DE102011051335A8 - Substrathalteeinrichtung - Google Patents
Substrathalteeinrichtung Download PDFInfo
- Publication number
- DE102011051335A8 DE102011051335A8 DE201110051335 DE102011051335A DE102011051335A8 DE 102011051335 A8 DE102011051335 A8 DE 102011051335A8 DE 201110051335 DE201110051335 DE 201110051335 DE 102011051335 A DE102011051335 A DE 102011051335A DE 102011051335 A8 DE102011051335 A8 DE 102011051335A8
- Authority
- DE
- Germany
- Prior art keywords
- substrate holder
- holder
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011051335A DE102011051335A1 (de) | 2011-06-26 | 2011-06-26 | Substrathalteeinrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011051335A DE102011051335A1 (de) | 2011-06-26 | 2011-06-26 | Substrathalteeinrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102011051335A1 DE102011051335A1 (de) | 2013-01-10 |
DE102011051335A8 true DE102011051335A8 (de) | 2013-03-21 |
Family
ID=47426325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102011051335A Withdrawn DE102011051335A1 (de) | 2011-06-26 | 2011-06-26 | Substrathalteeinrichtung |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102011051335A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103280420B (zh) * | 2013-06-04 | 2015-11-25 | 上海华力微电子有限公司 | 晶圆承载装置及晶圆倒片的方法 |
CN113066744B (zh) * | 2021-03-19 | 2021-11-16 | 江苏新智达新能源设备有限公司 | 真空烧结炉的料盘转运机构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3625038A1 (de) * | 1986-07-24 | 1988-01-28 | Siemens Ag | Vorrichtung zur halterung von flachbaugruppen |
DE3738165A1 (de) * | 1987-11-10 | 1989-05-24 | Siemens Ag | Verfahren und anordnung zum umsetzen von plattenfoermigen werkstuecken |
US5435075A (en) * | 1992-04-07 | 1995-07-25 | Tokyo Electron Limited | Spindrier |
US5971156A (en) * | 1997-09-05 | 1999-10-26 | Kinetrix, Inc. | Semiconductor chip tray with rolling contact retention mechanism |
DE10304174A1 (de) * | 2002-02-25 | 2003-09-11 | Samsung Electronics Co Ltd | Vorrichtung und Verfahren zur Waferrückseiteninspektion |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080111206A1 (en) | 2006-11-10 | 2008-05-15 | Evergreen Solar, Inc. | Substrate with Two Sided Doping and Method of Producing the Same |
DE102007057891A1 (de) | 2006-12-01 | 2008-07-03 | Ingenia Gmbh | Wafergreifer und Verfahren zu seiner Ansteuerung |
-
2011
- 2011-06-26 DE DE102011051335A patent/DE102011051335A1/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3625038A1 (de) * | 1986-07-24 | 1988-01-28 | Siemens Ag | Vorrichtung zur halterung von flachbaugruppen |
DE3738165A1 (de) * | 1987-11-10 | 1989-05-24 | Siemens Ag | Verfahren und anordnung zum umsetzen von plattenfoermigen werkstuecken |
US5435075A (en) * | 1992-04-07 | 1995-07-25 | Tokyo Electron Limited | Spindrier |
US5971156A (en) * | 1997-09-05 | 1999-10-26 | Kinetrix, Inc. | Semiconductor chip tray with rolling contact retention mechanism |
DE10304174A1 (de) * | 2002-02-25 | 2003-09-11 | Samsung Electronics Co Ltd | Vorrichtung und Verfahren zur Waferrückseiteninspektion |
Also Published As
Publication number | Publication date |
---|---|
DE102011051335A1 (de) | 2013-01-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20140101 |