DE102015116047A1 - Prüfvorrichtung und Steuerverfahren für eine Prüfvorrichtung - Google Patents

Prüfvorrichtung und Steuerverfahren für eine Prüfvorrichtung Download PDF

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Publication number
DE102015116047A1
DE102015116047A1 DE102015116047.1A DE102015116047A DE102015116047A1 DE 102015116047 A1 DE102015116047 A1 DE 102015116047A1 DE 102015116047 A DE102015116047 A DE 102015116047A DE 102015116047 A1 DE102015116047 A1 DE 102015116047A1
Authority
DE
Germany
Prior art keywords
secondary reflection
image
projection
pattern image
image recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102015116047.1A
Other languages
German (de)
English (en)
Inventor
Shimpei Fujii
Yuto Kawashima
Takayuki Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Publication of DE102015116047A1 publication Critical patent/DE102015116047A1/de
Granted legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08—Testing mechanical properties
    • G01M11/081—Testing mechanical properties by using a contact-less detection method, i.e. with a camera
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8829—Shadow projection or structured background, e.g. for deflectometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0635—Structured illumination, e.g. with grating

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  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE102015116047.1A 2015-01-13 2015-09-23 Prüfvorrichtung und Steuerverfahren für eine Prüfvorrichtung Granted DE102015116047A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-004253 2015-01-13
JP2015004253A JP6507653B2 (ja) 2015-01-13 2015-01-13 検査装置及び検査装置の制御方法

Publications (1)

Publication Number Publication Date
DE102015116047A1 true DE102015116047A1 (de) 2016-07-14

Family

ID=56233764

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102015116047.1A Granted DE102015116047A1 (de) 2015-01-13 2015-09-23 Prüfvorrichtung und Steuerverfahren für eine Prüfvorrichtung

Country Status (3)

Country Link
JP (1) JP6507653B2 (zh)
CN (1) CN105783784B (zh)
DE (1) DE102015116047A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114128418A (zh) * 2019-07-26 2022-03-01 株式会社富士 检查装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018146449A (ja) * 2017-03-07 2018-09-20 オムロン株式会社 ３次元形状計測装置及び３次元形状計測方法
JP6658625B2 (ja) * 2017-03-08 2020-03-04 オムロン株式会社 ３次元形状計測装置及び３次元形状計測方法
JP6702234B2 (ja) * 2017-03-10 2020-05-27 オムロン株式会社 ３次元測定装置、３次元測定方法、およびプログラム
JP6782194B2 (ja) * 2017-06-02 2020-11-11 株式会社日立製作所 自動点検システム
JP7053366B2 (ja) * 2018-05-10 2022-04-12 株式会社荏原製作所 検査装置及び検査方法
JP7145444B2 (ja) * 2018-06-20 2022-10-03 パナソニックＩｐマネジメント株式会社 投影システム、投影調整プログラム及び投影方法
WO2020005001A1 (ko) * 2018-06-28 2020-01-02 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
KR102267919B1 (ko) 2018-06-28 2021-06-23 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
US11428644B2 (en) 2018-11-27 2022-08-30 Koh Young Technology Inc. Method and electronic apparatus for displaying inspection result of board
US11682584B2 (en) 2018-12-26 2023-06-20 Camtek Ltd. Measuring buried layers
EP4036517B1 (en) * 2019-09-26 2023-08-23 Fuji Corporation Height measurement device
JP7364439B2 (ja) * 2019-11-25 2023-10-18 ファナック株式会社 Ｔｏｆセンサを用いた物体検出システム
JP7088232B2 (ja) * 2020-04-28 2022-06-21 オムロン株式会社 検査装置、検査方法、およびプログラム
KR102631655B1 (ko) * 2020-12-17 2024-02-01 (주)메티스 공정효율성을 높인 비전검사장치
KR20240060825A (ko) 2022-03-09 2024-05-08 야마하하쓰도키 가부시키가이샤 삼차원 계측용 연산 장치, 삼차원 계측용 프로그램, 기록 매체, 삼차원 계측 장치 및 삼차원 계측용 연산 방법

Citations (1)

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JP2012112952A (ja) 2010-11-19 2012-06-14 Koh Young Technology Inc 表面形状測定方法及び測定装置

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US5617209A (en) * 1995-04-27 1997-04-01 View Engineering, Inc. Method and system for triangulation-based, 3-D imaging utilizing an angled scaning beam of radiant energy
US5812269A (en) * 1996-07-29 1998-09-22 General Scanning, Inc. Triangulation-based 3-D imaging and processing method and system
JP2000329521A (ja) * 1999-05-18 2000-11-30 Nikon Corp パターン測定方法および位置合わせ方法
US7111783B2 (en) * 2004-06-25 2006-09-26 Board Of Trustees Operating Michigan State University Automated dimensional inspection
JP2006090756A (ja) * 2004-09-21 2006-04-06 Victor Co Of Japan Ltd カメラキャリブレーション装置
JP4611782B2 (ja) * 2005-03-28 2011-01-12 シチズンホールディングス株式会社 ３次元形状測定方法及び測定装置
US7898651B2 (en) * 2005-10-24 2011-03-01 General Electric Company Methods and apparatus for inspecting an object
JP4103921B2 (ja) * 2006-08-11 2008-06-18 オムロン株式会社 フィレット検査のための検査基準データの設定方法、およびこの方法を用いた基板外観検査装置
US7465916B2 (en) * 2006-10-19 2008-12-16 Fujikura Ltd. Optical detection sensor
JP2008309551A (ja) * 2007-06-13 2008-12-25 Nikon Corp 形状測定方法、記憶媒体、および形状測定装置
CN103134446B (zh) * 2008-02-26 2017-03-01 株式会社高永科技 三维形状测量装置及测量方法
JP2009281824A (ja) * 2008-05-21 2009-12-03 Hitachi Kokusai Electric Inc 試料検査装置
JP5765651B2 (ja) * 2011-02-01 2015-08-19 Ｊｕｋｉオートメーションシステムズ株式会社 ３次元測定装置
JP5869281B2 (ja) * 2011-04-11 2016-02-24 株式会社ミツトヨ 光学式プローブ
JP6071363B2 (ja) * 2012-09-19 2017-02-01 キヤノン株式会社 距離計測装置及び方法
US9857166B2 (en) * 2012-09-19 2018-01-02 Canon Kabushiki Kaisha Information processing apparatus and method for measuring a target object
US9041914B2 (en) * 2013-03-15 2015-05-26 Faro Technologies, Inc. Three-dimensional coordinate scanner and method of operation

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Publication number Priority date Publication date Assignee Title
JP2012112952A (ja) 2010-11-19 2012-06-14 Koh Young Technology Inc 表面形状測定方法及び測定装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114128418A (zh) * 2019-07-26 2022-03-01 株式会社富士 检查装置
CN114128418B (zh) * 2019-07-26 2023-10-20 株式会社富士 检查装置

Also Published As

Publication number Publication date
CN105783784B (zh) 2019-12-13
CN105783784A (zh) 2016-07-20
JP6507653B2 (ja) 2019-05-08
JP2016130663A (ja) 2016-07-21

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Representative=s name: HORN KLEIMANN WAITZHOFER PATENTANWAELTE PARTG , DE

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