DE102010043871A1 - Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung - Google Patents

Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung Download PDF

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Publication number
DE102010043871A1
DE102010043871A1 DE102010043871A DE102010043871A DE102010043871A1 DE 102010043871 A1 DE102010043871 A1 DE 102010043871A1 DE 102010043871 A DE102010043871 A DE 102010043871A DE 102010043871 A DE102010043871 A DE 102010043871A DE 102010043871 A1 DE102010043871 A1 DE 102010043871A1
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DE
Germany
Prior art keywords
adhesive
electronic
pressure
psa
opto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102010043871A
Other languages
German (de)
English (en)
Inventor
Thorsten Krawinkel
Judith Grünauer
Jan Ellinger
Dr. Keite-Telgenbüscher Klaus
Alexander Steen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Priority to DE102010043871A priority Critical patent/DE102010043871A1/de
Priority to KR1020137015033A priority patent/KR20130141588A/ko
Priority to CN201180064864.4A priority patent/CN103348465B/zh
Priority to PCT/EP2011/068822 priority patent/WO2012062587A1/de
Priority to EP11779147.5A priority patent/EP2638570A1/de
Priority to TW100141033A priority patent/TW201241125A/zh
Publication of DE102010043871A1 publication Critical patent/DE102010043871A1/de
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
DE102010043871A 2010-11-12 2010-11-12 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung Withdrawn DE102010043871A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102010043871A DE102010043871A1 (de) 2010-11-12 2010-11-12 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
KR1020137015033A KR20130141588A (ko) 2010-11-12 2011-10-27 전자 장치를 캡슐화하기 위한 접착제 및 방법
CN201180064864.4A CN103348465B (zh) 2010-11-12 2011-10-27 封装电子装置的粘合剂和方法
PCT/EP2011/068822 WO2012062587A1 (de) 2010-11-12 2011-10-27 Klebmasse und verfahren zur kapselung einer elektronischen anordnung
EP11779147.5A EP2638570A1 (de) 2010-11-12 2011-10-27 Klebmasse und verfahren zur kapselung einer elektronischen anordnung
TW100141033A TW201241125A (en) 2010-11-12 2011-11-10 Adhesive and method of encapsulation for electronic arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010043871A DE102010043871A1 (de) 2010-11-12 2010-11-12 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung

Publications (1)

Publication Number Publication Date
DE102010043871A1 true DE102010043871A1 (de) 2012-05-16

Family

ID=44907849

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102010043871A Withdrawn DE102010043871A1 (de) 2010-11-12 2010-11-12 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung

Country Status (6)

Country Link
EP (1) EP2638570A1 (zh)
KR (1) KR20130141588A (zh)
CN (1) CN103348465B (zh)
DE (1) DE102010043871A1 (zh)
TW (1) TW201241125A (zh)
WO (1) WO2012062587A1 (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014095385A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum entfernen von permeaten aus flächengebilden und klebeband dafür
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014207837A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zur Lagerung von Dünnglas
WO2015162013A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und verfahren zum lagern einer dünnglasfolie
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160317068A1 (en) * 2015-04-30 2016-11-03 Verily Life Sciences Llc Electronic devices with encapsulating silicone based adhesive
US11976201B2 (en) * 2018-01-31 2024-05-07 Zeon Corporation Resin film and organic electroluminescent device

Citations (18)

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US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
US4552604A (en) 1977-02-02 1985-11-12 Ciba Geigy Corporation Bonding method employing film adhesives
DE4226696A1 (de) * 1991-08-13 1993-02-18 Shinetsu Chemical Co Hitzehaertbare harzmassen
US5304419A (en) 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
EP0827994A2 (de) 1996-09-04 1998-03-11 Hüls Aktiengesellschaft Verwendung von silangepfropften amorphen Poly-alpha-Olefinen als feuchtigkeitsvernetzender Klebrohstoff oder Klebstoff
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
EP1037192A2 (en) 1999-03-18 2000-09-20 Sel Semiconductor Energy Laboratory Co., Ltd. Gray scale driving for a display device with an active matrix
JP2000311782A (ja) 1999-04-27 2000-11-07 Nec Corp 有機ｅｌディスプレイおよびその製造方法
DE19929011A1 (de) * 1999-06-25 2000-12-28 Bayer Ag Spezielle Aminosilane enthaltende, kondensationsvernetzende Polyurethanmassen, ein Verfahren zu ihrer Herstellung sowie ihre Verwendung
WO2003065470A1 (en) 2002-01-31 2003-08-07 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
JP2004296381A (ja) 2003-03-28 2004-10-21 Honda Motor Co Ltd 燃料電池用金属製セパレータおよびその製造方法
US20040225025A1 (en) 2001-08-03 2004-11-11 Sullivan Michael G. Curable compositions for display devices
US6833668B1 (en) 1999-09-29 2004-12-21 Sanyo Electric Co., Ltd. Electroluminescence display device having a desiccant
US20060100299A1 (en) 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
WO2007087281A1 (en) 2006-01-24 2007-08-02 3M Innovative Properties Company Adhesive encapsulating composition film and organic electroluminescence device
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036970A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

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Publication number Priority date Publication date Assignee Title
TW452897B (en) * 1998-08-21 2001-09-01 Hitachi Chemical Co Ltd Paste composition, and protective film and semiconductor device both obtained with the same
JP3784202B2 (ja) * 1998-08-26 2006-06-07 リンテック株式会社 両面粘着シートおよびその使用方法
US6664318B1 (en) * 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
US20060235156A1 (en) * 2005-04-14 2006-10-19 Griswold Roy M Silylated thermoplastic vulcanizate compositions
JP4809355B2 (ja) * 2005-09-02 2011-11-09 信越化学工業株式会社 エポキシ樹脂組成物及び該組成物を含むダイボンド剤
DE102006047738A1 (de) * 2006-10-06 2008-04-10 Tesa Ag Hitzeaktivierbares Klebeband insbesondere für die Verklebung von elektronischen Bauteilen und Leiterbahnen
DE102008062130A1 (de) * 2008-12-16 2010-06-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
US8222352B2 (en) * 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051195A (en) 1975-12-15 1977-09-27 Celanese Polymer Specialties Company Polyepoxide-polyacrylate ester compositions
US4552604A (en) 1977-02-02 1985-11-12 Ciba Geigy Corporation Bonding method employing film adhesives
US5304419A (en) 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
US5591379A (en) 1990-07-06 1997-01-07 Alpha Fry Limited Moisture getting composition for hermetic microelectronic devices
DE4226696A1 (de) * 1991-08-13 1993-02-18 Shinetsu Chemical Co Hitzehaertbare harzmassen
EP0827994A2 (de) 1996-09-04 1998-03-11 Hüls Aktiengesellschaft Verwendung von silangepfropften amorphen Poly-alpha-Olefinen als feuchtigkeitsvernetzender Klebrohstoff oder Klebstoff
WO1998021287A1 (en) 1996-11-12 1998-05-22 Minnesota Mining And Manufacturing Company Thermosettable pressure sensitive adhesive
EP1037192A2 (en) 1999-03-18 2000-09-20 Sel Semiconductor Energy Laboratory Co., Ltd. Gray scale driving for a display device with an active matrix
JP2000311782A (ja) 1999-04-27 2000-11-07 Nec Corp 有機ｅｌディスプレイおよびその製造方法
DE19929011A1 (de) * 1999-06-25 2000-12-28 Bayer Ag Spezielle Aminosilane enthaltende, kondensationsvernetzende Polyurethanmassen, ein Verfahren zu ihrer Herstellung sowie ihre Verwendung
US6833668B1 (en) 1999-09-29 2004-12-21 Sanyo Electric Co., Ltd. Electroluminescence display device having a desiccant
US20040225025A1 (en) 2001-08-03 2004-11-11 Sullivan Michael G. Curable compositions for display devices
WO2003065470A1 (en) 2002-01-31 2003-08-07 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US20060100299A1 (en) 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
JP2004296381A (ja) 2003-03-28 2004-10-21 Honda Motor Co Ltd 燃料電池用金属製セパレータおよびその製造方法
WO2007087281A1 (en) 2006-01-24 2007-08-02 3M Innovative Properties Company Adhesive encapsulating composition film and organic electroluminescence device
DE102008047964A1 (de) 2008-09-18 2010-03-25 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036968A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung
DE102009036970A1 (de) * 2009-08-12 2011-02-17 Tesa Se Verfahren zur Kapselung einer elektronischen Anordnung

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
A. G. Erlat et. al. in "47th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2004, Seiten 654 bis 659
DIN 53380 Teil 3
DIN EN ISO 4625
M. E. Gross et al. in "46th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2003, Seiten 89 bis 92

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9969908B2 (en) 2012-12-21 2018-05-15 Tesa Se Method for removing permeates from flat structures, and corresponding adhesive tape
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
WO2014095385A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum entfernen von permeaten aus flächengebilden und klebeband dafür
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
WO2015162013A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und verfahren zum lagern einer dünnglasfolie
WO2015162012A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und verfahren zur lagerung von dünnglas
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
DE102014207837A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zur Lagerung von Dünnglas
US10618837B2 (en) 2014-04-25 2020-04-14 Tesa Se Thin glass composite and method for storing a thin glass film
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
US10797269B2 (en) 2017-05-05 2020-10-06 3M Innovative Properties Company Polymeric films and display devices containing such films
US11472909B2 (en) 2017-05-05 2022-10-18 3M Innovative Properties Company Polymeric films and display devices containing such films

Also Published As

Publication number Publication date
CN103348465A (zh) 2013-10-09
WO2012062587A1 (de) 2012-05-18
TW201241125A (en) 2012-10-16
KR20130141588A (ko) 2013-12-26
EP2638570A1 (de) 2013-09-18
CN103348465B (zh) 2017-02-08

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Legal Events

Date Code Title Description
R163 Identified publications notified
R081 Change of applicant/patentee

Owner name: TESA SE, DE

Free format text: FORMER OWNER: TESA SE, 20253 HAMBURG, DE

R012 Request for examination validly filed
R120 Application withdrawn or ip right abandoned