DE102009057566A1 - Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren - Google Patents

Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren Download PDF

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Publication number
DE102009057566A1
DE102009057566A1 DE102009057566A DE102009057566A DE102009057566A1 DE 102009057566 A1 DE102009057566 A1 DE 102009057566A1 DE 102009057566 A DE102009057566 A DE 102009057566A DE 102009057566 A DE102009057566 A DE 102009057566A DE 102009057566 A1 DE102009057566 A1 DE 102009057566A1
Authority
DE
Germany
Prior art keywords
partial beams
carrier
semiconductor layer
laser radiation
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102009057566A
Other languages
German (de)
English (en)
Inventor
Ralph Dr. Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102009057566A priority Critical patent/DE102009057566A1/de
Priority to JP2012542414A priority patent/JP5635123B2/ja
Priority to KR1020127017715A priority patent/KR20120101707A/ko
Priority to PCT/EP2010/065891 priority patent/WO2011069735A1/de
Priority to EP10771088.1A priority patent/EP2509741B9/de
Priority to CN201080055854.XA priority patent/CN102639281B/zh
Priority to US13/514,373 priority patent/US8946098B2/en
Priority to TW099140137A priority patent/TW201143952A/zh
Publication of DE102009057566A1 publication Critical patent/DE102009057566A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
DE102009057566A 2009-12-09 2009-12-09 Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren Withdrawn DE102009057566A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102009057566A DE102009057566A1 (de) 2009-12-09 2009-12-09 Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren
JP2012542414A JP5635123B2 (ja) 2009-12-09 2010-10-21 ビームスプリッタを用いたレーザリフトオフ法のための方法および装置
KR1020127017715A KR20120101707A (ko) 2009-12-09 2010-10-21 레이저 박리 방법 그리고 빔 스플리터를 구비하는 레이저 박리 방법용 장치
PCT/EP2010/065891 WO2011069735A1 (de) 2009-12-09 2010-10-21 Verfahren und vorrichtung für ein laserabhebeverfahren mit einem strahlteiler
EP10771088.1A EP2509741B9 (de) 2009-12-09 2010-10-21 Verfahren und vorrichtung für ein laserabhebeverfahren mit einem strahlteiler
CN201080055854.XA CN102639281B (zh) 2009-12-09 2010-10-21 利用分束器进行激光剥离方法的方法和装置
US13/514,373 US8946098B2 (en) 2009-12-09 2010-10-21 Device for a laser lift-off method and laser lift-off method
TW099140137A TW201143952A (en) 2009-12-09 2010-11-22 Device for a laser lift-off method and laser lift-off method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009057566A DE102009057566A1 (de) 2009-12-09 2009-12-09 Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren

Publications (1)

Publication Number Publication Date
DE102009057566A1 true DE102009057566A1 (de) 2011-06-16

Family

ID=43416867

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009057566A Withdrawn DE102009057566A1 (de) 2009-12-09 2009-12-09 Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren

Country Status (8)

Country Link
US (1) US8946098B2 (https=)
EP (1) EP2509741B9 (https=)
JP (1) JP5635123B2 (https=)
KR (1) KR20120101707A (https=)
CN (1) CN102639281B (https=)
DE (1) DE102009057566A1 (https=)
TW (1) TW201143952A (https=)
WO (1) WO2011069735A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017129795A1 (de) * 2016-01-29 2017-08-03 Kjellberg-Stiftung Vorrichtung und verfahren zur thermischen bearbeitung
DE102022114637A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
DE102022114646A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
DE102023201553A1 (de) * 2023-02-22 2024-08-22 3D-Micromac Ag Verfahren und System zur Herstellung mikroelektronischer Komponenten mit Schichtaufbau
WO2025078839A1 (en) * 2023-10-13 2025-04-17 Pulse Investments Uk Limited Method and system for surface layer removal

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010030358B4 (de) 2010-06-22 2014-05-22 Osram Opto Semiconductors Gmbh Verfahren zum Abtrennen einer Substratscheibe
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
GB2519088B (en) 2013-10-08 2015-09-16 M Solv Ltd Laser scanning system for laser release
CN104858544B (zh) 2014-02-26 2018-09-21 恩耐公司 激光剥离方法及用于在目标上引起激光剥离的系统
CN104158067B (zh) * 2014-08-22 2016-06-22 苏州大学 一种导线外皮的激光剥离方法
KR20160049382A (ko) * 2014-10-27 2016-05-09 삼성디스플레이 주식회사 레이저 박리 장치 및 표시 장치의 제조 방법
CN104297926A (zh) * 2014-11-12 2015-01-21 核工业理化工程研究院 高功率激光分光光纤装置
GB201509766D0 (en) * 2015-06-05 2015-07-22 Element Six Technologies Ltd Method of fabricating diamond-semiconductor composite substrates
DE102018200036B3 (de) * 2018-01-03 2019-01-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Optische Anordnung zur direkten Laserinterferenzstrukturierung
CN109623155B (zh) * 2018-11-14 2020-07-10 吉林大学 利用多光子激发进行近4π立体角飞秒激光直写加工的方法及应用
DE112020002981A5 (de) * 2019-06-21 2022-03-03 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Bearbeiten eines Werkstücks
CN110491811B (zh) * 2019-09-19 2024-06-14 北京大学东莞光电研究院 一种可调节光强型激光剥离装置
DE102024209847A1 (de) * 2024-10-10 2026-04-16 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zur Erzeugung von Materialabtragungsbereichen in einem Glasobjekt

Citations (3)

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EP0859261A1 (en) * 1997-02-04 1998-08-19 Miyachi Technos Corporation Laser beam-splitting apparatus
US6169631B1 (en) * 1998-05-19 2001-01-02 Seagate Technology Llc Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing
US6210479B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Product and process for forming a semiconductor structure on a host substrate

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JPH06296597A (ja) 1992-08-19 1994-10-25 D F C:Kk 脳波分析方法及びその装置
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses
CN2432001Y (zh) * 2000-06-21 2001-05-30 中国科学院光电技术研究所 一种激光干涉光刻系统
TWI226139B (en) * 2002-01-31 2005-01-01 Osram Opto Semiconductors Gmbh Method to manufacture a semiconductor-component
CN100530705C (zh) * 2003-01-31 2009-08-19 奥斯兰姆奥普托半导体有限责任公司 用于制造一个半导体元器件的方法
JP4423465B2 (ja) 2004-02-12 2010-03-03 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置
DE602006004913D1 (de) 2005-04-28 2009-03-12 Semiconductor Energy Lab Verfahren und Vorrichtung zur Herstellung von Halbleitern mittels Laserstrahlung
US7829909B2 (en) 2005-11-15 2010-11-09 Verticle, Inc. Light emitting diodes and fabrication methods thereof
CN101434005B (zh) 2008-11-20 2011-05-25 武汉凌云光电科技有限责任公司 多通道非晶硅太阳能板激光刻膜机

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0859261A1 (en) * 1997-02-04 1998-08-19 Miyachi Technos Corporation Laser beam-splitting apparatus
US6169631B1 (en) * 1998-05-19 2001-01-02 Seagate Technology Llc Laser-texturing data zone on a magnetic disk surface by using degenerative two wave mixing
US6210479B1 (en) * 1999-02-26 2001-04-03 International Business Machines Corporation Product and process for forming a semiconductor structure on a host substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017129795A1 (de) * 2016-01-29 2017-08-03 Kjellberg-Stiftung Vorrichtung und verfahren zur thermischen bearbeitung
US11224939B2 (en) 2016-01-29 2022-01-18 Kjellberg-Stiftung Apparatus for thermal processing
DE102022114637A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
DE102022114646A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
DE102023201553A1 (de) * 2023-02-22 2024-08-22 3D-Micromac Ag Verfahren und System zur Herstellung mikroelektronischer Komponenten mit Schichtaufbau
WO2025078839A1 (en) * 2023-10-13 2025-04-17 Pulse Investments Uk Limited Method and system for surface layer removal

Also Published As

Publication number Publication date
CN102639281B (zh) 2015-02-25
CN102639281A (zh) 2012-08-15
US8946098B2 (en) 2015-02-03
US20120258605A1 (en) 2012-10-11
EP2509741B9 (de) 2015-02-25
JP2013513487A (ja) 2013-04-22
EP2509741A1 (de) 2012-10-17
JP5635123B2 (ja) 2014-12-03
TW201143952A (en) 2011-12-16
EP2509741B1 (de) 2014-12-03
KR20120101707A (ko) 2012-09-14
WO2011069735A1 (de) 2011-06-16

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee