DE29719716U1 - Divider - Google Patents

Divider

Info

Publication number
DE29719716U1
DE29719716U1 DE1997219716 DE29719716U DE29719716U1 DE 29719716 U1 DE29719716 U1 DE 29719716U1 DE 1997219716 DE1997219716 DE 1997219716 DE 29719716 U DE29719716 U DE 29719716U DE 29719716 U1 DE29719716 U1 DE 29719716U1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
divider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1997219716
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Aug Picard & Co Kg 42857 Remscheid De GmbH
PICARD FA CARL AUG
Original Assignee
Carl Aug Picard & Co Kg 42857 Remscheid De GmbH
PICARD FA CARL AUG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
DE1997219716 1997-11-06 1997-11-06 Divider Expired - Lifetime DE29719716U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1997219716 DE29719716U1 (en) 1997-11-06 1997-11-06 Divider

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997219716 DE29719716U1 (en) 1997-11-06 1997-11-06 Divider

Publications (1)

Publication Number Publication Date
DE29719716U1 true DE29719716U1 (en) 1997-12-11

Family

ID=8048262

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997219716 Expired - Lifetime DE29719716U1 (en) 1997-11-06 1997-11-06 Divider

Country Status (1)

Country Link
DE (1) DE29719716U1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999053737A1 (en) * 1998-04-10 1999-10-21 R.E. Service Company, Inc. Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6130000A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper and steel components for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
DE10131887A1 (en) * 2001-07-04 2003-01-23 Dieter Backhaus Separating plate and method for producing a separator plate for a multilayer pressed
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
DE102005034499A1 (en) * 2005-07-20 2007-02-01 Backhaus, Monika Tool for pressing a multilayer press stack, in particular for arrangement in a press or packet structure for pressing multilayer or press for pressing or production of multilayers
EP2676993A1 (en) 2012-06-20 2013-12-25 Siemens Aktiengesellschaft Component with a coating that reduces adhesion and method for producing same
WO2014206705A1 (en) * 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Powder-carrying component having an adhesion-reducing layer and method for production thereof
WO2015032654A1 (en) * 2013-09-05 2015-03-12 Siemens Aktiengesellschaft Method for producing a layer by chemical or electrochemical coating

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999053737A1 (en) * 1998-04-10 1999-10-21 R.E. Service Company, Inc. Steel alloy separator sheets and copper/steel laminated sheets for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6130000A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper and steel components for use in manufacturing printed circuit boards
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6235404B1 (en) 1998-04-10 2001-05-22 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
DE10131887A1 (en) * 2001-07-04 2003-01-23 Dieter Backhaus Separating plate and method for producing a separator plate for a multilayer pressed
US6986950B2 (en) 2001-07-04 2006-01-17 Monika Backhaus Partition or method for producing a partition for a multilayer pressed packet
DE102005034499A1 (en) * 2005-07-20 2007-02-01 Backhaus, Monika Tool for pressing a multilayer press stack, in particular for arrangement in a press or packet structure for pressing multilayer or press for pressing or production of multilayers
DE102005034499B4 (en) * 2005-07-20 2011-03-31 Wickeder Westfalenstahl Gmbh Press pack assembly for pressing multilayer or press for pressing and production of multilayers
EP2676993A1 (en) 2012-06-20 2013-12-25 Siemens Aktiengesellschaft Component with a coating that reduces adhesion and method for producing same
WO2014206705A1 (en) * 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Powder-carrying component having an adhesion-reducing layer and method for production thereof
DE102013212474A1 (en) 2013-06-27 2014-12-31 Siemens Aktiengesellschaft Powder-carrying component with an adhesion-reducing layer and processes for their preparation
WO2015032654A1 (en) * 2013-09-05 2015-03-12 Siemens Aktiengesellschaft Method for producing a layer by chemical or electrochemical coating

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980129

R156 Lapse of ip right after 3 years

Effective date: 20010801