DE102009010496A8 - Sputtertarget - Google Patents
Sputtertarget Download PDFInfo
- Publication number
- DE102009010496A8 DE102009010496A8 DE102009010496A DE102009010496A DE102009010496A8 DE 102009010496 A8 DE102009010496 A8 DE 102009010496A8 DE 102009010496 A DE102009010496 A DE 102009010496A DE 102009010496 A DE102009010496 A DE 102009010496A DE 102009010496 A8 DE102009010496 A8 DE 102009010496A8
- Authority
- DE
- Germany
- Prior art keywords
- sputtering target
- sputtering
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0483—Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Powder Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-043218 | 2008-02-25 | ||
JP2008043218A JP2009197310A (ja) | 2008-02-25 | 2008-02-25 | スパッタリングターゲット |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102009010496A1 DE102009010496A1 (de) | 2009-08-27 |
DE102009010496A8 true DE102009010496A8 (de) | 2009-12-03 |
Family
ID=40896955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102009010496A Withdrawn DE102009010496A1 (de) | 2008-02-25 | 2009-02-25 | Sputtertarget |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090211902A1 (de) |
JP (1) | JP2009197310A (de) |
DE (1) | DE102009010496A1 (de) |
TW (1) | TW200948996A (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104126026B (zh) * | 2012-02-23 | 2016-03-23 | 吉坤日矿日石金属株式会社 | 含有铬氧化物的强磁性材料溅射靶 |
KR102152586B1 (ko) * | 2015-03-04 | 2020-09-07 | 제이엑스금속주식회사 | 자성재 스퍼터링 타깃 및 그 제조 방법 |
KR20180129769A (ko) * | 2016-03-28 | 2018-12-05 | 미쓰이금속광업주식회사 | 스퍼터링 타깃재 및 그의 제조 방법, 및 스퍼터링 타깃 |
CN111230129B (zh) * | 2020-03-18 | 2022-08-16 | 宁波江丰电子材料股份有限公司 | 一种钨钛混粉方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5736657A (en) * | 1995-03-31 | 1998-04-07 | Ricoh Company, Ltd. | Sputtering target |
DE10017414A1 (de) * | 2000-04-07 | 2001-10-11 | Unaxis Materials Deutschland G | Sputtertarget auf der Basis eines Metalls oder einer Metalllegierung und Verfahren zu dessen Herstellung |
WO2005005683A1 (ja) | 2003-07-15 | 2005-01-20 | Nikko Materials Co., Ltd. | スパッタリングターゲット及び光記録媒体 |
JP4351212B2 (ja) * | 2003-08-05 | 2009-10-28 | 日鉱金属株式会社 | スパッタリングターゲット及びその製造方法 |
US20060078457A1 (en) | 2004-10-12 | 2006-04-13 | Heraeus, Inc. | Low oxygen content alloy compositions |
JP2007062108A (ja) * | 2005-08-30 | 2007-03-15 | Kobe Steel Ltd | 光情報記録媒体用の記録層およびスパッタリングターゲット、並びに光情報記録媒体 |
US20090046566A1 (en) * | 2005-10-18 | 2009-02-19 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel Ltd.) | Recording layer for optical information recording medium, optical information recording medium, and sputtering target for optical information recording medium |
JP2007293983A (ja) * | 2006-04-24 | 2007-11-08 | Kobe Steel Ltd | 光情報記録媒体 |
JP4348354B2 (ja) | 2006-08-11 | 2009-10-21 | 株式会社湯本製作所 | 麺線巻入装置 |
-
2008
- 2008-02-25 JP JP2008043218A patent/JP2009197310A/ja active Pending
-
2009
- 2009-02-24 US US12/391,487 patent/US20090211902A1/en not_active Abandoned
- 2009-02-25 TW TW098105994A patent/TW200948996A/zh unknown
- 2009-02-25 DE DE102009010496A patent/DE102009010496A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20090211902A1 (en) | 2009-08-27 |
JP2009197310A (ja) | 2009-09-03 |
TW200948996A (en) | 2009-12-01 |
DE102009010496A1 (de) | 2009-08-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8196 | Reprint of faulty title page (publication) german patentblatt: part 1a6 | ||
OP8 | Request for examination as to paragraph 44 patent law | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee | ||
R002 | Refusal decision in examination/registration proceedings | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20120901 |