DE102013212474A1 - Powder-containing component with a adhesion-reducing layer and process for its preparation - Google Patents
Powder-containing component with a adhesion-reducing layer and process for its preparation Download PDFInfo
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- DE102013212474A1 DE102013212474A1 DE102013212474.0A DE102013212474A DE102013212474A1 DE 102013212474 A1 DE102013212474 A1 DE 102013212474A1 DE 102013212474 A DE102013212474 A DE 102013212474A DE 102013212474 A1 DE102013212474 A1 DE 102013212474A1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/04—Tubes; Rings; Hollow bodies
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
Abstract
Die Erfindung betrifft eine Pulver (10) führende Komponente (11) wie zum Beispiel eine Rohrleitung oder einen Fördertrichter, auf der eine haftungsvermindernde Schicht (12) aufgebracht ist sowie ein Verfahren zu deren Herstellung. Erfindungsgemäß ist vorgesehen, dass in der Schicht zumindest in einer Decklage (22) Kunststoffpartikel (23) beispielsweise aus Teflon dispers verteilt sind und auch einen Oberflächenanteil der Oberfläche (25) ausbilden. Die metallische Matrix der Decklage (22) besteht aus Nickel. Die Paarung von Nickel und einem Kunststoff, vorzugsweise Teflon, hat den überraschenden Effekt, dass die Verklumpungsneigung des geförderten Pulvers vermindert wird. Daher kann auf Pulverzusätze verzichtet werden, die beispielsweise beim Kaltgasspritzen zu Verunreinigungen in der erzeugten Schicht führen können.The invention relates to a component (11) carrying powder (10), such as a pipeline or a conveying funnel, on which an adhesion-reducing layer (12) is applied, and a method for its production. According to the invention, it is provided that plastic particles (23), for example made of Teflon, are dispersed in the layer at least in one cover layer (22) and also form a surface portion of the surface (25). The metallic matrix of the cover layer (22) consists of nickel. The pairing of nickel and a plastic, preferably Teflon, has the surprising effect that the tendency of the conveyed powder to clump is reduced. It is therefore possible to dispense with powder additives, which can lead to contamination in the layer produced during cold gas spraying, for example.
Description
Die Erfindung betrifft eine Pulver führende Komponente einer Pulverförderanlage. Außerdem betrifft die Erfindung ein Verfahren zur Herstellung einer solchen Komponente. The invention relates to a powder-carrying component of a powder conveying system. Moreover, the invention relates to a method for producing such a component.
Pulverführende Komponenten von Pulverförderanlagen sind beispielsweise aus der
Um ein Verklumpen des Pulvers beim Kaltgasspritzen zu vermeiden, kann gemäß dem Stand der Technik ein weiteres Pulver aus Aluminiumoxid (Größenordnung F360) dem Pulver zugegeben werden. Dieser Zusatz verbessert die Fließeigenschaften des Pulvers, so dass ein Verbacken der Pulverpartikel weitgehend verhindert werden kann. Allerdings muss hingenommen werden, dass die Partikel aus Aluminiumoxid zumindest in geringen Mengen auch in die zu erzeugende Schicht eingebaut werden. Außerdem hat das Aluminiumoxid aufgrund der Härte abrasive Eigenschaften, weswegen die Komponenten der Pulverförderanlage einem gewissen Verschleiß unterworfen sind. In order to avoid clumping of the powder during cold gas spraying, according to the prior art, a further powder of aluminum oxide (order of magnitude F360) can be added to the powder. This addition improves the flow properties of the powder, so that a caking of the powder particles can be largely prevented. However, it must be accepted that the particles of alumina are at least incorporated in small quantities in the layer to be produced. In addition, due to the hardness of the alumina has abrasive properties, which is why the components of the powder conveyor system are subjected to a certain wear.
Die Aufgabe der Erfindung liegt daher darin, eine Komponente einer Pulverförderanlage anzugeben, mit der eine Förderung von reinem Pulver möglich ist, ohne dass dieses verklumpt. The object of the invention is to provide a component of a powder conveying system with which a promotion of pure powder is possible without this clumps.
Diese Aufgabe wird mit einer pulverführenden Komponente der eingangs angegebenen Art erfindungsgemäß dadurch gelöst, dass die Komponente der Pulverförderanlage mit einer die Haftung vermindernden Schicht ausgestattet wird, die zumindest eine die Haftung vermindernde Oberfläche zur Verfügung stellende Decklage aufweist. Diese Decklage weist eine metallische Matrix aus Nickel auf, in der Partikel aus einem Kunststoff eingelagert sind, die zumindest einen Teil der Oberfläche bilden. Gemäß einer besonderen Ausgestaltung der Erfindung sind diese eingelagerten Partikel aus PTFE (Teflon). Vorteilhaft werden die hervorragenden Gleitreibungseigenschaften des Metalls Nickel in Kombination mit den haftungsvermindernden Eigenschaften von Kunststoffen, insbesondere PTFE, genutzt, um die Reibung der Pulverpartikel an den Wänden der Komponente zu verringern. This object is achieved with a powder-carrying component of the type specified according to the invention that the component of the powder conveyor system is equipped with a adhesion-reducing layer having at least one adhesion-reducing surface-providing cover layer. This cover layer has a metallic matrix of nickel, in which particles of a plastic are embedded, which form at least part of the surface. According to a particular embodiment of the invention, these embedded particles of PTFE (Teflon). Advantageously, the excellent sliding friction properties of the metal nickel are used in combination with the adhesion-reducing properties of plastics, in particular PTFE, in order to reduce the friction of the powder particles on the walls of the component.
Bauteile mit die Haftung vermindernden Schichten sind an sich bekannt. Beispielsweise ist in der
Außerdem ist es gemäß der
Überraschend ist allerdings die Wirkung einer haftungsvermindernden Beschichtung der pulverführenden Komponenten, dass eine Verklumpung des geförderten Pulvers vermindert wird. Grundsätzlich wirken sich die haftungsvermindernden Eigenschaften der Wände ja nicht auf Pulverpartikel aus, die im Inneren der pulverführenden Komponente geführt werden. Der positive Effekt der haftungsvermindernden Eigenschaften auf die Verminderung der Verklumpungsneigung des geförderten Pulvers wird damit erklärt, dass die Mechanismen eines Anhaftens von Pulverpartikeln an den Wandungen der pulverführenden Komponente zu einer Initiierung der Verklumpungen des geförderten Pulvers einen wesentlichen Anteil beitragen. Werden diese Möglichkeiten einer Verklumpungsbildung bereits von vornherein unterdrückt, so fließt das Pulver weitgehend ungehindert durch die Pulverförderanlage, ohne dass es zu Verklumpungen kommt. Auf Zusätze, die die Verklumpungsneigung verhindern, kann damit vorteilhaft verzichtet werden. Surprisingly, however, the effect of an adhesion-reducing coating of the powder-carrying components that a clumping of the pumped powder is reduced. In principle, the adhesion-reducing properties of the walls do not affect powder particles which are guided inside the powder-carrying component. The positive effect of the adhesion reducing properties on the reduction of the tendency to agglomerate of the conveyed powder is explained by the fact that the mechanisms of adhesion of powder particles to the walls of the powder-carrying component contribute to initiation of the clumps of the conveyed powder. If these possibilities of a formation of clots are already suppressed from the outset, then the powder flows largely unhindered through the powder conveying system, without causing lumps. On additives that prevent the tendency to clump, can thus be advantageously dispensed with.
Gemäß einer Ausgestaltung der Erfindung kann die pulverführende Komponente aus einem metallischen Werkstoff bestehen. Metallische Werkstoffe lassen sich vorteilhaft auf einfachem Wege, beispielsweise elektrochemisch, mit Nickel beschichten, wobei bei einer elektrochemischen Beschichtung die Partikel aus Kunststoff mit in die sich ausbildende Schicht eingebaut werden können. According to one embodiment of the invention, the powder-carrying component may consist of a metallic material. Metallic materials can advantageously be coated in a simple way, for example electrochemically, with nickel, wherein in the case of an electrochemical coating the particles of plastic can be incorporated into the layer that forms.
Gemäß einer anderen Ausgestaltung der Erfindung ist vorgesehen, dass die Komponente aus einem Kunststoff besteht und auf dieser eine Startlage für das stromlose Beschichten mit Metall aufgebracht ist. Diese Startlage weist eine Matrix aus einem Kunstharz auf, in der metallische Partikel als Keime für das stromlose Beschichten eingelagert sind. Diese Keime eignen sich vorteilhaft dafür, dass ein stromloses metallisches Beschichten auch auf einem Kunststoffteil zur Erzeugung der die Haftung vermindernden Schicht verwendet werden kann. Als haftungsvermindernd sollen im Zusammenhang mit dieser Erfindung Schichten verstanden werden, die selbst eine geringere Haftung von Pulverpartikeln an der Oberfläche des beschichteten Bauteils erzeugen, als verglichen mit dem unbeschichteten Bauteil. Damit ist durch die Beschichtung der Effekt einer Haftungsverminderung zu verzeichnen. According to another embodiment of the invention, it is provided that the component consists of a plastic and on this a starting position for the electroless plating with metal is applied. This starting layer has a matrix of a synthetic resin in which metallic particles are incorporated as nuclei for electroless plating. These seeds are advantageous in that electroless metal plating can also be used on a plastic part to produce the adhesion-reducing layer. As adhesion-reducing layers should be understood in the context of this invention, which itself produce a lower adhesion of powder particles to the surface of the coated component, as compared with the uncoated component. As a result, the coating has the effect of reducing the adhesion.
Als metallische Matrix kommt Nickel zum Einsatz. Hierbei handelt es sich um ein Metall, was im Vergleich zu anderen Metallen eine Oberfläche mit an sich guten Haftungseigenschaften zur Verfügung stellt. Als Kunststoff kommt insbesondere Polytetrafluorethylen (auch PTFE oder Teflon genannt) zum Einsatz, dessen haftungsvermindernde Eigenschaften hinlänglich bekannt sind. Auch hier sind insbesondere abhängig vom Einsatzfall andere Kunststoffe denkbar wie z. B. Nylon. Nickel is used as the metallic matrix. This is a metal, which provides a surface with intrinsically good adhesion properties compared to other metals. The plastic used in particular polytetrafluoroethylene (also called PTFE or Teflon) is used, the adhesion-reducing properties are well known. Again, depending on the application, other plastics are conceivable, such as. Nylon.
Die Möglichkeit, auch Bauteile aus Kunststoff mit Schichten zu versehen, die die Haftung vermindern, macht vorteilhaft den Einsatz der Beschichtungen in großflächigen Pulver führenden Komponenten wie Rohrleitungen möglich. Die Komponenten können allerdings nicht in einem Bad beschichtet werden, weil diese im Allgemeinen zu große Abmessungen aufweisen. Die Beschichtung muss dann beispielsweise durch Brush-Plating erzeugt werden, wobei der Elektrolyt bei diesem Verfahren mittels einer Bürste oder einem schwammartigen Gebilde auf die Oberfläche des Bauteils aufgebracht wird. The ability to provide components made of plastic with layers that reduce the adhesion, makes advantageous the use of the coatings in large-scale powder-carrying components such as piping possible. However, the components can not be coated in a bath because they are generally too large in size. The coating must then be produced for example by brush-plating, wherein the electrolyte is applied in this method by means of a brush or a sponge-like structure on the surface of the component.
Außerdem wird die Aufgabe mit dem eingangs genannten Verfahren erfindungsgemäß dadurch gelöst, dass, wenn die Komponente aus einem Kunststoff besteht, auf der Pulver führenden Komponente eine Startlage mit einer Matrix aus einem Kunstharz aufgebracht wird, wobei in der Matrix metallische Partikel als Keime für ein anschließendes stromloses elektrochemisches Beschichten eingelagert werden. Im nächsten Schritt oder im ersten Schritt, wenn die Komponente aus einem Metall besteht, wird auf der Startlage chemisch oder elektrochemisch zumindest eine die Haftung vermindernde Oberfläche zur Verfügung stellende Decklage hergestellt, wobei die Decklage eine metallische Matrix aufweist, in der Partikel aus einem Kunststoff eingelagert sind, die zumindest einen Teil der Oberfläche bilden. Dies kann in der bereits beschriebenen Weise beispielsweise durch Brush-Plating erfolgen. Dabei können auch große Bauteile, wie z. B. Förderleitungen für Pulver, beschichtet werden. In addition, the object is achieved with the above-mentioned method according to the invention that, if the component consists of a plastic, on the powder component leading a starting layer is applied with a matrix of a synthetic resin, wherein in the matrix metallic particles as germs for a subsequent electroless plating can be stored. In the next step or in the first step, if the component consists of a metal, at least one adhesion-reducing surface-providing cover layer is produced chemically or electrochemically on the starting layer, the cover layer having a metallic matrix in which particles of a plastic are embedded are that form at least part of the surface. This can be done in the manner already described, for example by brush-plating. It also large components such. As conveying lines for powder coated.
Das erfindungsgemäße Verfahren kann überdies vorteilhaft ausgestaltet werden, wenn die Decklage einer Wärmebehandlung unterworfen wird, indem die Oberfläche mit Heißluft beaufschlagt wird, bis die Partikel aus Kunststoff zumindest an der Oberfläche angeschmolzen werden. Durch die Wärmebehandlung lässt sich das haftungsvermindernde Verhalten der Schicht vorteilhaft weiter verbessern. Durch das Anschmelzen der Partikel werden diese geglättet und können sich auch teilweise auf der metallischen Oberfläche, die durch die Matrix der Decklage gebildet wird, ausbreiten. Abhängig vom Abstand der durch die Oberfläche der Matrix herausragenden Partikel können jeweils benachbarte Partikel durch die Wärmebehandlung auch zusammengeschlossen werden. Bei einer genügend dichten Verteilung der Partikel an der Oberfläche lässt sich sogar eine zumindest im Wesentlichen geschlossene Teflonschicht herstellen, welche durch die stabile Matrix der Decklage mechanisch unterstützt und verstärkt wird. Hierbei wird der Vorteil der Metall-Kunststoff-Materialkombination in besonderer Weise ausgenutzt, wobei diese Werkstoffpaarung nicht nur günstige Eigenschaften einer Haftungsverminderung zur Verfügung stellen, sondern auch einer hohen Stabilität gegen mechanische Beanspruchung wie Abrasion durch Pulverpartikel. Daher ist diese Materialpaarung im besonderen Maße für den Pulver führende Komponenten geeignet. Moreover, the method according to the invention can be advantageously configured when the cover layer is subjected to a heat treatment by applying hot air to the surface until the particles of plastic are melted at least at the surface. By the heat treatment, the adhesion-reducing behavior of the layer can advantageously be further improved. By melting the particles they are smoothed and can also partially spread on the metallic surface formed by the matrix of the cover layer. Depending on the distance between the particles protruding through the surface of the matrix, neighboring particles can also be joined together by the heat treatment. With a sufficiently dense distribution of the particles on the surface, it is even possible to produce an at least substantially closed Teflon layer, which is mechanically supported and reinforced by the stable matrix of the cover layer. Here, the advantage of the metal-plastic material combination is exploited in a special way, this pair of materials not only provide favorable properties of a reduction in adhesion available, but also a high stability to mechanical stress such as abrasion by powder particles. Therefore, this pairing of materials is particularly suitable for the powder-carrying components.
Vorteilhaft können die metallischen Partikel in der Startlage aus Palladium und/oder Kupfer und/oder Nickel und/oder Eisen bestehen. Diese Metalle eignen sich vorteilhaft im besonderen Maße dazu, eine Keimbildung für eine anschließende stromlose Metallabscheidung katalytisch zu unterstützen. Insbesondere lassen sich mit diesen Katalysatormetallen Schichten aus Nickel abscheiden. Advantageously, the metallic particles in the starting position of palladium and / or copper and / or nickel and / or iron. These metals are particularly advantageous in particular to catalytically support nucleation for subsequent electroless metal deposition. In particular, layers of nickel can be deposited with these catalyst metals.
Vorteilhaft ist es weiterhin, wenn der Volumenanteil an metallischen Partikeln im Verhältnis zum Kunstharz der Matrix in der Startlage mindestens 60 und höchstens 85 % beträgt. Bei einem derartigen Füllgrad wird einerseits noch gewährleistet, dass die Matrix aus dem Harzwerkstoff die metallischen Partikel zuverlässig bindet. Andererseits bestehen an der Oberfläche der Startlage aber auch genügend metallische Partikel als Keimbildner zur Verfügung, so dass eine anschließende stromlose Beschichtung in wirtschaftlich hinnehmbarer Zeit erzeugt werden kann. It is furthermore advantageous if the volume fraction of metallic particles in relation to the synthetic resin of the matrix in the starting position is at least 60 and at most 85%. On the one hand, such a degree of filling ensures that the matrix of the resin material reliably binds the metallic particles. On the other hand, there are enough on the surface of the starting position metallic particles as nucleating agents available, so that a subsequent electroless plating can be produced in an economically acceptable time.
Vorteilhaft weist die Decklage eine Dicke von mindestens 5 und höchstens 15 µm auf. Hierbei ist aus technischer Sicht ein Kompromiss zu finden, der in diesem Dickenbereich gewährleistet ist. Zu berücksichtigen ist einerseits, dass die Schicht genügend dick sein muss, damit bei einer anschließenden Wärmebehandlung die thermische Belastung des Bauteils, falls es aus Kunststoff ist, durch Ableitung der Wärme in die Decklage verringert werden kann. Hierzu sind möglichst dicke Lagen vorzusehen. Andererseits darf die Decklage aufgrund von Eigenspannungen während der Wärmebehandlung nicht abplatzen. Daher darf die Decklage eine Dicke von 15 µm nicht überschreiten. Außerdem würden dickere Schichten auch teurer in der Herstellung sein (mehr Material, längere Herstellungszeit), so dass dickere Schichten in ihrer Herstellung unwirtschaftlicher wären. Zuletzt darf aufgrund der Anforderung an die mechanische Stabilität der Decklage die Schichtdicke nicht unter 5 µm betragen. Advantageously, the cover layer has a thickness of at least 5 and at most 15 microns. From a technical point of view, a compromise can be found which is guaranteed in this thickness range. On the one hand, it has to be taken into account that the layer has to be thick enough so that, in the case of a subsequent heat treatment, the thermal load of the component, if it is made of plastic, can be reduced by dissipating the heat into the cover layer. For this purpose, layers as thick as possible are to be provided. On the other hand, the cover layer must not flake off due to residual stresses during the heat treatment. Therefore, the top layer must not exceed a thickness of 15 microns. In addition, thicker layers would also be more expensive to produce (more material, longer production time), so that thicker layers would be less economical to manufacture. Finally, due to the requirement for the mechanical stability of the cover layer, the layer thickness must not be less than 5 μm.
Vorteilhaft kann zwischen der Startlage und der Decklage auch eine metallische Zwischenlage vorgesehen werden. Diese Zwischenlage ist vorteilhaft kostengünstiger in ihrer Herstellung, als die mit den Partikeln aus Kunststoff versehene Decklage. Daher können vorteilhaft auch größere Schichtdicken kostengünstig hergestellt werden. Außerdem verbessert eine Zwischenlage aus reinem Nickel oder einem anderen Metall die Haftung der Decklage auf der Startlage. Advantageously, a metallic intermediate layer can be provided between the starting position and the cover layer. This intermediate layer is advantageously less expensive to produce than the cover layer provided with the particles of plastic. Therefore, advantageously, larger layer thicknesses can be produced inexpensively. In addition, an intermediate layer of pure nickel or another metal improves the adhesion of the cover layer on the starting position.
Weitere Einzelheiten der Erfindung werden nachfolgend anhand der Zeichnung beschrieben. Gleiche oder sich entsprechende Zeichnungselemente sind in den einzelnen Figuren jeweils mit den gleichen Bezugszeichen versehen und werden nur insoweit mehrfach erläutert, wie sich Unterschiede zwischen den einzelnen Figuren ergeben. Es zeigen: Further details of the invention are described below with reference to the drawing. Identical or corresponding drawing elements are each provided with the same reference numerals in the individual figures and will only be explained several times to the extent that differences arise between the individual figures. Show it:
Der
Auf der Komponente
In
In
In
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- EP 484633 B1 [0002] EP 484633 B1 [0002]
- DE 29719716 U1 [0006] DE 29719716 U1 [0006]
- US 2011/0083885 A1 [0007] US 2011/0083885 A1 [0007]
Claims (11)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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DE102013212474.0A DE102013212474A1 (en) | 2013-06-27 | 2013-06-27 | Powder-containing component with a adhesion-reducing layer and process for its preparation |
PCT/EP2014/061705 WO2014206705A1 (en) | 2013-06-27 | 2014-06-05 | Powder-carrying component having an adhesion-reducing layer and method for production thereof |
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DE102013212474.0A DE102013212474A1 (en) | 2013-06-27 | 2013-06-27 | Powder-containing component with a adhesion-reducing layer and process for its preparation |
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DE102013212474A1 true DE102013212474A1 (en) | 2014-12-31 |
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DE102013212474.0A Withdrawn DE102013212474A1 (en) | 2013-06-27 | 2013-06-27 | Powder-containing component with a adhesion-reducing layer and process for its preparation |
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DE (1) | DE102013212474A1 (en) |
WO (1) | WO2014206705A1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3137578A1 (en) * | 1981-09-22 | 1983-04-14 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Mould or moulding tool, in particular for the production of plastic articles |
EP0484633A1 (en) | 1990-11-07 | 1992-05-13 | Combustion Engineering, Inc. | Connector pin and socket saver |
DE29719716U1 (en) | 1997-11-06 | 1997-12-11 | Picard Fa Carl Aug | Divider |
EP1543933A2 (en) * | 2003-12-16 | 2005-06-22 | Polyomnia S.r.l. | Moulds for the production of plastic abrasives and support thereof |
US20110083885A1 (en) | 2009-10-08 | 2011-04-14 | Tae Hyun Kim | Metal wiring structure comprising electroless nickel plating layer and method of fabricating the same |
EP2676993A1 (en) * | 2012-06-20 | 2013-12-25 | Siemens Aktiengesellschaft | Component with a coating that reduces adhesion and method for producing same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH623851A5 (en) * | 1975-10-04 | 1981-06-30 | Akzo Nv | |
US5711489A (en) * | 1994-08-18 | 1998-01-27 | Nihon Parkerizing Co., Ltd. | Electrostatic powder coating method and apparatus |
JP3867176B2 (en) * | 1996-09-24 | 2007-01-10 | アール・アイ・ディー株式会社 | Powder mass flow measuring device and electrostatic powder coating device using the same |
-
2013
- 2013-06-27 DE DE102013212474.0A patent/DE102013212474A1/en not_active Withdrawn
-
2014
- 2014-06-05 WO PCT/EP2014/061705 patent/WO2014206705A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3137578A1 (en) * | 1981-09-22 | 1983-04-14 | Messerschmitt-Bölkow-Blohm GmbH, 8000 München | Mould or moulding tool, in particular for the production of plastic articles |
EP0484633A1 (en) | 1990-11-07 | 1992-05-13 | Combustion Engineering, Inc. | Connector pin and socket saver |
DE29719716U1 (en) | 1997-11-06 | 1997-12-11 | Picard Fa Carl Aug | Divider |
EP1543933A2 (en) * | 2003-12-16 | 2005-06-22 | Polyomnia S.r.l. | Moulds for the production of plastic abrasives and support thereof |
US20110083885A1 (en) | 2009-10-08 | 2011-04-14 | Tae Hyun Kim | Metal wiring structure comprising electroless nickel plating layer and method of fabricating the same |
EP2676993A1 (en) * | 2012-06-20 | 2013-12-25 | Siemens Aktiengesellschaft | Component with a coating that reduces adhesion and method for producing same |
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