DE102008038443B4 - Maskenloser Belichtungsapparat - Google Patents

Maskenloser Belichtungsapparat Download PDF

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Publication number
DE102008038443B4
DE102008038443B4 DE102008038443.7A DE102008038443A DE102008038443B4 DE 102008038443 B4 DE102008038443 B4 DE 102008038443B4 DE 102008038443 A DE102008038443 A DE 102008038443A DE 102008038443 B4 DE102008038443 B4 DE 102008038443B4
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DE
Germany
Prior art keywords
wedge
substrate
exposure
projection lens
shaped
Prior art date
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Active
Application number
DE102008038443.7A
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German (de)
English (en)
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DE102008038443A1 (de
Inventor
Yoshitada Oshida
Kazuo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adtec Engineering Co Ltd
Original Assignee
Adtec Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Adtec Engineering Co Ltd filed Critical Adtec Engineering Co Ltd
Publication of DE102008038443A1 publication Critical patent/DE102008038443A1/de
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Publication of DE102008038443B4 publication Critical patent/DE102008038443B4/de
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE102008038443.7A 2007-09-26 2008-08-20 Maskenloser Belichtungsapparat Active DE102008038443B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007249885A JP4543069B2 (ja) 2007-09-26 2007-09-26 マスクレス露光装置
JP2007-249885 2007-09-26

Publications (2)

Publication Number Publication Date
DE102008038443A1 DE102008038443A1 (de) 2009-04-02
DE102008038443B4 true DE102008038443B4 (de) 2023-07-27

Family

ID=40384579

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008038443.7A Active DE102008038443B4 (de) 2007-09-26 2008-08-20 Maskenloser Belichtungsapparat

Country Status (5)

Country Link
JP (1) JP4543069B2 (zh)
KR (1) KR101516607B1 (zh)
CN (1) CN101398631B (zh)
DE (1) DE102008038443B4 (zh)
TW (1) TWI443473B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5354803B2 (ja) * 2010-06-28 2013-11-27 株式会社ブイ・テクノロジー 露光装置
CN105549337A (zh) * 2016-02-03 2016-05-04 京东方科技集团股份有限公司 一种光刻装置及光刻方法、显示基板的制作方法
WO2018013270A1 (en) * 2016-07-13 2018-01-18 Applied Materials, Inc. Micro led array as illumination source
JP2019045836A (ja) * 2017-09-01 2019-03-22 株式会社アドテックエンジニアリング 直接描画露光装置
KR20190054815A (ko) 2017-11-14 2019-05-22 삼성전자주식회사 마스크리스 노광 방법, 마스크리스 노광 장치 및 이를 이용한 반도체 장치의 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209813A (en) 1990-10-24 1993-05-11 Hitachi, Ltd. Lithographic apparatus and method
JP2004039871A (ja) 2002-07-03 2004-02-05 Hitachi Ltd 照明方法並びに露光方法及びその装置
US20050185157A1 (en) 2003-05-07 2005-08-25 Fuji Photo Film Co., Ltd. Projecting exposure method
US20060265889A1 (en) 2005-05-31 2006-11-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing FPD chuck Z position measurement

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139023B2 (ja) * 1991-01-30 2001-02-26 株式会社日立製作所 電子線装置及び電子線装置の焦点調整方法
JP2004163798A (ja) * 2002-11-15 2004-06-10 Fuji Photo Film Co Ltd 露光装置
US7061591B2 (en) * 2003-05-30 2006-06-13 Asml Holding N.V. Maskless lithography systems and methods utilizing spatial light modulator arrays
JP2005266779A (ja) * 2004-02-18 2005-09-29 Fuji Photo Film Co Ltd 露光装置及び方法
JP2006030791A (ja) * 2004-07-20 2006-02-02 Fuji Photo Film Co Ltd 光学装置
JP2007025005A (ja) * 2005-07-12 2007-02-01 Fujifilm Holdings Corp セル内構造の製造方法及びセル内構造並びに表示装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5209813A (en) 1990-10-24 1993-05-11 Hitachi, Ltd. Lithographic apparatus and method
JP2004039871A (ja) 2002-07-03 2004-02-05 Hitachi Ltd 照明方法並びに露光方法及びその装置
US20050185157A1 (en) 2003-05-07 2005-08-25 Fuji Photo Film Co., Ltd. Projecting exposure method
US20060265889A1 (en) 2005-05-31 2006-11-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing FPD chuck Z position measurement

Also Published As

Publication number Publication date
DE102008038443A1 (de) 2009-04-02
JP4543069B2 (ja) 2010-09-15
KR101516607B1 (ko) 2015-04-30
KR20090031977A (ko) 2009-03-31
CN101398631B (zh) 2012-09-26
CN101398631A (zh) 2009-04-01
TW200915016A (en) 2009-04-01
TWI443473B (zh) 2014-07-01
JP2009080324A (ja) 2009-04-16

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Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: SCHWABE SANDMAIR MARX, DE

R081 Change of applicant/patentee

Owner name: VIA MECHANICS, LTD., EBINA-SHI, JP

Free format text: FORMER OWNER: HITACHI VIA MECHANICS, LTD., EBINA-SHI, KANAGAWA, JP

Effective date: 20140203

Owner name: VIA MECHANICS, LTD., JP

Free format text: FORMER OWNER: HITACHI VIA MECHANICS, LTD., EBINA-SHI, JP

Effective date: 20140203

Owner name: ADTEC ENGINEERING CO., LTD., JP

Free format text: FORMER OWNER: HITACHI VIA MECHANICS, LTD., EBINA-SHI, KANAGAWA, JP

Effective date: 20140203

R082 Change of representative

Representative=s name: SCHWABE SANDMAIR MARX PATENTANWAELTE RECHTSANW, DE

Effective date: 20140203

Representative=s name: SCHWABE SANDMAIR MARX, DE

Effective date: 20140203

R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: ADTEC ENGINEERING CO., LTD., JP

Free format text: FORMER OWNER: VIA MECHANICS, LTD., EBINA-SHI, KANAGAWA, JP

R082 Change of representative

Representative=s name: SCHWABE SANDMAIR MARX PATENTANWAELTE RECHTSANW, DE

Representative=s name: SSM SANDMAIR PATENTANWAELTE RECHTSANWALT PARTN, DE

R016 Response to examination communication
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R018 Grant decision by examination section/examining division