DE102009033915B4 - Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel - Google Patents

Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel Download PDF

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Publication number
DE102009033915B4
DE102009033915B4 DE102009033915.9A DE102009033915A DE102009033915B4 DE 102009033915 B4 DE102009033915 B4 DE 102009033915B4 DE 102009033915 A DE102009033915 A DE 102009033915A DE 102009033915 B4 DE102009033915 B4 DE 102009033915B4
Authority
DE
Germany
Prior art keywords
light
radiation
emitting diode
semiconductor bodies
transmissive carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102009033915.9A
Other languages
German (de)
English (en)
Other versions
DE102009033915A1 (de
Inventor
Dr. Hahn Berthold
Dr. Maute Markus
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102009033915.9A priority Critical patent/DE102009033915B4/de
Priority to CN2010800331752A priority patent/CN102473704A/zh
Priority to EP10734486.3A priority patent/EP2457254B1/de
Priority to JP2012521009A priority patent/JP5813636B2/ja
Priority to PCT/EP2010/060345 priority patent/WO2011009821A1/de
Priority to KR1020127004430A priority patent/KR20120038511A/ko
Publication of DE102009033915A1 publication Critical patent/DE102009033915A1/de
Application granted granted Critical
Publication of DE102009033915B4 publication Critical patent/DE102009033915B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE102009033915.9A 2009-07-20 2009-07-20 Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel Expired - Fee Related DE102009033915B4 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102009033915.9A DE102009033915B4 (de) 2009-07-20 2009-07-20 Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel
CN2010800331752A CN102473704A (zh) 2009-07-20 2010-07-16 用于制造发光机构的方法和发光机构
EP10734486.3A EP2457254B1 (de) 2009-07-20 2010-07-16 Verfahren zur herstellung eines leuchtmittels und leuchtmittel
JP2012521009A JP5813636B2 (ja) 2009-07-20 2010-07-16 光源の製造方法及び光源
PCT/EP2010/060345 WO2011009821A1 (de) 2009-07-20 2010-07-16 Verfahren zur herstellung eines leuchtmittels und leuchtmittel
KR1020127004430A KR20120038511A (ko) 2009-07-20 2010-07-16 조명 수단을 제조하기 위한 방법 그리고 조명 수단

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009033915.9A DE102009033915B4 (de) 2009-07-20 2009-07-20 Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel

Publications (2)

Publication Number Publication Date
DE102009033915A1 DE102009033915A1 (de) 2011-01-27
DE102009033915B4 true DE102009033915B4 (de) 2022-05-25

Family

ID=43016842

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009033915.9A Expired - Fee Related DE102009033915B4 (de) 2009-07-20 2009-07-20 Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel

Country Status (6)

Country Link
EP (1) EP2457254B1 (enExample)
JP (1) JP5813636B2 (enExample)
KR (1) KR20120038511A (enExample)
CN (1) CN102473704A (enExample)
DE (1) DE102009033915B4 (enExample)
WO (1) WO2011009821A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012202928A1 (de) * 2012-02-27 2013-08-29 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
DE102013205179A1 (de) 2013-03-25 2014-09-25 Osram Gmbh Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe
GB201413578D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour iled display on silicon
KR102732448B1 (ko) 2018-11-27 2024-11-21 삼성전자주식회사 마이크로 광원 어레이, 이를 포함한 디스플레이 장치 및 디스플레이 장치의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940683A (en) 1996-01-18 1999-08-17 Motorola, Inc. LED display packaging with substrate removal and method of fabrication
WO2008062783A1 (en) 2006-11-20 2008-05-29 Nikon Corporation Led device and method for manufacturing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3473396B2 (ja) * 1998-04-23 2003-12-02 松下電器産業株式会社 光情報処理装置
EP0977063A1 (en) * 1998-07-28 2000-02-02 Interuniversitair Micro-Elektronica Centrum Vzw A socket and a system for optoelectronic interconnection and a method of fabricating such socket and system
JP3652945B2 (ja) * 1999-12-28 2005-05-25 松下電器産業株式会社 光情報処理装置
JP4182661B2 (ja) * 2001-10-31 2008-11-19 ソニー株式会社 画像表示装置及びその製造方法
JP2005093649A (ja) * 2003-09-17 2005-04-07 Oki Data Corp 半導体複合装置、ｌｅｄプリントヘッド、及び、それを用いた画像形成装置
US7294961B2 (en) * 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
CN1622730A (zh) * 2004-12-16 2005-06-01 新磊微制造股份有限公司 发光模块
DE102007010244A1 (de) * 2007-02-02 2008-08-07 Osram Opto Semiconductors Gmbh Anordnung und Verfahren zur Erzeugung von Mischlicht
JP2008262993A (ja) * 2007-04-10 2008-10-30 Nikon Corp 表示装置
EP1988577B1 (en) * 2007-04-30 2017-04-05 Tridonic Jennersdorf GmbH Light emitting diode module with silicon platform

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5940683A (en) 1996-01-18 1999-08-17 Motorola, Inc. LED display packaging with substrate removal and method of fabrication
WO2008062783A1 (en) 2006-11-20 2008-05-29 Nikon Corporation Led device and method for manufacturing the same

Also Published As

Publication number Publication date
EP2457254B1 (de) 2020-03-18
JP5813636B2 (ja) 2015-11-17
JP2012533895A (ja) 2012-12-27
CN102473704A (zh) 2012-05-23
DE102009033915A1 (de) 2011-01-27
WO2011009821A1 (de) 2011-01-27
KR20120038511A (ko) 2012-04-23
EP2457254A1 (de) 2012-05-30

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