DE102009032606A1 - Optoelektronisches Bauteil und Flachlichtquelle - Google Patents

Optoelektronisches Bauteil und Flachlichtquelle Download PDF

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Publication number
DE102009032606A1
DE102009032606A1 DE200910032606 DE102009032606A DE102009032606A1 DE 102009032606 A1 DE102009032606 A1 DE 102009032606A1 DE 200910032606 DE200910032606 DE 200910032606 DE 102009032606 A DE102009032606 A DE 102009032606A DE 102009032606 A1 DE102009032606 A1 DE 102009032606A1
Authority
DE
Germany
Prior art keywords
carrier
semiconductor chip
substrate
optoelectronic component
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE200910032606
Other languages
German (de)
English (en)
Inventor
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE200910032606 priority Critical patent/DE102009032606A1/de
Priority to PCT/EP2010/058744 priority patent/WO2011003726A1/fr
Publication of DE102009032606A1 publication Critical patent/DE102009032606A1/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
DE200910032606 2009-07-10 2009-07-10 Optoelektronisches Bauteil und Flachlichtquelle Pending DE102009032606A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200910032606 DE102009032606A1 (de) 2009-07-10 2009-07-10 Optoelektronisches Bauteil und Flachlichtquelle
PCT/EP2010/058744 WO2011003726A1 (fr) 2009-07-10 2010-06-21 Composant optoélectronique et source lumineuse plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200910032606 DE102009032606A1 (de) 2009-07-10 2009-07-10 Optoelektronisches Bauteil und Flachlichtquelle

Publications (1)

Publication Number Publication Date
DE102009032606A1 true DE102009032606A1 (de) 2011-01-13

Family

ID=42732440

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200910032606 Pending DE102009032606A1 (de) 2009-07-10 2009-07-10 Optoelektronisches Bauteil und Flachlichtquelle

Country Status (2)

Country Link
DE (1) DE102009032606A1 (fr)
WO (1) WO2011003726A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012202927A1 (de) * 2012-02-27 2013-08-29 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
WO2015062990A1 (fr) * 2013-10-30 2015-05-07 Osram Opto Semiconductors Gmbh Puce semi-conductrice optoélectronique et ensemble comprenant au moins une telle puce semi-conductrice optoélectronique
DE102014103034A1 (de) * 2014-03-07 2015-09-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016156329A1 (fr) * 2015-03-30 2016-10-06 Osram Opto Semiconductors Gmbh Puce semi-conductrice optoélectronique, composant semi-conducteur optoélectronique et procédé de fabrication d'une puce semi-conductrice optoélectronique
WO2020084165A1 (fr) * 2018-10-26 2020-04-30 Barco N.V. Boîtier de del
US12125958B2 (en) 2018-10-26 2024-10-22 Barco N.V. LED package

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998650B1 (en) * 2005-03-17 2006-02-14 Jiahn-Chang Wu Replaceable light emitting diode module
US20080122120A1 (en) * 2006-11-29 2008-05-29 Fujitsu Limited Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7210817B2 (en) * 2004-04-27 2007-05-01 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method, system and device for delivering phototherapy to a patient
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
US20070164303A1 (en) * 2006-01-13 2007-07-19 Lightop Technology Co., Ltd. [led lamp]
KR20080007961A (ko) * 2006-07-19 2008-01-23 알티전자 주식회사 엘이디 모듈의 냉각 장치 및 그 제조 방법
DE102007015893A1 (de) * 2007-04-02 2008-10-09 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung sowie Verfahren zum Betrieb und Verfahren zur Herstellung einer optoelektronischen Anordnung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998650B1 (en) * 2005-03-17 2006-02-14 Jiahn-Chang Wu Replaceable light emitting diode module
US20080122120A1 (en) * 2006-11-29 2008-05-29 Fujitsu Limited Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012202927A1 (de) * 2012-02-27 2013-08-29 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
US10533729B2 (en) 2012-02-27 2020-01-14 Osram Gmbh Light source with LED chip and luminophore layer
DE102012202927B4 (de) * 2012-02-27 2021-06-10 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
WO2015062990A1 (fr) * 2013-10-30 2015-05-07 Osram Opto Semiconductors Gmbh Puce semi-conductrice optoélectronique et ensemble comprenant au moins une telle puce semi-conductrice optoélectronique
DE102014103034A1 (de) * 2014-03-07 2015-09-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016156329A1 (fr) * 2015-03-30 2016-10-06 Osram Opto Semiconductors Gmbh Puce semi-conductrice optoélectronique, composant semi-conducteur optoélectronique et procédé de fabrication d'une puce semi-conductrice optoélectronique
US10270019B2 (en) 2015-03-30 2019-04-23 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip, optoelectronic semiconductor component and method for producing an optoelectronic semiconductor chip
WO2020084165A1 (fr) * 2018-10-26 2020-04-30 Barco N.V. Boîtier de del
CN112913036A (zh) * 2018-10-26 2021-06-04 巴科股份有限公司 Led封装
US12125958B2 (en) 2018-10-26 2024-10-22 Barco N.V. LED package

Also Published As

Publication number Publication date
WO2011003726A1 (fr) 2011-01-13

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OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
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Effective date: 20131010

R016 Response to examination communication