DE102018120061A1 - Ein Detektormodul für einen photoakustischen Gassensor - Google Patents

Ein Detektormodul für einen photoakustischen Gassensor Download PDF

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Publication number
DE102018120061A1
DE102018120061A1 DE102018120061.7A DE102018120061A DE102018120061A1 DE 102018120061 A1 DE102018120061 A1 DE 102018120061A1 DE 102018120061 A DE102018120061 A DE 102018120061A DE 102018120061 A1 DE102018120061 A1 DE 102018120061A1
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DE
Germany
Prior art keywords
substrate
recess
detector module
cell
reference gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102018120061.7A
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German (de)
English (en)
Inventor
Horst Theuss
Rainer Markus Schaller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
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Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE102018120061.7A priority Critical patent/DE102018120061A1/de
Priority to US16/534,143 priority patent/US11105776B2/en
Priority to CN201910753562.6A priority patent/CN110836855A/zh
Publication of DE102018120061A1 publication Critical patent/DE102018120061A1/de
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2418Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G01N29/2425Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics optoacoustic fluid cells therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/022Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/222Constructional or flow details for analysing fluids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G01N2021/1704Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids in gases
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G01N2021/1708Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids with piezotransducers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/021Gases

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  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
DE102018120061.7A 2018-08-17 2018-08-17 Ein Detektormodul für einen photoakustischen Gassensor Pending DE102018120061A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102018120061.7A DE102018120061A1 (de) 2018-08-17 2018-08-17 Ein Detektormodul für einen photoakustischen Gassensor
US16/534,143 US11105776B2 (en) 2018-08-17 2019-08-07 Detector module for a photo-acoustic gas sensor
CN201910753562.6A CN110836855A (zh) 2018-08-17 2019-08-15 用于光声气体传感器的检测器模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018120061.7A DE102018120061A1 (de) 2018-08-17 2018-08-17 Ein Detektormodul für einen photoakustischen Gassensor

Publications (1)

Publication Number Publication Date
DE102018120061A1 true DE102018120061A1 (de) 2020-02-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018120061.7A Pending DE102018120061A1 (de) 2018-08-17 2018-08-17 Ein Detektormodul für einen photoakustischen Gassensor

Country Status (3)

Country Link
US (1) US11105776B2 (zh)
CN (1) CN110836855A (zh)
DE (1) DE102018120061A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020122812A1 (de) 2020-09-01 2022-03-03 Infineon Technologies Ag Photoakustische Sensoren und zugehörige Herstellungsverfahren
DE102020123199A1 (de) 2020-09-04 2022-03-10 Testo SE & Co. KGaA Photoakustische Sensoranordnung

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11206494B2 (en) 2018-10-05 2021-12-21 Knowles Electronics, Llc Microphone device with ingress protection
US10870577B2 (en) 2018-10-05 2020-12-22 Knowles Electronics, Llc Methods of forming MEMS diaphragms including corrugations
DE112019005007T5 (de) 2018-10-05 2021-07-15 Knowles Electronics, Llc Akustikwandler mit einer Niederdruckzone und Membranen, die eine erhöhte Nachgiebigkeit aufweisen
DE102019134279B3 (de) * 2019-12-13 2021-05-27 Infineon Technologies Ag Photoakustische Sensoren und MEMS-Bauelemente
CN117083514A (zh) 2021-03-04 2023-11-17 哈恩-席卡德应用研究学会 用于对mems单元中的参考气体进行封闭的方法
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996024831A1 (en) * 1995-02-10 1996-08-15 Nyfotek A/S Photoacoustic gas detector
WO2016105920A1 (en) * 2014-12-24 2016-06-30 Intel Corporation Gas sensing devices with photoacoustic detection

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0989773A (ja) * 1995-09-20 1997-04-04 Horiba Ltd 赤外線ガス分析計
FR2768813B1 (fr) * 1997-09-19 1999-10-22 Commissariat Energie Atomique Spectrometre photoacoustique miniaturise
US6124145A (en) * 1998-01-23 2000-09-26 Instrumentarium Corporation Micromachined gas-filled chambers and method of microfabrication
US6809413B1 (en) * 2000-05-16 2004-10-26 Sandia Corporation Microelectronic device package with an integral window mounted in a recessed lip
JP3583739B2 (ja) * 2000-08-22 2004-11-04 日本電信電話株式会社 ガス分光分析用微小フローセルおよびその製造方法
JP2002328115A (ja) * 2001-04-27 2002-11-15 Yamatake Corp 光音響ガスセンサ用ガス拡散フィルタの製造方法
DE102004030380B4 (de) 2004-06-23 2010-07-29 Eads Deutschland Gmbh Mikromechanischer Drucksensor und Verfahren zum Selbsttest eines solchen
US7692148B2 (en) * 2005-01-26 2010-04-06 Analog Devices, Inc. Thermal sensor with thermal barrier
US20080164598A1 (en) * 2007-01-08 2008-07-10 Horst Theuss Semiconductor module
US7812960B2 (en) * 2007-10-16 2010-10-12 Judd Gardner Optical ultrasound device
DE102010040370B4 (de) * 2010-09-08 2016-10-06 Robert Bosch Gmbh MEMS-Mikrofon-Package
JP5874609B2 (ja) * 2012-03-27 2016-03-02 株式会社デンソー 半導体装置およびその製造方法
ITTO20130350A1 (it) * 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
US9513261B2 (en) * 2013-10-14 2016-12-06 Infineon Technologies Ag Photoacoustic gas sensor device and a method for analyzing gas
DE202015002315U1 (de) 2015-03-27 2015-05-06 Infineon Technologies Ag Gassensor
DE102015106373B4 (de) * 2015-04-24 2023-03-02 Infineon Technologies Ag Photoakustisches gassensormodul mit lichtemittereinheit und einer detektoreinheit
DE102016216875A1 (de) * 2015-09-07 2017-03-09 Infineon Technologies Ag Vorrichtung und Verfahren für eine In-situ-Kalibrierung eines photoakustischen Sensors
DE102016200497A1 (de) * 2016-01-15 2017-07-20 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
DE102016103646B4 (de) * 2016-01-22 2023-03-02 Infineon Technologies Ag Integriertes photoakustisches gassensormodul
US10347814B2 (en) 2016-04-01 2019-07-09 Infineon Technologies Ag MEMS heater or emitter structure for fast heating and cooling cycles
US9909926B2 (en) * 2016-05-31 2018-03-06 Ams Sensors Uk Limited Chemical sensor
US10451589B2 (en) 2016-06-03 2019-10-22 Infineon Technologies Ag Acoustic wave detector
US10466174B2 (en) * 2016-12-13 2019-11-05 Infineon Technologies Ag Gas analyzer including a radiation source comprising a black-body radiator with at least one through-hole and a collimator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996024831A1 (en) * 1995-02-10 1996-08-15 Nyfotek A/S Photoacoustic gas detector
WO2016105920A1 (en) * 2014-12-24 2016-06-30 Intel Corporation Gas sensing devices with photoacoustic detection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020122812A1 (de) 2020-09-01 2022-03-03 Infineon Technologies Ag Photoakustische Sensoren und zugehörige Herstellungsverfahren
US11686667B2 (en) 2020-09-01 2023-06-27 Infineon Technologies Ag Photoacoustic sensors and associated production methods
DE102020123199A1 (de) 2020-09-04 2022-03-10 Testo SE & Co. KGaA Photoakustische Sensoranordnung

Also Published As

Publication number Publication date
US20200057031A1 (en) 2020-02-20
US11105776B2 (en) 2021-08-31
CN110836855A (zh) 2020-02-25

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