DE102012212996A1 - Method for manufacturing inlay for smart card, involves providing substrate with opening for receiving chip module, while integrated chip is provided to chip module with two contact areas that are spaced apart by encapsulation - Google Patents

Abstract

The method involves providing a substrate (1) with an opening (2) for receiving a chip module, while an integrated chip is provided to the chip module with two contact areas that are spaced apart from each other by an encapsulation. An antenna with a coil of a wire (6) is attached on a surface (1.1) of the substrate, where two wire ends (6.1) are arranged traversing the opening. The wire ends are arranged so that the traversed portions (6.2) of the wire ends are spaced apart at a distance corresponding to the distance of the contact areas of the chip module. The chip module is inserted through another second surface of the substrate, while the transverse portions of the wire ends are electrically connected with the contact areas.

Description

The invention relates to a method for producing an inlay for a chip card.

Documents, such as passports, identity documents and ID cards, in particular in the formats ID-1, ID-2 and ID-3 are often equipped with RFID systems (Radio Frequency Identification Device) according to the specification ICAO 9303. Normally, an RFID transponder with an antenna coil is used for this purpose. The antenna coil can be made by etching an aluminum or copper layer, by screen printing or ink jet printing with electrically conductive pastes. Alternatively, thin, enamel-insulated copper wires of 30 μm to 15 μm thickness are laid on an inner layer, a chip module is placed on the inner layer or a recess therein, and the wire ends are contacted with the chip module.

The European patent EP 0 880 754 B1 which the US Patent 6,233,818 discloses a process for contacting a wire conductor during fabrication of a transponder assembly disposed on a coil substrate and comprising a wire coil, wherein in a first phase the wire conductor is routed across a pad or portion for receiving the pad and fixing the wire conductor relative to the pad or the pad-associated area on the substrate; and wherein in a second phase, a connection of the wire conductor to the pad is performed with a connection instrument and the wire conductor is contacted while being fixed on the coil substrate and the wire conductor extends parallel to the surface plane of the turns of the wire coil.

It is an object of the invention to provide an improved method for producing an inlay for a chip card.

The object is achieved by a method according to claim 1.

Advantageous embodiments are the subject of the dependent claims.

According to the invention, a method for producing an inlay for a chip card comprises:

• Providing a substrate with a breakthrough for receiving a chip module,
• Providing a chip module comprising an integrated chip with a potting and at least two contact areas, which are spaced from each other by the potting,
• Fixing an antenna on a surface of the substrate, for example by means of an ultrasonic sonotrode, the antenna comprising at least one turn of a wire, wherein two wire ends are arranged crossing the aperture so that the transverse parts of the wire ends are spaced from each other by a distance corresponds to the removal of the contact areas of the chip module,
• Inserting the chip module into the aperture through a second surface of the substrate opposite the first surface so that the potting is between the crossing portions of the wire ends and the contact portions are adjacent to the crossing portions;
• - electrically contacting the transverse parts of the wire ends with the contact areas.

The substrate may be part of a multiple-use sheet of plastic, such as PVC or PC, or of paper or a paper-like material of natural or synthetic fibers.

In one embodiment of the invention, the chip module is placed on a bonding plate and fixed on the bonding plate by vacuum before the substrate is placed over the chip module to insert the chip module into the aperture. This allows a precise and reliable positioning of the chip module.

The chip module can be punched out of a modular belt before it is inserted into the breakthrough.

In one embodiment of the invention, the chip module is inserted into a receiving recess in the bonding plate, so that the precision and reliability of the positioning is improved.

The transverse parts of the wire ends can be electrically contacted to the contact areas by thermal bonding, ultrasonic welding, soldering, laser soldering, laser welding, gluing or crimping.

The multiple-benefit sheet may comprise a number of substrates arranged in at least two rows and at least two columns, in particular in three rows and eight columns, so as to yield 24 substrates per multiple-use sheet.

In one embodiment of the invention, a plurality of substrates and chip modules may be processed on a conveyor, wherein the conveyor operatively advances the multiple-use sheet by whole steps or half steps, which are performed with the whole length and the half length of the multiple-use sheet, so that the multiple-use sheet is fed to various processing tools and units to perform the process. While the conveyor and the multiple-use sheet remain in one position, the substrates on the respective multiple-sheet or part thereof can be processed sequentially, simultaneously or almost simultaneously. In the latter case, at least two of the substrates are processed simultaneously by appropriate tools or machining units.

• – erster Schritt: Befestigen jeweils einer Antenne auf der ersten Oberfläche jedes Substrats auf einer vorderen, ersten Hälfte des Mehrfachnutzen-Bogens mittels einer Vielzahl von Ultraschall-Sonotroden. Die vordere Hälfte bezeichnet diejenige Hälfte des Mehrfachnutzen-Bogens, die in die Bewegungsrichtung der Fördereinrichtung weist.
• – zweiter Schritt: Vorschub der Fördereinrichtung um einen halben Schritt und Befestigen jeweils einer Antenne auf der ersten Oberfläche jedes Substrats auf einer hinteren, zweiten Hälfte des Mehrfachnutzen-Bogens mittels der Vielzahl von Ultraschall-Sonotroden und Platzieren einer Vielzahl von Chip-Modulen entsprechend der halben Anzahl der Substrate des Mehrfachnutzen-Bogens auf ein erstes Drittel einer Bonding-Platte. Die hintere Hälfte bezeichnet diejenige Hälfte des Mehrfachnutzen-Bogens, die entgegen der Bewegungsrichtung der Fördereinrichtung weist.
• – dritter Schritt: Vorschub der Fördereinrichtung um einen ganzen Schritt, wobei die hintere, zweite Hälfte des Mehrfachnutzen-Bogens über dem ersten Drittel der Bonding-Platte platziert wird, Einsetzen der Chip-Module in die Durchbrüche und elektrisch Kontaktieren der querenden Teile der Drahtenden mit den Kontaktbereichen, und Platzieren einer Vielzahl von Chip-Modulen entsprechend der halben Anzahl der Substrate des Mehrfachnutzen-Bogens auf ein drittes Drittel der Bonding-Platte. Das erste Drittel der Bonding-Platte ist dasjenige Drittel, welches der Mehrfachnutzen-Bogen während des Vorschubs durch die Fördereinrichtung zuerst erreicht.
• – vierter Schritt: Vorschub der Fördereinrichtung um einen halben Schritt, wobei die vordere, erste Hälfte des Mehrfachnutzen-Bogens über dem dritten Drittel der Bonding-Platte platziert wird, Einsetzen der Chip-Module in die Durchbrüche und elektrisch Kontaktieren der querenden Teile der Drahtenden mit den Kontaktbereichen. Das dritte Drittel der Bonding-Platte ist dasjenige Drittel, welches der Mehrfachnutzen-Bogen während des Vorschubs durch die Fördereinrichtung zuletzt erreicht. Das heißt, um ausgehend vom ersten Drittel das dritte Drittel zu erreichen, muss die Fördereinrichtung den Mehrfachnutzen-Bogen über das zweite Drittel bewegen, das zwischen dem ersten Drittel und dem dritten Drittel angeordnet ist.
• – fünfter Schritt: Vorschub der Fördereinrichtung um einen ganzen Schritt, wobei der Mehrfachnutzen-Bogen einem nachfolgenden Prozess zugeführt wird.

In one embodiment of the invention, the method comprises the following steps:

• - First step: Attaching each one antenna on the first surface of each substrate on a front, first half of the multi-utility sheet by means of a plurality of ultrasonic sonotrodes. The front half indicates that half of the multiple-use sheet which points in the direction of movement of the conveyor.
• - Second step: advancing the conveyor by half a step and fixing each one antenna on the first surface of each substrate on a rear, second half of the multi-utility sheet by means of the plurality of ultrasonic sonotrodes and placing a plurality of chip modules corresponding to half Number of substrates of the multiple-use sheet on a first third of a bonding plate. The rear half designates that half of the multiple-use sheet, which faces counter to the direction of movement of the conveyor.
• - third step: advancing the conveyor by a full step, with the rear, second half of the multiple-use sheet is placed over the first third of the bonding plate, inserting the chip modules in the openings and electrically contacting the transverse parts of the wire ends with the contact areas, and placing a plurality of chip modules corresponding to half the number of substrates of the multiple-use sheet on a third third of the bonding plate. The first third of the bonding plate is the one third that the multiple-use sheet first reaches during the feed through the conveyor.
• Fourth step: advancing the conveyor by half a step, placing the front, first half of the multiple-use arch over the third third of the bonding plate, inserting the chip modules into the apertures, and electrically contacting the crossing parts of the wire ends the contact areas. The third third of the bonding plate is the third that the multiple-use sheet last reaches during feed through the conveyor. That is, in order to reach the third third from the first third, the conveyor must move the multiple-use sheet over the second third located between the first third and the third third.
• - fifth step: advancing the conveyor by one full step, the multiple-use sheet being fed to a subsequent process.

In one embodiment of the invention, during the execution of the third step on a multiple-use sheet, the first step is performed on a subsequent multiple-use sheet, wherein during the execution of the fourth step on a multiple-use sheet, the second step is performed on a subsequent multiple-use sheet is performed, wherein during the execution of the fifth step on a multiple-benefit sheet of the third step is performed on a subsequent multiple-benefit sheet. This results in a continuous process in which any number of consecutive multiple-benefit sheets can be processed. In this process, the conveyor alternately conveys the multiple-use sheets by half a step and a full step.

The multiple-use sheet may be pre-perforated to facilitate later separation of the substrates.

The wider scope of applicability of the present invention will become apparent from the following detailed description. However, the detailed description and the specific examples are merely given to indicate preferred embodiments and are given for clarification. A variety of variations and modifications within the general concept of the invention will become apparent to those skilled in the art from this detailed description.

The present invention will become more fully understood from the ensuing detailed description and the accompanying drawings, which are given by way of illustration only, and thus are not limitative of the present invention.

Showing:

1 3 is a schematic view of a substrate with an opening and two wire ends of an antenna, which are arranged on the substrate above the opening,

2 a schematic view of a chip module,

3 a schematic view of the substrate with the chip module, which is inserted into the breakthrough,

4 a schematic view of an apparatus for the production of inlays for chip cards during a first step of a method for producing the inlays,

5 a schematic view of the device for the production of inlays for chip cards during a second step of the method for producing the inlays,

6 a schematic view of the device for the production of inlays for chip cards during a third step of the method for producing the inlays,

7 a schematic view of the device for the production of inlays for chip cards during a fourth step of the method for producing the inlays,

8th a schematic view of the device for the production of inlays for chip cards during a fifth step of the method for producing the inlays,

9 a schematic plan view of the device for the production of inlays for chip cards,

10 a schematic side view of the device for the production of inlays for chip cards,

11 a schematic plan view of the device for the production of inlays for chip cards during the fourth step S4 in the processing of a first row,

12 a schematic plan view of the device for the production of inlays for chip cards during the fourth step S4 when processing a second series,

13 a schematic plan view of the device for the production of inlays for chip cards during the fourth step S4 in the processing of a third row, and

14 a schematic plan view of the device for the production of inlays for chip cards after completion of the fourth step S4.

Corresponding parts are provided in all figures with the same reference numerals.

1 is a schematic view of a substrate 1 which may be used to make an inlay for a smart card, such as a passport, identity document, ID card, credit card or the like, particularly in one of the ID-1, ID-2 or ID-3 formats. The substrate 1 includes a breakthrough 2 , which is for receiving a chip module 3 is dimensioned in 2 is shown. The chip module 3 includes an integrated chip with a potting 4 and at least two contact areas 5 by the potting 4 spaced apart from each other.

1 shows that the antenna at least one turn of a wire 6 comprising, by means of an ultrasonic sonotrode 10 (see 4 to 10 ) on a first surface 1.1 is fixed, for example, a front side of the substrate 1 where two wire ends 6.1 the break through 2 transverse are arranged so that the crossing parts 6.2 the wire ends 6.1 spaced from each other with a distance corresponding to the distance between the contact areas 5 of the chip module 3 corresponds. The wire ends 6.1 be on both sides of the breakthrough 2 by means of the ultrasonic sonotrode 10 on the substrate 1 fixed and / or in the substrate 1 embedded.

The substrate 1 is part of a multiple-benefit sheet 7 made of plastic, such as PVC or PC or paper or a paper-like material.

3 is a schematic view of the substrate 1 with the chip module 3 that in the breakthrough 2 is used. The chip module 3 is through a second surface, for example a backside of the substrate 1 opposite the first surface 1.1 in the breakthrough 2 so used that the potting 4 between the crossing parts 6.2 the wire ends 6.1 lies and the contact areas 5 to the crossing parts 6.2 adjacent, for example, underneath. After inserting the chip module 4 become the crossing parts 6.2 the wire ends 6.1 electrically with the contact areas 5 contacted, for example, by thermal bonding, ultrasonic welding, soldering, laser soldering, laser welding, gluing or clamping.

4 shows a schematic view of a device 8th for manufacturing inlays for chip cards during a first step S1 of a method for producing the inlays.

A multiple-benefit bow 7 comprising three rows and eight columns of pre-perforated substrates 1 is by means of a conveyor (not shown) on a wire embedding plate 9 placed. The conveyor pushes the multiple-benefit bow 7 operationally by whole steps or half steps ahead, with the whole length and half the length of the multiple-use arch 7 correspond, that is a whole step the conveyor pushes the multiple-benefit bow 7 by its full length within the device 8th in front. A half step of the conveyor pushes the multiple-use bow 7 by half its length inside the device 8th in front.

Im in 4 The first step S1 of the method, shown in FIG. 1, is in each case an antenna on the first surface 1.1 every substrate 1 on a front first half 7.1 of the multiple-benefit bow 7 by means of a large number of ultrasonic sonotrodes 10 attached. The front half 7.1 denotes the half 7.1 . 7.2 of the multiple-benefit bow 7 pointing in the direction of movement M of the conveyor. In the illustrated embodiment, there are four ultrasonic sonotrodes 10 arranged to simultaneously antennas on the substrates 1 in the same row but in different columns of one of the halves 7.1 . 7.2 of the multiple-benefit bow 7 to move before proceeding to the next row. In alternative embodiments, other numbers of ultrasonic sonotrodes 10 be provided to lay antennas sequentially and / or simultaneously.

5 is a schematic view of the device 8th for manufacturing inlays for chip cards during a second step S2 of the method for producing the inlays. In the second step S2, the conveyor advances by half a step and pushes the multiple-use sheet 7 so its half length on the wire embedding plate 9 in the field of ultrasonic sonotrodes 10 , One antenna will then be on the first surface 1.1 every substrate 1 on a back second half 7.2 of the multiple-benefit bow 7 by means of the plurality of ultrasonic sonotrodes 10 attached. The back half 7.2 denotes the half 7.2 . 7.1 of the multiple-benefit bow 7 , which points counter to the direction of movement M of the conveyor.

A variety of chip modules 3 corresponding to half the number of substrates 1 on the multiple-benefit bow 7 gets out of a module band 11 (see 9 . 10 ) punched out and on a first third 13.1 a bonding plate 13 by means of a positioning tool 12 placed. The first third 13.1 the bonding plate 13 is that third 13.1 . 13.2 . 13.3 which is the multiple-benefit bow 7 reached during the feed by the conveyor in the direction of movement M first. On the first third 13.1 follow the second third 13.2 and the third third 13.3 in the direction of movement M.

The bonding plate 13 can for the positioning of the chip modules 3 have respective receiving recesses (not shown). Furthermore, the chip modules 3 by means of vacuum on the bonding plate 13 be fixed.

6 is a schematic view of the device 8th for manufacturing inlays for chip cards during a third step S3 of the method for producing the inlays.

In the third step S3, the conveyor moves by one complete step and thus places the rear, second half 7.2 of the multiple-benefit bow 7 over the first third 13.1 the bonding plate 13 and move a subsequent multiple-benefit arc 7 ' in the position for performing the first step S1.

The one on the first third 13.1 the bonding plate 13 located chip modules 3 can now in the breakthroughs 2 the substrates 1 on the back, second half 7.2 of the multiple-benefit bow 7 be used by the bonding plate 13 raised or the multiple-benefit bow 7 is lowered. Once the chip modules 3 in the breakthroughs 2 are used, the crossing parts 6.2 the wire ends 6.1 by means of one or more contacting units 14 electrically with the contact areas 5 connected. A variety of chip modules 3 corresponding to half the number of substrates 1 on the multiple-benefit bow 7 gets out of the module band 11 punched out and on the third third 13.3 the bonding plate 13 using the positioning tool 12 placed. Meanwhile, the first step S1 of the process on the subsequent multiple-use sheet 7 ' carried out.

7 is a schematic view of the device 8th for manufacturing inlays for chip cards during a fourth step S4 of the process for producing the inlays. The conveyor advances by half a step, placing the front, first half 7.1 of the multiple-benefit bow 7 over the third third 13.3 the bonding plate 13 and move the subsequent multiple-benefit bow 7 ' in the position for performing the second step S2.

The third third 13.3 the bonding plate 13 lying chip modules 3 can now in the breakthroughs 2 the substrates 1 on the front, first half 7.1 of the multiple-benefit bow 7 be used by the bonding plate 13 raised or the multiple-benefit bow 7 is lowered. Once the chip modules 3 in the breakthroughs 2 are used, the crossing parts 6.2 the wire ends 6.1 by means of one or more contacting units 14 electrically with the contact areas 5 connected, which can be moved for this purpose with and against the direction of movement M of the conveyor. A variety of chip modules 3 corresponding to half the number of substrates 1 on the multiple-benefit bow 7 gets out of the module band 11 punched out and on the first third 13.1 the bonding plate 13 using the positioning tool 12 placed. Meanwhile, the first step S1 of the process on the subsequent multiple-use sheet 7 ' performed while another multiple-benefit bow 7 '' for feeding into the device 8th can be prepared.

8th is a schematic view of the device 8th for manufacturing inlays for chip cards during a fifth step of the process for the production of the inlays. The conveyor moves by one full step, thus creating the multiple-use bow 7 to a subsequent process, moves the subsequent multiple-benefit arc 7 ' in the position for performing the third step S3 and the subsequent subsequent multiple-benefit arc 7 '' in the position for performing the first step S1.

The process continues with alternate execution of steps S4 and S5 until the desired number of inlays is established.

9 is a schematic plan view of the device 8th for the production of inlays for chip cards in the area of the bonding plate 13 , 10 is a corresponding schematic side view. A punching tool 15 is for punching out chip modules 3 from the module tape 11 arranged, which the punching tool 15 from a module dispenser 11.1 is supplied. The empty module tape 11 will then be on a tape reel 11.2 wound. The positioning tool 12 and the contacting tool 14 can with and against the direction of movement M of the conveyor and in the transverse direction by means of a linear motor Verfahrisches 16 or another two-dimensional drive means are moved.

11 is a schematic plan view of the device 8th for the production of inlays for chip cards in the area of the bonding plate 13 during the fourth step S4. The contacting unit 14 contacts the crossing parts 6.2 the wire ends 6.1 the substrates 1 in a first row 7.1.1 the front, first half 7.1 of the multiple-benefit bow 7 electrically with the contact areas 5 the chip modules 3 in the third third 13.3 the bonding plate 13 while the positioning tool 12 simultaneously the chip modules 3 for the first row of the back, second half 7'.2 of the subsequent multiple-benefit sheet 7 ' in the first row 13.1.1 of the first third 13.1 the bonding plate 13 placed.

12 is a schematic plan view of the device 8th for making inlays for chip cards during the fourth step S4. Starting from the in 11 The situation shown has the linear motor traversing table 16 the contacting unit 14 and the positioning tool 12 moved in the transverse direction, so that they can now edit a second row. The contacting unit 14 contacts the crossing parts 6.2 the wire ends 6.1 the substrates 1 in a second row 7.1.2 the front, first half 7.1 of the multiple-benefit bow 7 electrically with the contact areas 5 the chip modules 3 in the third third 13.3 the bonding plate 13 while the positioning tool 12 simultaneously the chip modules 3 for the second row of the back, second half 7'.2 of the subsequent multiple-benefit sheet 7 ' in the second row 13.1.2 of the first third 13.1 the bonding plate 13 placed.

13 is a schematic plan view of the device 8th for making inlays for chip cards during the fourth step S4. Starting from the in 12 The situation shown has the linear motor traversing table 16 the contacting unit 14 and the positioning tool 12 moved further in the transverse direction, so that they can now edit a third row. The contacting unit 14 contacts the crossing parts 6.2 the wire ends 6.1 the substrates 1 in a third row 7.1.3 the front, first half 7.1 of the multiple-benefit bow 7 electrically with the contact areas 5 the chip modules 3 in the third third 13.3 the bonding plate 13 while the positioning tool 12 simultaneously the chip modules 3 for the third row of the back, second half 7'.2 of the subsequent multiple-benefit sheet 7 ' in the third row 13.1.3 of the first third 13.1 the bonding plate 13 placed.

14 is a schematic plan view of the device 8th for the production of inlays for chip cards after completion of the fourth step S4. All three rows have been machined and the linear motor traversing table 16 has the contacting unit 14 and the positioning tool 12 moved transversely and longitudinally in their respective basic positions.

The control of the movement of the contacting unit 14 and the positioning tool 12 according to the 11 to 13 enables simultaneous processing of the substrates 1 a multiple-benefit bow 7 during a processing step for the subsequent multiple-benefit sheet 7 ' is prepared, with collisions between the contacting unit 14 and the positioning tool 12 be avoided.

The third step S3 or the fifth step S5 can be carried out in an analogous manner, wherein the contacting unit 14 In the first third 13.1 and the positioning tool in the third third 13.3 operate.

The method in which the conveyor the multiple-benefit sheet 7 alternately moved by half and full steps and / or at which the movement of the contacting unit 14 and the positioning tool 12 according to the 11 to 13 is not directed to the production of inlays by laying antennas and inserting and contacting chip modules 3 limited. It can also be used for efficient assembly line production of other items. In particular, the method could be independent of the structure of the chip module to be inserted in the breakthrough 3 or chips and regardless of the exact number and location of the wire ends 6.1 and contact areas 5 be used.

LIST OF REFERENCE NUMBERS

1

substratum

1.1

first surface

2

breakthrough

3

Chip module

4

grouting

5

contact area

6

wire

6.1

wire end

6.2

crossing part

7

Multiple-up sheet

7.1

front, first half

7.1.1

first row

7.1.2

second row

7.1.3

third row

7.2

rear, second half

7 ', 7' '

subsequent multiple-benefit bow

7'.1

front, first half

7'.2

rear, second half

8th

Device for producing inlays

9

Wire embedding plate

10

Ultrasonic horn

11

Module Band

11.1

Module Dispenser

11.2

Belt retractor

12

Positioning tool

13

Bonding plate

13.1

first third

13.1.1

first row

13.1.2

second row

13.1.3

third row

13.2

second third

13.3

third third

14

contacting unit

15

punching tool

16

Linear motor positioning stage

M

movement direction

S1

first step

S2

second step

S3

Third step

S4

fourth step

S5

fifth step

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 0880754 B1 [0003]
• US 6233818 [0003]

Claims (10)

Method for producing an inlay for a chip card, the method comprising: providing a substrate ( 1 ) with a breakthrough ( 2 ) for receiving a chip module ( 3 ), - providing a chip module ( 3 ) comprising an integrated chip with a potting ( 4 ) and at least two contact areas ( 5 ) separated from each other by the potting ( 4 ), - fixing an antenna comprising at least one turn of a wire ( 6 ) on a first surface ( 1.1 ) of the substrate ( 1 ), whereby two wire ends ( 6.1 ) the break through ( 2 ) are arranged transversely so that the crossing parts ( 6.2 ) of the wire ends ( 6.1 ) are spaced from each other by a distance associated with the removal of the contact areas ( 5 ) of the chip module ( 3 ), - inserting the chip module ( 3 ) through a second surface of the substrate ( 1 ), the first surface ( 1.1 ), into the breakthrough ( 2 ), so that the potting ( 4 ) between the crossing parts ( 6.2 ) of the wire ends ( 6.1 ) and the contact areas ( 5 ) to the crossing parts ( 6.2 ), - electrically contacting the crossing parts ( 6.2 ) of the wire ends ( 6.1 ) with the contact areas ( 5 ). Method according to claim 1, characterized in that the substrate ( 1 ) Part of a multiple-benefit sheet ( 7 ) comprising plastic, for example PVC or PC, or comprising paper or a paper-like material Method according to one of claims 1 or 2, characterized in that the chip module ( 3 ) on a bonding plate ( 13 ) and on the bonding plate ( 13 ) fixed by vacuum before the substrate ( 1 ) above the chip module ( 3 ) is arranged to the chip module ( 3 ) in the breakthrough ( 2 ). Method according to one of the preceding claims, characterized in that the chip module ( 3 ) from a modular belt ( 11 ) is punched out before it breaks into the ( 2 ) is used. Method according to one of claims 3 or 4, characterized in that the chip module in a receiving recess in the bonding plate ( 13 ) is used. Method according to one of the preceding claims, characterized in that the transverse parts ( 6.2 ) of the wire ends ( 6.1 ) by thermal bonding, ultrasonic welding, soldering, laser soldering, laser welding, gluing or clamping electrically with the contact areas ( 5 ) are contacted. Method according to one of claims 2 to 6, characterized in that the multiple-use sheet ( 7 ) a number of substrates ( 1 ) arranged in at least two rows and at least two columns. Method according to claim 7, characterized in that a plurality of substrates ( 1 ) and chip modules ( 3 ) are processed on a conveyor, wherein the conveyor the multiple-benefit sheet ( 7 ) Operatively advances by whole steps or half steps, with the whole length and the half length of the multiple-benefit-sheet ( 7 ) correspond. Method according to claim 8, characterized by: - a first step (S1): attaching in each case one antenna to the first surface ( 1.1 ) of each substrate ( 1 ) on a front, first half ( 7.1 ) of the multiple-benefit sheet ( 7 ) by means of a plurality of ultrasonic sonotrodes ( 10 ), - a second step (S2): advancing the conveyor by half a step and attaching in each case an antenna on the first surface (S2) 1.1 ) of each substrate ( 1 ) on a back, second half ( 7.2 ) of the multiple-benefit sheet ( 7 ) by means of the plurality of ultrasonic sonotrodes ( 10 ) and placing a plurality of chip modules ( 3 ) corresponding to half the number of substrates ( 1 ) of the multiple-benefit sheet ( 7 ) to a first third ( 13.1 ) a bonding plate ( 13 ), - a third step (S3): advancing the conveyor by a whole step, wherein the rear, second half (S3) 7.2 ) of the multiple-benefit sheet ( 7 ) over the first third ( 13.1 ) of the bonding plate ( 13 ), inserting the chip modules ( 3 ) in the breakthroughs ( 2 ) and electrically contacting the crossing parts ( 6.2 ) of the wire ends ( 6.1 ) with the contact areas ( 5 ), and placing a variety of chip modules ( 3 ) corresponding to half the number of substrates ( 1 ) of the multiple-benefit sheet ( 7 ) to a third third ( 13.3 ) of the bonding plate ( 13 ), - a fourth step (S4): advancing the conveyor by half a step, wherein the front, first half (S4) 7.1 ) of the multiple-benefit sheet ( 7 ) over the third third ( 13.3 ) of the bonding plate ( 13 ), inserting the chip modules ( 3 ) in the breakthroughs ( 2 ) and electrically contacting the crossing parts ( 6.2 ) of the wire ends ( 6.1 ) with the contact areas ( 5 ), - a fifth step (S5): feeding of the conveyor by a whole step for feeding the multiple-use sheet ( 7 ) to a subsequent process. A method according to claim 9, characterized in that during the execution of the third step (S3) on a multiple-use sheet ( 7 . 7 ' ) the first step (S1) on a subsequent multiple-benefit sheet ( 7 ' . 7 '' ) is carried out, wherein during the execution of the fourth step (S4) on a multiple-use sheet ( 7 . 7 ' ) the second step (S2) on a subsequent multiple-use sheet ( 7 ' . 7 '' ) is carried out, wherein during the execution of the fifth step (S5) on a multiple-use sheet ( 7 . 7 ' ) the third step (S3) on a subsequent multiple-use sheet ( 7 ' . 7 '' ) is performed.

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