DE102008055978A1 - Panel substructure for the laying of pipelines for heating, cooling or absorbing purposes, for example for floor or wall heating systems, and method for producing such a heating system - Google Patents

Abstract

The invention relates to a slab base (1) for laying pipes (18) for heating, cooling or absorber purposes, for example, for floor or wall or ceiling heating, consisting of a plate-shaped thermal insulation (3), in which grooves (11) are formed with a U-shaped cross-section, wherein on the upper side of the thermal insulation (3) has a flat Wärmeleitblech (16) is applied, which for receiving the pipes (18) grooves (17) with a U or reverse omega-shaped cross-section which are fittingly inserted into the U-shaped (11) grooves. The thermal insulation consists of a first, an upper side and a lower surface having surface element (2), which closely adjacent and mutually parallel, filled with air channel spaces (26) formed of at least one wave path (4, 5, 6). In the surface element (2), starting from the top, the grooves (21) for receiving the pipes (18) are formed. On the upper side of the surface element (2), the heat conduction plate (16) is arranged with the grooves (17) fittingly inserted in the grooves (17), on the underside of the first surface element (2) below the grooves (11) is a second surface element ( 3), consisting of further closely adjacent and mutually parallel channel spaces (27) of at least one wave path (12, 13, 14), which channel spaces (27) filled with a fine-grained filler (15) and are closed at their edges.

Description

Technical area:

The The invention relates to a plate substructure for planar Laying pipes for heating or cooling Absorber purposes, for example, for floor or Wall or ceiling heating, consisting of a plate-shaped Thermal insulation, in the top grooves with a U-shaped cross-section are formed, taking on the top the thermal insulation a flat Wärmeleitblech is applied, which grooves for receiving pipelines has a U- or inversely omega-shaped cross-section, which are fitted in the U-shaped grooves, according to the preamble of claim 1. Likewise The invention relates to a method for producing such Heating or cooling system.

State of the art:

By the DE 31 09 866 A1 a plate substructure of the type mentioned for the surface laying of pipes for heating cooling or absorber purposes, for example, for floor or wall heaters, known, consisting of a pipeline in two parallel grooves receiving base plate and a uniform width, the deflection of the Pipe up to 180 ° enabling head plate with subsequent grooves of the base plate grooves, wherein on the base plate, the spacing of the grooves from each other twice as large as their respective distance from the adjacent plate edge and base plates and head plates in grid to a plate substructure laid are. The top plate has two aligned with the grooves of the base plate, interconnected via a 180 ° arc grooves and two perpendicular grooves of equal spacing, of which the outer tangent to the 180 ° arc, while the inner groove on each a 90 ° Arc in the between her and the intersecting grooves formed outer corners is connected to these grooves. The existing of a thermal insulation panels, which have provided with a U-shaped cross-section grooves are coated on the upper side with a Wärmeleitblech, in which also grooves are formed, which engage in the grooves of the heat insulation panels and fit them on a large part of their outer Fill in the scope.

By the DE 197 55 856 A1 Further, there has been known a surface heating system having pipes for heating fluid to be mounted in the bottom or in a wall of a room and elements for fixing the pipes in the floor / in the wall. Foamed plastic sheets are provided on one side with metal sheets having substantially rectilinear, semi-cylindrical recesses for receiving the pipes. The metal sheets are subdivided in the longitudinal and transverse direction with a small intervening intermediate space, wherein the foam plastic plates have linear predetermined breaking points in these spaces. Other foam plastic plates have arcuate recesses for receiving arcuately curved connecting sections of the tubes between rectilinear sections, wherein the metal plates are provided at their edges in the region of the recesses with beadings. The metal sheets may be aluminum sheets and have a thickness of about 0.2 mm to 1 mm.

By the EP 1063478 A2 is a floor and / or wall and / or ceiling heating, consisting of individual heating elements in the form of plate-shaped cuboids made of ceramic, stoneware, earthenware or clay, which have mutually parallel recesses, which open into opposite end faces of the cuboid and the ends of the recesses of two adjacent cuboids, which abut with their faces abut each other, laid in the recesses at least one leading a heating or cooling medium line and is guided over a plurality of such heating elements, wherein the recesses of one of the main surfaces of the cuboid outgoing, are open to this main surface longitudinal grooves whose depth is slightly larger than at most equal to the diameter of the line. The lines are flexible plastic lines and along the longitudinal grooves along form-fitting airtight and are thus adjacent to the main surface, wherein the remaining gap formed between the top of the lines within the longitudinal grooves and the main surface of the cuboid is airtight grouted by means of a filler. Within the longitudinal grooves, the clear width thereof along the junction with the main surface is smaller than the diameter of the pipe. On the longitudinal grooves and the lines having main surface of the cuboid tiles or tiles or wood or other flooring are applied. The lines are either flexible hoses for the heating medium water or electrical lines for the heating medium electrical energy, each with a circular cross-section. The filling material for the residual joints of the cuboid is a mortar or adhesive or ceramic filler adhesive.

The known slab substructures or underfloor heating systems either have sufficient impact sound insulation if they are made of ceramic or clay, but have insufficient thermal insulation and must therefore be additionally insulated with regard to their thermal insulation to the floor or to the wall. Furthermore, such floor heating systems made of ceramic still have too high thermal inertia and still too high Heat loss, because the massive base made of ceramic is heated. Also have such plate substructures or underfloor heating a high basis weight.

Disk substructures or underfloor heating of the type described, which Wärmeleitbleche on heat insulation board usually have sufficient thermal insulation, but only a small footfall sound insulation.

By the EP 0 966 579 A1 Sound insulating surface component has become known, wherein a closely adjacent and mutually parallel channel spaces exhibiting surface element made of corrugated cardboard filled with a filler, the corrugated cardboard is closed at its two open end faces. The corrugated sheet surface element has at least two wave paths, which are connected to one another in such a way that the channel spaces of the adjacent wave paths intersect, the filler having a non-moving sand material interlocking in the channel spaces and a limitedly movable powder material provided between the sand material. The corrugated cardboard surface element preferably has three wave paths, wherein the middle wave path has a smaller wave height than the two outer wave paths. As sand material and powder material quartz sand or quartz powder is used.

Technical task:

Of the Invention is based on the object, a plate substructure Panels for the laying of pipelines for Heating, cooling or absorber purposes, for example for Floor or wall heaters, to create which both a good thermal insulation as well as a good impact sound insulation should have low thermal inertia; especially the slab substructure should also have a low basis weight have and thus be easily deployed.

Disclosure of the invention and its advantages.

• • die Wärmedämmung besteht aus einem ersten, eine Oberseite und eine Unterseite aufweisenden Flächenelement, welches eng benachbarte und zueinander parallele, mit Luft gefüllte Kanalräume, gebildet aus wenigstens einer Wellenbahn, aufweist,
• • in das Flächenelement sind, ausgehend von der Oberseite, Nuten zur Aufnahme der Rohrleitungen eingeformt,
• • auf der Oberseite des Flächenelements ist das Wärmeleitblech mit den in die Nuten passend eingebrachten Rillen angeordnet,
• • auf der Unterseite des ersten Flächenelements unterhalb der Nuten ist ein zweites Flächenelement angeordnet, bestehend aus weiteren eng benachbarten und zueinander parallelen Kanalräumen aus wenigstens einer Wellenbahn, welche Kanalräume mit einem feinkörnigen Füllstoff gefüllt und an ihren Rändern verschlossen sind.

The solution of the problem consists in a plate substructure for laying flat pipes for heating cooling or absorber purposes according to the aforementioned type in the following features:

• The thermal insulation consists of a first surface element having an upper side and a lower side, which has closely adjacent, mutually parallel, air-filled channel spaces formed by at least one wave path,
• • in the surface element, starting from the top, grooves for receiving the pipes are formed,
• On the upper side of the surface element, the heat conduction plate is arranged with the grooves inserted into the grooves,
• • On the underside of the first surface element below the grooves, a second surface element is arranged, consisting of further closely adjacent and mutually parallel channel spaces from at least one wave path, which channel spaces filled with a fine-grained filler and sealed at their edges.

Of the Advantage of the patented plate substructure as well one completely by means of the patent Slab substructure manufactured for floors and / or walls and / or ceilings is that the Slab substructure both good thermal insulation as well as a good impact sound insulation with low thermal inertia having. A particular advantage is that a patent designed accordingly Floor and / or wall due to partial filling to comply with the fire protection regulations with a filler is capable, without this from specific heavy ceramic carrier components to be built. But the patented plate substructure has a low basis weight and is thus by the craftsman easy to lay.

In further inventive embodiment of the plate substructure If the first and / or the second surface element consists of Corrugated cardboard and at least two, preferably three or four, one above the other lying wave paths constructed, which connected to each other like are that the channel spaces of the adjacent wave paths intersect.

In the wave paths of the first surface element, the grooves are formed with a U-shaped cross-section; For example, after the gluing of the wave paths, the grooves are pressed onto one another from above into the first surface element. It has been found in terms of carrying capacity and strength sufficient if the first surface element of three intersecting wave paths is constructed. With a basis weight of the first and second surface element between 1700 g / m ² to 2000 g / m ² , for example, after the application of the tiles on the plate base, a transmittance of 600 kg / m ² to 800 kg / m ² can be achieved , For example, information on the structure, the dimensions and the basis weights of the surface elements are the EP 0966579 B1 , Page 3, paragraphs [14] and [15] and page 4, paragraphs [19] and [20].

In a further embodiment of the plate substructure according to the invention, after the introduction of the pipelines into the grooves of the heat conducting plate, the same, including via the pipelines, applied a flat expanded metal mesh. This expanded metal mesh provides tension compensation within the individual panels of the slab substructure. In particular, the expanded metal can overlap the single plate of the plate substructure on at least one side by a given distance and be reset on the opposite side by the same distance, so that when two adjacent plates of the plate substructure are abutted, the expanded metal of the one Plate overlaps the adjacent plate of the plate substructure. The flat expanded metal grid is, for example, glued to the heat conducting sheet.

Of Further, the wave paths of the first surface element with each other as well as the wave paths of the second surface element be glued together with each other.

In According to the invention, the first embodiment Surface element with the second surface element form an integral block of corrugated cardboard, with the for the lower surface element according to certain wave paths the production of the block filled with filler and glued to the edges at the sides.

On the flat expanded metal mesh can be tiles or tiles are applied, which preferably with a tile adhesive are glued on.

Of Further, the first and / or the second surface element have three superposed wave paths, wherein the respective middle wave path has a smaller wave height can own as the two outer wave paths.

Of Further, the filling material of the second surface element consist of fine-grained sand or quartz or silicon, wherein the grain size of the filler from 0.05 mm to 1 mm.

In Another embodiment of the invention, the plates of the slab substructure below the grooves within the wave tracks the first surface element at least one further wave path with have air-filled channel spaces, to which down the second surface element connects. Thus, the groove of the Wärmeleitbleches including the pipeline is largely surrounded by insulating air until on the contact surface of the pipeline towards the expanded metal grid and to the topping made of tiles or panels or Wooden.

In Another embodiment of the invention, the wave paths approximating the first and second surface elements sinusoidal or approximately rectangular Have waves. The waveform depends on the desired one Capacity of the plates of the slab substructure and can therefore in be varied advantageously.

One Method for producing a plate substructure for planar Laying pipes for heating or cooling Absorber purposes, for example, for floor or Wall or ceiling heaters, using the slab substructure as plate-shaped insulation is characterized characterized in that for the production of thermal insulation at least two closely spaced and parallel to each other, with air filled ducts having wave paths on each other be glued, which are connected to each other in such a way that the channel spaces of the adjacent wave paths intersect, which form a first surface element in the wave paths be from the surface of the insulation formed grooves with a U-shaped cross-section, on the surface of the insulation is a flat Wärmeleitblech applied, in which previously used to accommodate the piping grooves with a U or vice versa have been impressed omega-shaped cross-section, after which the grooves of the Wärmeleitblechs in the U-shaped Grooves are used appropriately, the first surface element is glued to a second surface element, which from further closely adjacent and mutually parallel channel spaces is made of at least one wave path, wherein the channel spaces of the second surface element with a fine-grained Filler filled and at their edges be closed.

One Method for producing a floor or wall heating according to the preceding method claim is characterized in that in the grooves of the sheet heat conduction pipes be introduced, after which on the heat conducting a flat Expanded metal mesh applied, preferably glued and then on the expanded metal grid tiles or tiles or wooden boards or other flooring.

Short name of the drawing, in the demonstrate:

1 a cross section through a plate base to illustrate the structure of the same 2 a representation according to the 1 with the addition of an expanded metal grid on the Wärmeleitblech

3 a representation according to the 2 and 1 with the addition of a tile on the expanded metal mesh and

4 a representation of another cross-section of a plate substructure in which the expanded metal mesh on the individual plates of the Plat tenunterbaus offset is arranged to form a lateral projection and a displacement.

Ways to carry out the invention:

The 1 shows an exemplary embodiment of a plate substructure of plates 1 , each plate 1 of the plate substructure of two surface elements, namely a first surface element 2 and a second surface element 3 , is composed. The surface element 2 consists of wave paths 4 . 5 . 6 , For example, corrugated cardboard, wherein the individual wave paths parallel to each other channels 26 form. The wave paths 4 . 5 . 6 are connected to each other in such a way that the channel spaces 26 the adjacent wave paths intersect, preferably orthogonal. The top wave railway 4 is up through a cover layer 7 covered by a cover material, such as cardboard; between the wave tracks 4 and 5 is a liner 8th arranged, as well as between the middle wave path 5 and the lower wave path 6 an intermediate layer 9 is arranged. Also the liners 8th . 9 For example, they can be made of cardboard. On the lower wave track 6 there is a lower cover layer 10 which is the first surface element 2 closes down and which may also consist of a cover material, such as cardboard. The canal rooms 26 the wave paths 4 . 5 . 6 are filled with air. The cover layers 7 . 10 as well as the liners 8th . 9 can, for example, from a so-called kraftliner and the three wave paths 4 . 5 . 6 for example, consist of a semi-cellulose. For example, basis weights of the layer components of the first surface element, the EP 0 966 579 B1 , Page 3, paragraph [0014] and Table 1 given therein.

In the wave tracks 4 . 5 . 6 or in the first surface element 2 are grooves starting from the upper surface 11 embossed with a U-shaped cross section, as can be seen in the figures. Because the sewer spaces 26 filled with air, is an introduction of the grooves 11 in the first surface element 2 in a simple manner, either by impressions or milling, possible.

On the first surface element 2 is a Wärmeleitblech 16 , which may for example consist of aluminum, applied, wherein the heat conduction 16 grooves 17 has, which are either U-shaped or vice versa omega-shaped, bent out of the plane of the Wärmeleitbleches out, designed. The grooves 17 the Wärmeleitblechs 16 thus coincide with the grooves 11 of the first surface element that the grooves 17 when applying the Wärmeleitblechs 16 on the first surface element 2 fitting in the grooves 11 are arranged and fill them as far as possible. The heat conducting sheet 16 is for example on the top layer 7 the top wave track 4 of the first surface element 2 glued on with a suitable adhesive.

The first surface element 2 together with the Wärmeleitblech 16 is on a second surface element 3 applied, for example, glued surface, wherein the second surface element 3 similar to the first surface element 2 is constructed in terms of its internal configuration.

The second surface element 3 For example, it also consists of three wave paths 12 . 13 . 14 , which are also provided by upper and lower cover layers and with intermediate layers according to the structure of the first surface element 2 , Also are the wave lanes 12 . 13 . 14 of the second surface element 3 connected together so that the channel spaces 27 the neighboring wave tracks 12 . 13 . 14 cross, as is the 1 it can be seen; on the structure of the first surface element 2 will be referred. In contrast to the first surface element 2 are the canal rooms 27 the individual wave paths 12 . 13 . 14 with a filler 15 filled, which may be, for example, a fine-grained sand, such as quartz or silicon. The narrow side surfaces of the second surface element 3 are for securing the filler 15 by means of strips 25 circumferentially sealed, as is the 1 can be seen.

The two surface elements 2 and 3 may be constructed such that first an integral block of intersecting, similar wave lanes with, for example, four or six or eight superimposed wave lanes is created and then those wave lanes, which are to form the lower, second surface element, filled with the filler and at their edges be closed. Subsequently - or even before the further construction of the block - can in the upper wave trains, which form the first surface element, the grooves 11 be introduced. Finally, on this block of wave paths in the manner described above, the heat conduction 16 be applied.

The previously described plate substructure of a first and a second surface element together with the heat conducting sheet applied thereto 16 can already represent a tradable intermediate product, which is then completed on the construction site for floor or wall or ceiling heating.

After laying the plates 1 of the slab substructure 1 in the form of the above-described surface elements 2 and 3 along with the on the surface element 3 applied Wärmeleitblech 16 be in the grooves 17 the Wärmeleitblechs 16 piping 18 laid to guide the heating or cooling medium. Subsequently, on the heat conduction 16 by means of an adhesive 20 flat an expanded metal grid 19 applied, for example glued, the adhesive 20 at the same time the remaining small, longitudinal cavities between the inner wall of the grooves 17 and the pipes 18 fills. That on the Wärmeleitblech 16 applied expanded metal mesh 19 is for example from the 2 and 3 seen.

Then you can access the expanded metal mesh 19 tiling 21 or tiles or woods or panels or other coverings are applied, for example, be glued, whereby the floor or wall or ceiling heating is completed.

In 4 is an embodiment of another example of plates 28 a slab substructure 28 with an applied expanded metal grid 22 on the first and second surface element 2 . 3 shown. Here is the expanded metal grid 22 on the first surface element 2 arranged laterally offset by a distance X, so that right in the 4 a supernatant 23 and left in the 4 a transfer 24 of the expanded metal grid 22 formed. This displacement of the expanded metal grating may equally be located at the adjacent edges.

Now become two or four plates 28 of the slab substructure 28 laid on joint, so overlap the expanded metal mesh 22 the individual plates 28 , so that each adjacent expanded metal mesh 22 neighboring plates 28 glued on the two adjacent plates. In this way, a high strength of the entire composite of the slab substructure is achieved.

The individual slabs of the slab substructure can either be made together with the piping of the pipelines and applied expanded metal mesh, according to the example of 4 , designed as a finished product, so that with the installation of the individual plates and the piping must be interconnected. After laying and interconnecting the piping, only the tiles or panels or wood need to be applied to the board substructure.

Or the slab substructure will be including the heat conducting sheet finished and laid in such a way, after which the craftsman the Pipes in the grooves of the Wärmeleitblechs brings and then the expanded metal mesh over a large area Apply to all plates of the plate substructure, after which then the tiles or panels are applied.

Industrial Applicability:

Of the The invention is in particular for the construction of floor or wall or ceiling heating commercially applicable. The patented Plate base provides a composite element, which has both outstanding thermal insulation properties down as well as an excellent impact sound insulation with a high fire protection. Likewise, the patented Panel substructure cost-effective due to the materials used be prepared and is in a simple way for the artisan relocate.

1, 28

Plates substructure

2

first surface element

3

second surface element

4, 5, 6

wave runs of the first surface element

7, 10

outer layers

8th, 9

liners

11

groove with a U-shaped cross section within the first surface element

12 13, 14

wave runs of the second surface element

15

filler

16

heat conducting

17

U- or vice versa Omega-shaped groove within the

18

pipeline

19 22

Expanded metal mesh

20

Glue

21

tile

23

Got over

24

transfer

25

strip

26 27

channel rooms

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• DE 3109866 A1 [0002]
• DE 19755856 A1 [0003]
• - EP 1063478 A2 [0004]
• EP 0966579 A1 [0007]
• - EP 0966579 B1 [0012, 0026]

Claims (14)

Plate substructure ( 1 ) for the laying of pipelines ( 18 ) for heating, cooling or absorbing purposes, for example for floor or wall or ceiling heating, consisting of a plate-shaped thermal insulation ( 3 ), in whose upper side grooves ( 11 ) are formed with a U-shaped cross section, wherein on top of the thermal insulation ( 3 ) a flat heat-conducting sheet ( 16 ), which is suitable for receiving pipelines ( 18 ) Grooves ( 17 ) having a U- or inversely omega-shaped cross section, which in the U-shaped ( 11 ) Grooves are suitably inserted, characterized by the features the thermal insulation consists of a first, an upper side and a lower surface element ( 2 ), which closely adjacent and parallel to each other, filled with air channel spaces ( 26 ) formed by at least one wave track ( 4 . 5 . 6 ), in the surface element ( 2 ) are, starting from the top of the same, the grooves ( 21 ) formed on top of the surface element ( 2 ) is the heat conduction ( 16 ) with the in the grooves ( 11 ) appropriately inserted grooves ( 17 ), on the underside of the first surface element ( 2 ) below the grooves ( 11 ) is a second surface element ( 3 ), consisting of further closely adjacent and mutually parallel channel spaces ( 27 ) from at least one wave track ( 12 . 13 . 14 ), which channel spaces ( 27 ) with a fine-grained filler ( 15 ) are filled and closed at their edges. Board substructure according to claim 1, characterized in that the first and / or the second surface element ( 2 . 3 ) consists of corrugated cardboard and at least two, preferably three or four, superposed wave paths ( 4 . 5 . 6 . 12 . 13 . 14 ), which are connected to one another in such a way that the channel spaces ( 26 . 27 ) of the adjacent wave paths. Board substructure according to claim 1 or 2, characterized in that after the introduction of the pipelines ( 18 ) in the grooves ( 17 ) of the Wärmeleitblechs ( 16 ) on the same, including via the pipelines, a flat expanded metal grid ( 19 ) on the plate substructure ( 1 ) is applied. Plate substructure according to one of the preceding claims, characterized in that the wave paths ( 4 . 5 . 6 . 12 . 13 . 14 ) of the first surface element ( 2 ) as well as the wave lanes ( 4 . 5 . 6 . 12 . 13 . 14 ) of the second surface element ( 3 ) are glued together. A board substructure according to one of the preceding claims, wherein the first surface element forms an integral block of corrugated cardboard with the second surface element, wherein the wave paths intended for the lower surface element after production of the block with filler material ( 15 ) are filled and glued to the sides of the edges. Board substructure according to claim 3, characterized in that the flat expanded metal grid ( 19 ) on the heat conducting plate ( 16 ) is glued. Plate substructure according to one of the preceding claims, that on the flat expanded metal mesh ( 19 ) Tiles ( 21 ) or tiles or panels applied, preferably glued with an adhesive, are. Panel substructure according to one of the preceding claims 1 to 3, characterized in that the first and / or the second surface element ( 2 . 3 ) three superimposed wave paths ( 4 . 5 . 6 . 12 . 13 . 14 ), wherein the respective middle wave path ( 5 . 13 ) has a smaller wave height than the two outer wave paths ( 4 . 6 . 12 . 14 ). Board substructure according to one of the preceding claims 1 to 3, characterized in that the filling material ( 15 ) of the second surface element of fine-grained sand or quartz or silicon, wherein the grain size of the filler is from 0.05 mm to 1 mm. Slab substructure according to claim 3, characterized in that the expanded metal ( 19 ) the single plate of the slab substructure overlaps on at least one side by a given distance (X) and is reset on the opposite side by the same distance (X) so that when two adjacent slabs of the slab substructure are abutted Expanded metal of a plate overlaps the adjacent plate of the plate substructure. Slab substructure according to one of the preceding claims, characterized in that below the grooves within the wave paths at least one further wave path of the first surface element is arranged with air-filled channel spaces, on which connects down the second surface element. Slab substructure according to one of the preceding claims, characterized in that the wave paths ( 4 . 5 . 6 . 12 . 13 . 14 ) of the first and second surface elements ( 2 . 3 ) have approximately sinusoidal or approximately recheckförmige waves. Method for producing a slab substructure for laying pipelines for heating, cooling or absorbing purposes, for example for floor or wall or ceiling heating, using the plate-shaped plate substructure as thermal insulation, characterized in that for the production of the plate substructure at least two closely adjacent and mutually parallel, filled with air channel spaces wave webs are glued to each other, which are connected to each other such that the channel spaces of the adjacent Crossing wave paths, which form a first surface element, in the wave paths are formed from the surface of the heat insulating grooves starting with a U-shaped cross-section, on the surface of the heat insulation, a flat heat-conducting is applied, in which previously for receiving the pipes grooves with a U - Or vice versa omega-shaped cross-section have been impressed, after which the grooves of the Wärmeleitblechs are suitably inserted into the U-shaped grooves, the first surface element is adhered to a second surface element, which consists of further closely adjacent and z Ue parallel channel spaces from at least one wave path has been produced, wherein the channel spaces of the second surface element are filled with a fine-grained filler and sealed at their edges. Process for producing a floor or floor Wall or ceiling heating according to claim 13, characterized that in the grooves of the flat Wärmeleitblechs Pipelines for flow for the heating or cooling medium be introduced, after which on the Wärmeleitblech including over the pipes applied a flat expanded metal grid, is preferably glued and then on the expanded metal mesh Tiles or tiles or wooden boards or panels or any other Flooring can be applied.