DE102010046876B4 - Slide-in module for high-power LEDs - Google Patents
Slide-in module for high-power LEDs Download PDFInfo
- Publication number
- DE102010046876B4 DE102010046876B4 DE102010046876.2A DE102010046876A DE102010046876B4 DE 102010046876 B4 DE102010046876 B4 DE 102010046876B4 DE 102010046876 A DE102010046876 A DE 102010046876A DE 102010046876 B4 DE102010046876 B4 DE 102010046876B4
- Authority
- DE
- Germany
- Prior art keywords
- heat sink
- heat
- cylinder
- module
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
Einschubmodul (1) für Hochleistungs-LEDs (2) für rohrförmige Öffnungen (3), insbesondere zur Anordnung von LEDs (2) in Rohren oder Bohrungen mit einem geringen Durchmesser, aufweisend einen länglich ausgestalteten Kühlkörper (10), wobei der Kühlkörper (10) zum Abtransport der Wärme in Längsrichtung der Haupterstreckung des Kühlkörpers (10) an eine den Kühlkörper (10) umgebende rohrförmige Öffnung (3) ausgebildet ist und der Kühlkörper (10) zumindest bereichsweise derart flexibel ist, dass sich dessen Außenkontur an die Innenkontur der jeweiligen Öffnung (3) anpassen lässt und an dieser zumindest stellenweise anliegt, wobei der Kühlkörper (10) aus einem zumindest bereichsweise elastisch verformbaren wärmeleitenden Zylinder (11) besteht, dadurch gekennzeichnet, dass der Zylinder (11) zahlreiche längs verlaufende Schlitze (12) aufweist, durch welche wärmeleitende, elastisch federnde Kontaktflächen (13) gebildet werden und der Zylinder (11) durch elastische Verformung der Zylinderwandung in seinen Maßen frei veränderlich ist.Plug-in module (1) for high-performance LEDs (2) for tubular openings (3), in particular for arranging LEDs (2) in tubes or bores with a small diameter, comprising an elongated heat sink (10), the heat sink (10) is designed to remove the heat in the longitudinal direction of the main extent of the heat sink (10) to a tubular opening (3) surrounding the heat sink (10) and the heat sink (10) is flexible, at least in certain areas, in such a way that its outer contour fits the inner contour of the respective opening (3) can be adapted and at least partially abuts against it, the heat sink (10) consisting of an at least partially elastically deformable heat-conducting cylinder (11), characterized in that the cylinder (11) has numerous longitudinal slots (12) through which thermally conductive, elastically resilient contact surfaces (13) are formed and the cylinder (11) by elastic ver Dimensioning of the cylinder wall is freely variable in its dimensions.
Description
Technisches GebietTechnical area
Die vorliegende Erfindung betrifft ein neuartiges Einschubmodul für Hochleistungs-LEDs für rohrförmige Öffnungen, insbesondere zur Anordnung von LEDs in Rohren oder Bohrungen mit einem geringen Durchmesser, aufweisend einen länglich ausgestalteten Kühlkörper, wobei der Kühlkörper zum Abtransport der Wärme in Längsrichtung der Haupterstreckung des Kühlkörpers an eine den Kühlkörper umgebende rohrförmige Öffnung ausgebildet ist und der Kühlkörper zumindest bereichsweise derart flexibel ist, dass sich dessen Außenkontur an die Innenkontur der jeweiligen Öffnung anpassen lässt und an dieser zumindest stellenweise anliegt, wobei der Kühlkörper aus einem zumindest bereichsweise elastisch verformbaren wärmeleitenden Zylinder besteht.The present invention relates to a novel plug-in module for high-power LEDs for tubular openings, in particular for the arrangement of LEDs in pipes or holes with a small diameter, comprising a longitudinally configured heat sink, wherein the heat sink for removing the heat in the longitudinal direction of the main extension of the heat sink to a the heat sink surrounding the tubular opening is formed and the heat sink is at least partially so flexible that its outer contour can be adapted to the inner contour of the respective opening and at least partially applied thereto, the heat sink consists of an at least partially elastically deformable heat-conducting cylinder.
Stand der TechnikState of the art
Bei der Verwendung von Hochleistungs-LEDs als Anzeige- und Beleuchtungselemente ist eine geeignete Entwärmung unabdingbar für die einwandfreie und langlebige Funktion der LEDs. LEDs mit höherer Leistung benötigen daher einen Kühlkörper, um ihre Wärme ausreichend abführen zu können, da sie mit steigender Temperatur an Effizienz und Lebensdauer verlieren und oberhalb einer bestimmten Temperatur Schaden nehmen oder zerstört werden.When using high-power LEDs as display and lighting elements, suitable cooling is essential for the proper and long-lasting operation of the LEDs. Higher power LEDs therefore require a heat sink to dissipate their heat sufficiently, as they lose efficiency and life with increasing temperature, and are damaged or destroyed above a certain temperature.
Die auf dem Markt befindlichen SMD LEDs auf Kühlkörpern sind plattenförmig ausgebildet, erfordern einen großflächigen Bauraum und benötigen in der Regel zusätzliche, spezielle Kühlkörper.The marketed SMD LEDs on heat sinks are plate-shaped, require a large space and usually require additional, special heatsink.
Derartige großflächige Kühlkörper wurden bspw. in
Aus dem Stand der Technik sind neben diesen zahlreichen Standardkühlkörpern, die für LED-Entwärmung einsetzbar sind, auch für LEDs modifizierte Kühlkörpervarianten bekannt.In addition to these numerous standard heat sinks which can be used for LED cooling, modified heat sink variants are also known from the prior art for LEDs.
So werden in
Aus
Gemäß
Darstellung der ErfindungPresentation of the invention
Der vorliegenden Erfindung liegt die Aufgabe zu Grunde, ein Einschubmodul mit einem Kühlkörper für Hochleistungs-LEDs zu schaffen, der konstruktiv einfach, in Hinblick auf die Wärmeableitung effektiv und darüber hinaus Platz sparend gestaltet ist und sich insbesondere aber nicht ausschließlich für den flexiblen Einsatz in Rohren oder Bohrungen mit einem geringen Durchmesser eignet.The present invention is based on the object to provide a plug-in module with a heat sink for high-power LEDs, which is structurally simple, effective in terms of heat dissipation and space-saving design and in particular but not exclusively for flexible use in pipes or holes with a small diameter.
Erfindungsgemäß wird die voranstehende Aufgabe mit den Merkmalen des Anspruchs 1 gelöst. Vorteilhafte Ausgestaltungen des erfindungsgemäßen Einschubmoduls sind in Unteransprüchen angegeben.According to the invention the above object is achieved with the features of
Danach ist ein Einschubmodul mit einem Kühlkörper dadurch gekennzeichnet, dass der Zylinder zahlreiche längs verlaufende Schlitze aufweist, durch welche wärmeleitende, elastisch federnde Kontaktflächen gebildet werden und der Zylinder durch elastische Verformung der Zylinderwandung in seinen Maßen frei veränderlich ist.Thereafter, a plug-in module with a heat sink is characterized in that the cylinder has numerous longitudinal slots through which thermally conductive, elastically resilient contact surfaces are formed and the cylinder is freely variable in its dimensions by elastic deformation of the cylinder wall.
Durch das erfindungsgemäße Einschubmodul kann nahezu jedes beliebige Metallrohr, jedes anders geartete wärmeleitende Rohr oder Bohrungen in wärmeleitenden Materialen als Kühlkörper genutzt werden und eröffnet auch einem Nichtfachmann neue und vielfältige Möglichkeiten der LED-Integration. Mittels des Einschubmoduls sind mithin vielseitigere Gestaltungsmöglichkeiten als einem speziell ausgelegten Kühlkörper an einer vorgegebenen Standard-Grundplatte möglich.By insert module according to the invention can almost any metal tube, any other type of thermally conductive tube or Holes in heat-conducting materials can be used as heat sinks and also opens up a new and diverse possibilities of LED integration to a non-specialist. By means of the plug-in module, therefore, more versatile design possibilities than a specially designed heat sink on a given standard base plate are possible.
Kurzbeschreibung der ZeichnungenBrief description of the drawings
Weitere Ziele, Merkmale, Vorteile und Anwendungsmöglichkeiten des Einschubmoduls ergeben sich aus der nachfolgenden Beschreibung eines Ausführungsbeispiels anhand der Zeichnungen.Other objects, features, advantages and applications of the plug-in module will become apparent from the following description of an embodiment with reference to the drawings.
In den Zeichnungen zeigenIn the drawings show
Ausführung der ErfindungEmbodiment of the invention
In der in den
Der Vorteil dieser Ausführungsform des Kühlkörpers
Wie aus
In der in den
In einer weiteren Ausführungsform der Erfindung kann der Kühlkörper
Die Ausgestaltung der elastischen und/oder federnden Elemente
So besteht der in
In einer weiteren Ausführung kann die Miniplatine
Das erfindungsgemäße Einschubmodul
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 11
- Einschubmodulplug-in module
- 22
- Hochleistungs-LED/SMD LEDHigh performance LED / SMD LED
- 33
- Öffnungopening
- 44
- MiniplatineMini board
- 1010
- Kühlkörperheatsink
- 1111
- Zylindercylinder
- 1212
- Schlitzeslots
- 1313
- elastische und/oder federnde Elemente/Kontaktflächenelastic and / or resilient elements / contact surfaces
- 1414
- wärmeleitendes Verbindungsstückthermally conductive connector
- 1515
- Kabelelectric wire
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010046876.2A DE102010046876B4 (en) | 2010-09-29 | 2010-09-29 | Slide-in module for high-power LEDs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010046876.2A DE102010046876B4 (en) | 2010-09-29 | 2010-09-29 | Slide-in module for high-power LEDs |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102010046876A1 DE102010046876A1 (en) | 2012-03-29 |
DE102010046876B4 true DE102010046876B4 (en) | 2014-04-17 |
Family
ID=45804719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102010046876.2A Expired - Fee Related DE102010046876B4 (en) | 2010-09-29 | 2010-09-29 | Slide-in module for high-power LEDs |
Country Status (1)
Country | Link |
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DE (1) | DE102010046876B4 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201504566A (en) * | 2013-07-26 | 2015-02-01 | Jitboundary United Production Inc | Heat-dissipating lamp cap of LED lamp tube |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202008001506U1 (en) * | 2008-01-31 | 2008-03-27 | Domag Led Technology Co., Ltd., Zhonghe City | Cooling device for LED lamp |
DE102007045555A1 (en) * | 2007-09-24 | 2009-04-02 | Ledon Lighting Gmbh | Heat sink and cooling system for one LED module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7207695B2 (en) | 2004-11-22 | 2007-04-24 | Osram Sylvania Inc. | LED lamp with LEDs on a heat conductive post and method of making the LED lamp |
DE202005016756U1 (en) | 2005-10-26 | 2006-01-05 | Spectral Gesellschaft für Lichttechnik mbH | lamp |
CN101451698A (en) | 2007-11-30 | 2009-06-10 | 上海三思电子工程有限公司 | High power LED light source unit for lighting integrated with heat radiator |
TWM377544U (en) | 2009-10-09 | 2010-04-01 | I Chiun Precision Ind Co Ltd | Structure of LED down-light with heat sink |
-
2010
- 2010-09-29 DE DE102010046876.2A patent/DE102010046876B4/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007045555A1 (en) * | 2007-09-24 | 2009-04-02 | Ledon Lighting Gmbh | Heat sink and cooling system for one LED module |
DE202008001506U1 (en) * | 2008-01-31 | 2008-03-27 | Domag Led Technology Co., Ltd., Zhonghe City | Cooling device for LED lamp |
Also Published As
Publication number | Publication date |
---|---|
DE102010046876A1 (en) | 2012-03-29 |
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R020 | Patent grant now final |
Effective date: 20150120 |
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R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |