous to arrange different bundles B1-B4 in different layers L1-L4, as in FIG 4 shown.

Several lines can run in a respective layer L1-L4. In this example, each of the bundles B1-B4 comprises four lines, two live lines V+, V-, a first data line DATA0 and a second data line DATA1 being an example. In particular, electrical energy for operating a respective arrangement 111 - 114 (see 2 , 3 , 8th or 9 ) transfer. The operating voltage is preferably at most 60 volts. For example, analog or digital control signals and/or measurement signals are transmitted via the two data lines DATA0, DATA1. The various lines D0, D1, V−, V+ can be designed specifically for their respective specific task, that is to say they can consist of different materials and/or different cross sections, for example. In addition, insulation between two respective lines within a bundle B1-B4 can be different, depending on the voltage and/or current to be transmitted via a respective line.

5 shows a schematic embodiment of an arrangement of contact pins P of a connector CB1-4. In this example, the connector CB1-4 has a total of 18 contact pins P arranged in two rows. For reasons of clarity, only one contact pin P is provided with a reference number. Between the two rows of contact pins P, for example, runs a web made of an insulating material (no reference number). This connector CB 1-4 can be used, for example, for four bundles B1-B4 of four electrical lines each. An additional contact pin N is located between the two respective bundles B1, B2 and B3, B4 arranged in a respective row. This separates the two respective bundles B1-B4 from one another. The contact pin N is connected to a neutral reference potential, for example, or is not connected at all. This ensures that no contact is possible between the respective adjacent bundles B1, B2 and B3, B4, not even when one of the outer pins of a respective bundle B1-B4 is bent over. In embodiments, more than just one unoccupied contact pin N or one set to a neutral reference potential can be provided between two bundles. It should be noted that the connector CB 1-4 comprises a respective plug with a corresponding socket.

6 Fig. 12 shows a schematic embodiment of a connector plug CB1-4, showing a side view. In the side view, in particular, the contact pins P protruding from the plug CB1-4 can be seen, only one contact pin P being identified with a reference number for reasons of clarity. Two geometric dimensions characteristic of the plug CB1-4 are also shown: the length L of a respective contact pin P and a distance D between each two contact pins P. The connector plug CB1-4 is designed in particular in such a way that the distance D between each two contact pins P is greater than a respective length L of the contact pins P. This ensures that a bent contact pin P does not cause a short circuit with an adjacent contact pin P.

In embodiments of the connector plug CB 1-4, the distance D is greater than twice the length L of a respective contact pin P, so that even in the unlikely event that two adjacent contact pins P mutually ver are arc, no electrical contact between these two contact pins P can be produced.

7 shows a schematic second exemplary embodiment of an arrangement of lines in a printed circuit board LP, which in this example comprises two separate printed circuit board layers L1, L2. Four bundles B1 - B4 of electrical lines, each comprising four separate lines, run in the printed circuit board LP. As already based on the 4 described, are electrical lines that run in different layers L1, L2, electrically isolated from each other. In this example, two bundles B1, B2 and B3, B4 each run in a respective common layer L1, L2. Their lines are also electrically isolated from one another, but not by a layer boundary, but by the dielectric material arranged between two respective lines. In order to achieve a high level of security against mutual interference between the bundles B1, B2 and B3, B4 despite the arrangement on the same layers L1, L2, the arrangement of the conductor tracks is not uniform, but there is a distance D1 between conductor tracks of different bundles B1, B2 chosen larger than a distance D0 between traces of a bundle. For example, the distance D1 is at least twice as large as the distance D0. In this way, it is possible to reliably avoid a short circuit occurring over time between interconnects that belong to different bundles B1, B2 or B3, B4 due to electromigration or the like.

8th shows a schematic third embodiment of an optical system 100, which for example in the projection exposure system 1 of 1 , In particular in the illumination optics 4 or the projection optics 10 can be used. In this example, the optical system 100 comprises two arrangements 111, 112, each arrangement 111, 112 having a respective actuator/sensor device 102 (see 2 ) and a respective associated optical element 101 (see 2 ) includes those in the 8th are not marked with a respective reference number for reasons of clarity. The optical system 100 also includes a control unit 130 which is set up to control the associated arrangements 111, 112 and which is coupled to the arrangements 111, 112 by means of an interface 140. The interface 140 comprises two bundles B1, B2 of electrical lines, with each bundle B1, B2 comprising four lines in this example, for example two live lines and two data signal lines, as also based on FIG 4 is explained.

In this example, the control unit 130 is arranged on a printed circuit board LP and includes a logic unit 131 and a power unit 132. Further elements can be arranged on the printed circuit board LP, in particular the printed circuit board includes a separate connector CB1, CB2 for each arrangement 111, 112. Logic unit 131 is embodied, for example, as a processor or an application-specific integrated circuit (ASIC) and is set up to transmit control and/or regulation signals for a respective arrangement 111, 112, in particular for controlling the respective actuator/sensor device 102 (see 2 ), to generate and output. The logic unit 131 can receive both control signals from a higher-level control unit, such as a central control computer, and/or sensor signals detected by the actuator/sensor devices 102 and process them for suitable control or regulation. For each of the arrangements 111, 112, the logic unit 131 has two separate lines (corresponding to the two data signal lines), which can be operated unidirectionally or bidirectionally. The power unit 132 is designed, for example, as a voltage source or a current source and is set up to provide the electrical energy required for the operation of the respective arrangement 111, 112. The power unit 132 also has two separate lines (corresponding to the two live lines) for each of the assemblies 111, 112.

Due to the spatial separation of logic unit 131 and power unit 132 in this example, the lines belonging to a respective bundle B1, B2 run in spatial separation in sections. The interface 140 is divided into two sections 140A, 140B. The lines run in the printed circuit board LP in particular in the first section 140A. Preferably, a separate circuit board layer L1, L2 (see Fig 7 ) intended. The lines of different bundles B1, B2 can thus cross without this increasing the risk of mutual interference. The second section 140B comprises, in this example, separate connectors CB1, CB2 for each of the assemblies on the printed circuit board LP and separate connection elements, such as a respective cable, which are connected to a respective connector CB1, CB2 on the respective assembly 111, 112.

It should be noted that a respective internal structure of the logic unit 131 and the power unit 132 can also have separate sub-areas for the signal processing and provision of the respective electrical signals (not shown), so that if a respective sub-area fails, only the one controlled by the respective sub-area Arrangement 111, 112 is affected.

9 FIG. 10 shows a schematic view of an embodiment for an optical system 100, which has several structural and logical levels. The optical system 100 can, for example, in the projection exposure system 1 of 1 , In particular in the illumination optics 4 or the projection optics 10 are used. In particular, the levels form a hierarchy. In this example there are three structural levels, with the devices 111-114 being arranged on a lowest level, the control units 130A, 130B being arranged on a middle level and a central control unit 150 being arranged on a highest level. The central control unit 150 is set up to control the two control units 130A, 130B assigned to it. A respective drive unit 130A, 130B is set up to drive the arrangement 111-114 assigned to the respective drive unit 130A, 130B. To this end, the levels are coupled to one another by means of a respective interface 140, with hierarchically successive levels being connected to one another in each case.

A respective interface 140 comprises a respective plurality of bundles B1-B6 of electrical lines, the number of bundles depending on the units to be controlled on the respective lower hierarchical level. Therefore, the interface 140 between the central driver 150 and the drivers 130A, 130B comprises two trunks B5, B6 (one for each driver). If more than two control units are assigned to the central control unit 150, then the interface 140 includes a correspondingly higher number of bundles. The respective interface 140 between a respective control unit 130A, 130B and the respective associated arrangements 111-114 accordingly also includes two bundles B1, B2 and B3, B4.

Various interfaces 140, which couple respective different pairs of planes, can be designed differently, in particular with regard to their respective number of electrical lines and their purpose. For example, the bundles B5, B6 can only be designed for the transmission of data signals, a transmission of electrical energy for the operation of the control units 130A, 130B is not provided, since the control units 130A, 130B have a separate power supply (not shown), for example. In particular, the bundle B5 transmits the data necessary for driving the arrangements 111, 112, while the bundle B6 transmits the data necessary for driving the arrangements 113, 114. The respective control unit 130A, 130B controls the arrangements 111 - 114 on the basis of this control data.

In particular, the optical system 100 is arranged in a tree structure, with the central control unit 150 forming the root or trunk in this example, the drive units 130A, 130B forming the branches and the assemblies 111-114 forming the leaves of the tree structure.

10 shows a schematic block diagram of an embodiment of a method for producing an optical system 100, for example the optical system of FIG 2 , 3 , 7 or 8th . In a first step S1, a plurality of optical components 101 (see 2 ) for guiding radiation in the optical system 100 is provided. In a second step S2, a plurality N1 of arrangements 111-114 (see 2 , 3 , 7 or 8th ) are provided, with N1 > 2, each of the N1 arrangements 111 - 114 having at least one actuator/sensor device 102 (see 2 ) includes. In a third step S3, the actuator/sensor devices 102 of the N1 arrangements 111-114 are assigned to the optical components 101. In a fourth step S4, a number N2 of drive units 130 (see 2 , 3 , 7 or 8th ) for driving the number N1 of arrangements 111-114, with N2>1. In a fifth step S5, the N1 arrangements 111-114 are assigned to the N2 drive units 130. In a sixth step S6, the N1 arrangements 111 - 114 are coupled to the N2 drive units 130 for transmitting electrical signals between the respective drive unit 130 and the arrangements 111 - 114 assigned to the drive unit 130, with a respective bundle being used for each of the N1 arrangements 111 - 114 B1 - B4 (see 2 , 3 , 7 or 8th ) used by electrical wiring.

11 shows a schematic block diagram of an embodiment of a method for operating an optical system 100, for example the optical system of FIG 2 , 3 , 7 , 8th or 9 . In a first step ST1, a first electrical signal is transmitted from a control unit 130 to a first arrangement 111 of the plurality N1 of arrangements 111 - 114 via interface 140, with the first electrical signal being transmitted exclusively via a first bundle B1 of electrical lines of interface 140 is transferred. In a second step ST2, a second electrical signal is transmitted from control unit 130 to a second arrangement 112 of the plurality N1 of arrangements 111 - 114 via interface 140, with the second electrical signal being transmitted exclusively via a second bundle B2 of electrical lines of interface 140 is transferred.

In the event that a defect occurs in the interface, the method additionally comprises detecting an electrical defect in a specific one of the plurality of bundles B1-B4 of electrical lines, interrupting the transmission of the electrical signal via the specific bundle B1-B4 of electrical lines wires, and continuing transmission of the respective electrical signals over the plurality of electrical wire bundles B1-B4 without the particular electrical wire bundle B1-B4.

Although the present invention has been described using exemplary embodiments, it can be modified in many ways.

Reference List

1

projection exposure system

2

lighting system

3

light source

4

lighting optics

5

object field

6

object level

7

reticle

8th

reticle holder

9

reticle displacement drive

10

projection optics

11

image field

12

picture plane

13

wafers

14

wafer holder

15

Wafer displacement drive

16

illumination radiation

17

collector

18

intermediate focal plane

19

deflection mirror

20

first facet mirror

21

first facet

22

second facet mirror

23

second facet

100

optical system

101

optical element

102

actuator/sensor setup

110

module

111

arrangement

112

arrangement

113

arrangement

114

arrangement

130

control unit

130A

control unit

130B

control unit

131

processing unit

132

processing unit

140

interface

140A

Section

140B

Section

150

central control unit

B1

bunch

B2

bunch

B3

bunch

B4

bunch

B5

bunch

B6

bunch

CB1

Interconnects

CB1-2

Interconnects

CB1-4

Interconnects

CB2

Interconnects

D

Distance

D0

Distance

D1

Distance

DATA0

data signal line

DATA1

data signal line

FLB

flexible circuit board

L

length

L1

Position

L2

Position

L3

Position

L4

Position

LP

circuit board

M1

Mirror

M2

Mirror

M3

Mirror

M4

Mirror

M5

Mirror

M6

Mirror

N

neutral wire

P

contact pin

V+

operating voltage line

v

operating voltage line

S1

process step

S2

process step

S3

process step

S4

process step

S5

process step

S6

process step

ST1

process step

ST2

process step

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• WO 2009/100856 A1 [0006]
• DE 102015224742 B4 [0009]
• DE 102008009600 A1 [0085, 0089]
• US 2006/0132747 A1 [0087]
• EP 1614008 B1 [0087]
• US6573978 [0087]
• DE 102017220586 A1 [0092]
• US 2018/0074303 A1 [0106]

Claims (15)

Optical system (100), with: a plurality of optical components (101) for guiding radiation (16) in the optical system (100), a plurality N1 of arrangements (111 - 114), with N1 > 2, each of the N1 arrangements (111 - 114) comprising at least one actuator/sensor device (102) which is assigned to one of the optical components (101), and a number N2 of driving units (130, 130A, 130B) for driving the plurality N1 of devices (111 - 114), with N2 > 1, wherein each of the N2 driving units (130, 130A, 130B) comprises at least two of the N1 devices (111 - 114) are assigned, and wherein an interface (140) for electrically coupling the respective drive unit (130, 130A, 130B) to the drive unit (130, 130A, 130B) associated arrangements (111 - 114) for transmitting respective electrical signals between the control unit (130, 130A, 130B) and the respective arrangements (111 - 114) assigned to the control unit (130, 130A, 130B), the respective electrical signals being a data signal and/or electrical energy for operating the respective arrangement (111 - 114), and wherein the interface (140) has a respective bundle (B1 - B6) of electrical lines for each of the arrangements (111 - 114) assigned to the control unit (130, 130A, 130B). Optical system after claim 1 , A respective bundle (B1 - B6) of electrical lines for transmitting the electrical signals exclusively from the control unit (130, 130A, 130B) to the means of the bundle (B1 - B6) coupled arrangement (111 - 114) is set up. Optical system after claim 1 or 2 , wherein the N1 arrangements (111 - 114) have the same structure and the bundles (B1 - B6) of the interface (140) for each of the arrangements (111 - 114) assigned to the drive unit (130, 130A, 130B) have the same number of includes electrical wiring. Optical system according to one of Claims 1 until 3 , wherein a respective bundle (B1 - B6) of electrical lines comprises a number of operating voltage lines (V+, V-) and a number of data signal lines (DATA0, DATA1). Optical system according to one of Claims 1 until 4 , wherein the interface (140) comprises a printed circuit board (FLB, LP) with several separate electrical levels (L1 - L4) and the electrical lines of a respective bundle (B1 - B6) are designed as conductor tracks on the printed circuit board (FLB, LP), wherein the respective bundle (B1 - B6) of electrical lines is arranged in a respective plane (L1 - L4). Optical system according to any of the Claims 1 until 5 , wherein the interface (140) comprises a circuit board (FLB, LP) and the electrical lines of a respective bundle (B1 - B6) are designed as conductor tracks on the circuit board (FLB, LP), and with a distance (D1) between the conductor tracks of a first bundle (B1 - B6) to the traces of a second bundle (B1 - B6) is greater than a distance (D0) between two traces within a bundle (B1 - B6). Optical system according to one of Claims 1 until 6 , The interface (140) for each of the drive unit (130, 130A, 130B) associated arrangement (111 - 114) has a separate connector (CB1, CB2), the respective separate connector (CB1, CB2) for electrically connecting the number of electrical lines of the bundle (B1 - B4) between the control unit (130, 130A, 130B) and the arrangement (111 - 114). Optical system according to one of Claims 1 until 7 , wherein the interface (140) for a plurality of arrangements (111 - 114) assigned to the control unit (130, 130A, 130B) has a common plug connector (CB1-2, CB1-4) for electrically connecting the electrical lines of the plurality of bundles (B1 - B6 ) between the drive unit (130, 130A, 130B) and the plurality of assemblies (111-114), wherein the common connector (CB1-2, CB1-4) has a number K of contact pins (P), where K is greater than or equal to is the sum of all electrical lines comprised by the plurality of bundles (B1 - B6), and wherein a distance (D) between two adjacent contact pins (P) in each case is greater than a length (L) of a respective contact pin (P), and/or a pin assignment of the connector (CB1-2, CB1-4) is such that between two contact pins (P), which electrical lines of different bundles (B1 - B6) are assigned, an unassigned contact pin and/or a contact pin with a neutral one Reference potential (N) is arranged. Optical system according to one of Claims 1 until 8th , wherein the number of drive units (130, 130A, 130B) is N2 > 2 and the N2 drive units (130, 130A, 130B) have the same structure, and with a number N3 of central drive units (150) for driving the N2 drive units ( 130, 130A, 130B), with N3> 1, wherein each central control unit (150) at least two of the N2 control units (130, 130A, 130B) are assigned, and wherein a further interface (140) for electrically coupling the respective central control unit (150) with the assigned control units (130, 130A, 130B) for transmitting electrical signals between the central control unit (150) and the control units (130, 130A, 130B) for each of the central control unit (150) assigned control unit ( 130, 130A, 130B) has a bundle (B5, B6) of electrical lines, the bundles (B5, B6) of the further interface (140) for each of the central control unit (150) associated control unit (130, 130A, 130B) each comprise the same number of electrical lines. Optical system after claim 9 wherein the central drive unit (150), the N2 drive units (130, 130A, 130B) and the N1 devices (111-114) are connected in a tree structure. Optical system according to one of Claims 1 until 10 , wherein the actuator/sensor device (102) as an actuator device for displacing the optical component (101), as a sensor device for determining a position of the optical component (101) or as an actuator and sensor device is designed to move the optical component (101) and to determine a position of the optical component (101). Lithography system (1) with an optical system (100) according to one of Claims 1 until 11 . Method for producing an optical system (100) for a lithography system (1), with the steps: Providing (S1) a plurality of optical components (101) for guiding radiation (16) in the optical system (100), Providing (S2) a plurality N1 of arrangements (111 - 114), with N1 > 2, each of the N1 arrangements (111 - 114) comprising at least one actuator/sensor device (102), Assigning (S3) the actuator/sensor devices (102) of the N1 arrangements (111 - 114) to the optical components (101), Providing (S4) a number N2 of drive units (130, 130A, 130B) for driving the number N1 of arrangements (111-114), with N2 > 1, Assigning (S5) the N1 devices (111-114) to the N2 drive units (130, 130A, 130B), and Coupling (S6) the N1 devices (111-114) to the N2 drive units (130, 130A, 130B) for transmitting electrical signals between the respective drive unit (130, 130A, 130B) and those associated with the drive unit (130, 130A, 130B). Arrangements (111 - 114), wherein a respective bundle (B1 - B4) of electrical lines is used for each of the N1 arrangements (111 - 114). Method for operating an optical system (100) according to one of Claims 1 until 11 , having the steps of: transmitting (ST1) a first electrical signal from a drive unit (130, 130A, 130B) to a first arrangement (111-114) of the plurality N1 of arrangements (111-114) by means of the interface (140), wherein the first electrical signal is transmitted exclusively via a first bundle (B1 - B4) of electrical lines of the interface (140), and transmission (ST2) of a second electrical signal from the control unit (130, 130A, 130B) to a second arrangement (111 - 114) of the plurality N1 of assemblies (111-114) by means of the interface (140), the second electrical signal being transmitted exclusively via a second bundle (B1-B4) of electrical lines of the interface (140). procedure after Claim 14 , wherein a respective electrical signal is transmitted via a plurality of bundles (B1 - B4), with: detecting an electrical defect in a specific one of the plurality of bundles (B1 - B4) of electrical lines, interrupting the transmission of the electrical signal via the specific bundle (B1 - B4) of electric wires, and continuing the transmission of the respective electric signals via the plurality of bundles (B1 - B4) of electric wires without the particular bundle (B1 - B4) of electric wires.

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