DE102007027998A1 - Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer - Google Patents
Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer Download PDFInfo
- Publication number
- DE102007027998A1 DE102007027998A1 DE102007027998A DE102007027998A DE102007027998A1 DE 102007027998 A1 DE102007027998 A1 DE 102007027998A1 DE 102007027998 A DE102007027998 A DE 102007027998A DE 102007027998 A DE102007027998 A DE 102007027998A DE 102007027998 A1 DE102007027998 A1 DE 102007027998A1
- Authority
- DE
- Germany
- Prior art keywords
- transfer layer
- transfer
- layer
- layers
- stamping foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 239000010703 silicon Substances 0.000 title claims abstract description 42
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 42
- 239000004020 conductor Substances 0.000 title claims abstract description 20
- 238000004049 embossing Methods 0.000 title claims description 24
- 235000012431 wafers Nutrition 0.000 title description 35
- 238000012546 transfer Methods 0.000 claims abstract description 109
- 239000011888 foil Substances 0.000 claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 172
- 238000000034 method Methods 0.000 claims description 72
- 238000005245 sintering Methods 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 239000002923 metal particle Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 238000007639 printing Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Electrodes Of Semiconductors (AREA)
- Photovoltaic Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007027998A DE102007027998A1 (de) | 2007-06-14 | 2007-06-14 | Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer |
| US12/136,534 US20080308150A1 (en) | 2007-06-14 | 2008-06-10 | Hot embossing of conductor tracks on a photovoltaic silicon wafer |
| EP20080010672 EP2003698A3 (de) | 2007-06-14 | 2008-06-12 | Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer |
| JP2008157077A JP2008311665A (ja) | 2007-06-14 | 2008-06-16 | 光起電力シリコンウェファ上に導体路を形成する方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007027998A DE102007027998A1 (de) | 2007-06-14 | 2007-06-14 | Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102007027998A1 true DE102007027998A1 (de) | 2008-12-18 |
Family
ID=39832343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102007027998A Ceased DE102007027998A1 (de) | 2007-06-14 | 2007-06-14 | Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20080308150A1 (https=) |
| EP (1) | EP2003698A3 (https=) |
| JP (1) | JP2008311665A (https=) |
| DE (1) | DE102007027998A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007027999A1 (de) * | 2007-06-14 | 2008-12-18 | Leonhard Kurz Gmbh & Co. Kg | Heißprägen von Strukturen |
| IT1397536B1 (it) * | 2008-09-25 | 2013-01-16 | Smart Res Societa Per Azioni | Dispositivo di identificazione a radiofrequenza |
| FR2945151B1 (fr) * | 2009-04-30 | 2011-04-29 | Commissariat Energie Atomique | Procede de fixation d'un composant electronique sur un produit |
| DE102009026149A1 (de) * | 2009-07-10 | 2011-01-27 | Eppsteinfoils Gmbh & Co.Kg | Verbundsystem für Photovoltaik-Module |
| US8563351B2 (en) * | 2010-06-25 | 2013-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for manufacturing photovoltaic device |
| WO2015145886A1 (ja) * | 2014-03-25 | 2015-10-01 | パナソニックＩｐマネジメント株式会社 | 電極パターンの形成方法及び太陽電池の製造方法 |
| DE102014104510B4 (de) * | 2014-03-31 | 2019-02-07 | Gottfried Wilhelm Leibniz Universität Hannover | Verfahren zum Fügen und Einrichtung zum Fügen einer Anordnung unter Verwendung des Verfahrens |
| CN104009124B (zh) * | 2014-06-13 | 2018-09-18 | 苏州苏大维格光电科技股份有限公司 | 太阳能电池超精细电极转移薄膜、制备方法及其应用方法 |
| DE102015112909B3 (de) * | 2015-08-05 | 2017-02-09 | Leonhard Kurz Stiftung & Co. Kg | Verfahren und Vorrichtung zum Herstellen einer Mehrschichtfolie |
| GB202107490D0 (en) * | 2021-05-26 | 2021-07-07 | Foilco Ltd | Electro-conductive transfer films |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0385995B1 (de) | 1987-07-08 | 1992-12-09 | Leonhard Kurz Gmbh & Co. | PRäGEFOLIE, INSBESONDERE HEISSPRäGEFOLIE, ZUR ERZEUGUNG VON LEITERBAHNEN AUF EINEM SUBSTRAT |
| DE68926361T2 (de) | 1988-03-25 | 1996-11-28 | Hitachi Techno Eng | Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck |
| US5620904A (en) * | 1996-03-15 | 1997-04-15 | Evergreen Solar, Inc. | Methods for forming wraparound electrical contacts on solar cells |
| US6146483A (en) * | 1997-03-25 | 2000-11-14 | Evergreen Solar, Inc. | Decals and methods for providing an antireflective coating and metallization on a solar cell |
| US6841225B2 (en) * | 1999-07-30 | 2005-01-11 | 3M Innovative Properties, Company | Touch screen with an applied edge electrode pattern |
| WO2007022226A2 (en) * | 2005-08-12 | 2007-02-22 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3036260A1 (de) * | 1980-09-26 | 1982-04-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur herstellung von elektrischen kontakten an einer silizium-solarzelle |
| DE3116078A1 (de) * | 1981-04-22 | 1983-01-20 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | "praegefolie" |
| US4396690A (en) * | 1981-05-04 | 1983-08-02 | Diamond Shamrock Corporation | Device for the simultaneous production of electricity and thermal energy from the conversion of light radiation |
| US5277734A (en) | 1991-11-07 | 1994-01-11 | Fred Bayer Holdings Inc. | Electrically conductive circuit sheet and method and apparatus for making same |
| JPH08307054A (ja) * | 1995-03-03 | 1996-11-22 | Dainippon Printing Co Ltd | 多層プリント配線板およびその製造方法 |
| JPH11208194A (ja) * | 1998-01-27 | 1999-08-03 | Toyo Screen Insatsu Kk | 転写用印刷物 |
| NL1016779C2 (nl) * | 2000-12-02 | 2002-06-04 | Cornelis Johannes Maria V Rijn | Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs. |
| US8222072B2 (en) * | 2002-12-20 | 2012-07-17 | The Trustees Of Princeton University | Methods of fabricating devices by low pressure cold welding |
| US7964439B2 (en) * | 2002-12-20 | 2011-06-21 | The Trustees Of Princeton University | Methods of fabricating devices by transfer of organic material |
| WO2007002376A2 (en) * | 2005-06-24 | 2007-01-04 | Konarka Technologies, Inc. | Method of preparing electrode |
| DE102005049891A1 (de) * | 2005-10-17 | 2007-04-19 | Leonhard Kurz Gmbh & Co. Kg | Metallisierter Mehrschichtkörper |
-
2007
- 2007-06-14 DE DE102007027998A patent/DE102007027998A1/de not_active Ceased
-
2008
- 2008-06-10 US US12/136,534 patent/US20080308150A1/en not_active Abandoned
- 2008-06-12 EP EP20080010672 patent/EP2003698A3/de not_active Withdrawn
- 2008-06-16 JP JP2008157077A patent/JP2008311665A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0385995B1 (de) | 1987-07-08 | 1992-12-09 | Leonhard Kurz Gmbh & Co. | PRäGEFOLIE, INSBESONDERE HEISSPRäGEFOLIE, ZUR ERZEUGUNG VON LEITERBAHNEN AUF EINEM SUBSTRAT |
| DE68926361T2 (de) | 1988-03-25 | 1996-11-28 | Hitachi Techno Eng | Verfahren und Vorrichtung zur Aufbringung einer dünnen Schicht auf ein Substrat unter Druck |
| US5620904A (en) * | 1996-03-15 | 1997-04-15 | Evergreen Solar, Inc. | Methods for forming wraparound electrical contacts on solar cells |
| US6146483A (en) * | 1997-03-25 | 2000-11-14 | Evergreen Solar, Inc. | Decals and methods for providing an antireflective coating and metallization on a solar cell |
| US6841225B2 (en) * | 1999-07-30 | 2005-01-11 | 3M Innovative Properties, Company | Touch screen with an applied edge electrode pattern |
| WO2007022226A2 (en) * | 2005-08-12 | 2007-02-22 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2003698A2 (de) | 2008-12-17 |
| EP2003698A3 (de) | 2008-12-24 |
| US20080308150A1 (en) | 2008-12-18 |
| JP2008311665A (ja) | 2008-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| R002 | Refusal decision in examination/registration proceedings | ||
| R003 | Refusal decision now final | ||
| R003 | Refusal decision now final |
Effective date: 20141202 |