DE102021001126A1 - Prüfverfahren und Prüfsystem für zylindrische Wabenstruktur aus Keramik - Google Patents

Prüfverfahren und Prüfsystem für zylindrische Wabenstruktur aus Keramik Download PDF

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Publication number
DE102021001126A1
DE102021001126A1 DE102021001126.0A DE102021001126A DE102021001126A1 DE 102021001126 A1 DE102021001126 A1 DE 102021001126A1 DE 102021001126 A DE102021001126 A DE 102021001126A DE 102021001126 A1 DE102021001126 A1 DE 102021001126A1
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DE
Germany
Prior art keywords
honeycomb structure
cylindrical honeycomb
line sensor
turntable
sensor camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102021001126.0A
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German (de)
English (en)
Inventor
Takafumi TERAHAI
Yoshihiro Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE102021001126A1 publication Critical patent/DE102021001126A1/de
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8914—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the material examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/952—Inspecting the exterior surface of cylindrical bodies or wires
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Textile Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE102021001126.0A 2020-03-30 2021-03-02 Prüfverfahren und Prüfsystem für zylindrische Wabenstruktur aus Keramik Pending DE102021001126A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-061297 2020-03-30
JP2020061297A JP7206234B2 (ja) 2020-03-30 2020-03-30 セラミックス製の円柱状ハニカム構造体の検査方法及び検査装置

Publications (1)

Publication Number Publication Date
DE102021001126A1 true DE102021001126A1 (de) 2021-09-30

Family

ID=77659151

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102021001126.0A Pending DE102021001126A1 (de) 2020-03-30 2021-03-02 Prüfverfahren und Prüfsystem für zylindrische Wabenstruktur aus Keramik

Country Status (4)

Country Link
US (1) US11761899B2 (https=)
JP (1) JP7206234B2 (https=)
CN (1) CN113466128B (https=)
DE (1) DE102021001126A1 (https=)

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Publication number Priority date Publication date Assignee Title
US12078574B2 (en) * 2021-08-11 2024-09-03 Corning Incorporated Systems and methods for visual inspection and 3D measurement
KR102725142B1 (ko) * 2022-05-20 2024-11-01 주식회사 윈텍오토메이션 초경인서트 측면 코너부 검사를 위한 영상 획득시스템
JP7733042B2 (ja) * 2023-03-27 2025-09-02 日本碍子株式会社 ハニカム成形体の外周形状を検査するシステム及び方法
CN118464922B (zh) * 2024-05-10 2025-09-19 冠捷电子科技(福建)有限公司 一种基于相机前后景深的面板快速检测方法
CN118758967B (zh) * 2024-07-17 2024-12-10 江苏赛立昂复合材料有限公司 一种陶瓷内部缺陷检测装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017061318A1 (ja) 2015-10-06 2017-04-13 日本碍子株式会社 セラミックス体の表面検査方法

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JPH0612253B2 (ja) * 1989-03-01 1994-02-16 日本碍子株式会社 ハニカム成形用口金の検査方法
JP3840619B2 (ja) * 1995-05-25 2006-11-01 株式会社キーエンス 変位計
JPH11281321A (ja) * 1998-03-31 1999-10-15 Copal Co Ltd 部品認識装置
US7460703B2 (en) * 2002-12-03 2008-12-02 Og Technologies, Inc. Apparatus and method for detecting surface defects on a workpiece such as a rolled/drawn metal bar
CN101400990B (zh) 2006-03-16 2012-03-21 日本碍子株式会社 蜂窝结构体的外壁检测方法
JP2008241529A (ja) * 2007-03-28 2008-10-09 Yaskawa Electric Corp 回転中心合わせ装置
JP2008275496A (ja) * 2007-05-01 2008-11-13 Canon Chemicals Inc 発泡体ローラーの欠陥検出方法および装置
WO2009058247A1 (en) * 2007-10-31 2009-05-07 Corning Incorporated Laser scanning measurement systems and methods for surface shape measurement of hidden surfaces
US8049878B2 (en) * 2008-08-22 2011-11-01 Corning Incorporated Systems and methods for detecting defects in ceramic filter bodies
GB0901040D0 (en) * 2009-01-22 2009-03-11 Renishaw Plc Optical measuring method and system
JP2010249798A (ja) * 2009-03-23 2010-11-04 Ngk Insulators Ltd 目封止ハニカム構造体の検査装置及び目封止ハニカム構造体の検査方法
US8285027B2 (en) * 2009-11-13 2012-10-09 Corning Incorporated High-resolution large-field scanning inspection system for extruded ceramic honeycomb structures
US8537215B2 (en) * 2009-11-30 2013-09-17 Corning Incorporated Multi-camera skin inspection system for extruded ceramic honeycomb structures
CN201697882U (zh) * 2010-06-03 2011-01-05 成都精密光学工程研究中心 光学元件亚表面缺陷的检测装置
JP5963453B2 (ja) * 2011-03-15 2016-08-03 株式会社荏原製作所 検査装置
US9239296B2 (en) * 2014-03-18 2016-01-19 Corning Incorporated Skinning of ceramic honeycomb bodies
EP3224601A1 (en) * 2014-11-25 2017-10-04 Corning Incorporated Methods of in-line extrudate inspection and feedback control for honeycomb body manufacture
US11255663B2 (en) * 2016-03-04 2022-02-22 May Patents Ltd. Method and apparatus for cooperative usage of multiple distance meters
WO2018225664A1 (ja) * 2017-06-07 2018-12-13 キヤノンマシナリー株式会社 欠陥検出装置、欠陥検出方法、ウェハ、半導体チップ、ダイボンダ、半導体製造方法、および半導体装置製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017061318A1 (ja) 2015-10-06 2017-04-13 日本碍子株式会社 セラミックス体の表面検査方法

Also Published As

Publication number Publication date
CN113466128A (zh) 2021-10-01
US20210302325A1 (en) 2021-09-30
JP7206234B2 (ja) 2023-01-17
CN113466128B (zh) 2024-09-13
JP2021162348A (ja) 2021-10-11
US11761899B2 (en) 2023-09-19

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