DE102018216294A1 - Verfahren zur Herstellung eines MEMS-Sensors - Google Patents

Verfahren zur Herstellung eines MEMS-Sensors Download PDF

Info

Publication number
DE102018216294A1
DE102018216294A1 DE102018216294.8A DE102018216294A DE102018216294A1 DE 102018216294 A1 DE102018216294 A1 DE 102018216294A1 DE 102018216294 A DE102018216294 A DE 102018216294A DE 102018216294 A1 DE102018216294 A1 DE 102018216294A1
Authority
DE
Germany
Prior art keywords
mems
mems structure
asic
access
cavern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102018216294.8A
Other languages
German (de)
English (en)
Inventor
Daniel Haug
Tobias Henn
Michael Knauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102018216294.8A priority Critical patent/DE102018216294A1/de
Priority to CN201910911142.6A priority patent/CN110937569A/zh
Publication of DE102018216294A1 publication Critical patent/DE102018216294A1/de
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
    • B81B7/0025—Protection against chemical alteration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04—Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/11—Structural features, others than packages, for protecting a device against environmental influences
    • B81B2207/115—Protective layers applied directly to the device before packaging
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
DE102018216294.8A 2018-09-25 2018-09-25 Verfahren zur Herstellung eines MEMS-Sensors Pending DE102018216294A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102018216294.8A DE102018216294A1 (de) 2018-09-25 2018-09-25 Verfahren zur Herstellung eines MEMS-Sensors
CN201910911142.6A CN110937569A (zh) 2018-09-25 2019-09-25 用于制造mems传感器的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018216294.8A DE102018216294A1 (de) 2018-09-25 2018-09-25 Verfahren zur Herstellung eines MEMS-Sensors

Publications (1)

Publication Number Publication Date
DE102018216294A1 true DE102018216294A1 (de) 2020-03-26

Family

ID=69724852

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018216294.8A Pending DE102018216294A1 (de) 2018-09-25 2018-09-25 Verfahren zur Herstellung eines MEMS-Sensors

Country Status (2)

Country Link
CN (1) CN110937569A (zh)
DE (1) DE102018216294A1 (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4277079B2 (ja) * 2004-06-18 2009-06-10 Ｏｋｉセミコンダクタ株式会社 半導体加速度センサ装置及びその製造方法
DE102010064120B4 (de) * 2010-12-23 2023-05-25 Robert Bosch Gmbh Bauteil und Verfahren zu dessen Herstellung
DE102011005676A1 (de) * 2011-03-17 2012-09-20 Robert Bosch Gmbh Bauteil
DE102014211188A1 (de) * 2014-06-12 2015-12-17 Robert Bosch Gmbh Vertikal hybrid integriertes Bauteil mit Interposer zur Stressentkopplung einer MEMS-Struktur und Verfahren zu dessen Herstellung
DE102014214532B3 (de) * 2014-07-24 2015-10-08 Robert Bosch Gmbh Bauteil mit einem MEMS-Bauelement und einer Kappenstruktur mit Medienanschlussöffnung
DE102014222853A1 (de) * 2014-11-10 2016-05-12 Robert Bosch Gmbh Schutzvorrichtung für ein elektronisches Bauelement, Sensorbauteil und Verfahren zu dessen Herstellung
US20160297671A1 (en) * 2015-04-13 2016-10-13 Epcos Ag MEMS Sensor Component

Also Published As

Publication number Publication date
CN110937569A (zh) 2020-03-31

Similar Documents

Publication Publication Date Title
DE102013113469B4 (de) Flip-chip-wafer-level-baueinheiten und diesbezügliches verfahren
EP1805101B1 (de) Verfahren zum montieren von halbleiterchips und entsprechende halbleiterchipanordnung
EP1602625B1 (de) Halbleitermodul mit einem Halbleiter-Sensorchip und einem Kunststoffgehäuse sowie Verfahren zu dessen Herstellung
DE102010006132B4 (de) Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102006023879B4 (de) Verfahren zum Häusen eines Bildsensors und ein gehäuster Bildsensor
DE102004011203B4 (de) Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung
DE102012108305B4 (de) Sensorbauelement und Verfahren
DE102009051342A1 (de) Mikroelektronisches Gehäuse und Verfahren zum Anordnen in einem Gehäuse
DE102004040465B4 (de) Gehäuseanordnung für elektronische Bauelemente und Verfahren zum Verpacken elektronischer Bauelemente
WO2008138666A1 (de) Differenzdruck-sensoranordnung und entsprechendes herstellungsverfahren
DE102009038706A1 (de) Sensorbauelement
DE102006056361B4 (de) Modul mit polymerhaltigem elektrischen Verbindungselement und Verfahren
DE102010016696A1 (de) Halbleiter-Bauelement
DE102013211613A1 (de) Bauteil in Form eines Waferlevel-Packages und Verfahren zu dessen Herstellung
DE102012107403A1 (de) Chip-Gehäuse-Modul für einen Chip und ein Verfahren zum Herstellen eines Chip-Gehäuse-Moduls
DE10226033A1 (de) Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102018220762B4 (de) Aufbringung von Schutzmaterial auf Wafer-Ebene bei einem Eingangsprozess für Frühphasen-Teilchen- und -Feuchtigkeitsschutz
DE102017220258B4 (de) Halbleitersensorbauelement und Verfahren zum Herstellen desselben
DE102020110790B4 (de) Sensorvorrichtungen mit gasdurchlässigem Deckel und zugehörige Herstellungsverfahren
DE10251527A1 (de) Verfahren zur Herstellung einer Stapelanordnung eines Speichermoduls
DE19940564C2 (de) Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls
DE102018216294A1 (de) Verfahren zur Herstellung eines MEMS-Sensors
EP0996979B1 (de) Gehäuse für zumindest einen halbleiterkörper
DE102004058815A1 (de) Chipmodul und Verfahren zu dessen Herstellung
DE102010032506A1 (de) Modul und Herstellungsverfahren