DE102005054418A1 - Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte - Google Patents

Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte Download PDF

Info

Publication number
DE102005054418A1
DE102005054418A1 DE102005054418A DE102005054418A DE102005054418A1 DE 102005054418 A1 DE102005054418 A1 DE 102005054418A1 DE 102005054418 A DE102005054418 A DE 102005054418A DE 102005054418 A DE102005054418 A DE 102005054418A DE 102005054418 A1 DE102005054418 A1 DE 102005054418A1
Authority
DE
Germany
Prior art keywords
cluster layer
applying cluster
lead frame
former
carrier unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102005054418A
Other languages
English (en)
Other versions
DE102005054418B4 (de
Inventor
Frank Pueschner
Wolfgang Schindler
Peter Stampka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE102005054418A priority Critical patent/DE102005054418B4/de
Priority to JP2006306695A priority patent/JP2007141237A/ja
Priority to US11/560,058 priority patent/US7694888B2/en
Publication of DE102005054418A1 publication Critical patent/DE102005054418A1/de
Application granted granted Critical
Publication of DE102005054418B4 publication Critical patent/DE102005054418B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Ein Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte weist folgende Schritte auf. DOLLAR A Es wird eine Folie mit einer ersten und einer zweiten Oberfläche bereitgestellt, wobei die erste Oberfläche der zweiten Oberfläche gegenüberliegt. Die Folie wird derart strukturiert, dass mindestens ein Isoliergraben ausgebildet wird, wobei sich der Isoliergraben von der ersten Oberfläche bis zur zweiten Oberfläche erstreckt. Auf der ersten Oberfläche wird eine Clusterschicht aufgebracht. Nach dem Aufbringen der Clusterschicht auf der ersten Oberfläche wird die zweite Oberfläche mit einem Trägerelement verbunden.
DE102005054418A 2005-11-15 2005-11-15 Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte Active DE102005054418B4 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102005054418A DE102005054418B4 (de) 2005-11-15 2005-11-15 Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte
JP2006306695A JP2007141237A (ja) 2005-11-15 2006-11-13 チップカードのコンタクト層の製造方法
US11/560,058 US7694888B2 (en) 2005-11-15 2006-11-15 Method for producing a chip card contact zone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005054418A DE102005054418B4 (de) 2005-11-15 2005-11-15 Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte

Publications (2)

Publication Number Publication Date
DE102005054418A1 true DE102005054418A1 (de) 2007-05-16
DE102005054418B4 DE102005054418B4 (de) 2013-05-23

Family

ID=37982720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005054418A Active DE102005054418B4 (de) 2005-11-15 2005-11-15 Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte

Country Status (3)

Country Link
US (1) US7694888B2 (de)
JP (1) JP2007141237A (de)
DE (1) DE102005054418B4 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD983261S1 (en) 2019-12-20 2023-04-11 Capital One Services, Llc Vented laminated card

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19630049A1 (de) * 1996-07-25 1998-01-29 Siemens Ag Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone
DE10325564A1 (de) * 2003-06-05 2004-12-30 Infineon Technologies Ag Chipkartenmodul

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01210394A (ja) * 1988-02-19 1989-08-23 Matsushita Electric Ind Co Ltd 集積回路装置
FR2684235B1 (fr) * 1991-11-25 1999-12-10 Gemplus Card Int Carte a circuit integre comprenant des moyens de protection du circuit integre.
JPH05286289A (ja) * 1992-04-14 1993-11-02 Oki Electric Ind Co Ltd Ｉｃカードおよびその製造方法
DE19642563C1 (de) * 1996-10-15 1998-02-26 Siemens Ag Chipkarte mit einer Kontaktzone sowie Verfahren zur Herstellung einer solchen Chipkarte
DE19927051C2 (de) 1999-06-14 2002-11-07 November Ag Molekulare Medizin Verfahren und Vorrichtung zur Identifizierung einer Nukleotidsequenz
DE10035451C2 (de) 2000-07-19 2002-12-05 November Ag Molekulare Medizin Verfahren und Vorrichtung zur Identifizierung einer Polymersequenz
DE10042461C2 (de) 2000-08-29 2002-11-07 November Ag Molekulare Medizin Verfahren zur fälschungssicheren Markierung von Gegenständen und fälschungssichere Markierung
TW561358B (en) 2001-01-11 2003-11-11 Force Corp Z File switch and switched file system
US7077525B2 (en) 2001-02-06 2006-07-18 Optics 1, Inc Led-based flashlight
JP2004538586A (ja) * 2001-08-16 2004-12-24 ノヴェンバー アクティエンゲゼルシャフト ゲゼルシャフト フューア モレクラーレ メディツィーン オブジェクトの偽造防止マーキングおよびそのマーキングの識別方法
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
DE102004042187B4 (de) * 2004-08-31 2021-09-09 Infineon Technologies Ag Chipkartenmodul für eine kontaklose Chipkarte mit Sicherheitsmarkierung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19630049A1 (de) * 1996-07-25 1998-01-29 Siemens Ag Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone
DE10325564A1 (de) * 2003-06-05 2004-12-30 Infineon Technologies Ag Chipkartenmodul

Also Published As

Publication number Publication date
US20070148859A1 (en) 2007-06-28
DE102005054418B4 (de) 2013-05-23
JP2007141237A (ja) 2007-06-07
US7694888B2 (en) 2010-04-13

Similar Documents

Publication Publication Date Title
MY154934A (en) Chip card and method for the production of a chip card
BRPI0408964A (pt) método para fabricar um módulo eletrÈnico e módulo eletrÈnico
DE502005007956D1 (de) Smartcard-Körper, Smartcard und Herstellungsverfahren
ATE555498T1 (de) Herstellungsverfahren einer anordnung mit leistungshalbleiterbauelementen, welches einen schritt drucksintern beinhaltet
TW200723414A (en) A method of manufacturing a semiconductor device
TW200722875A (en) Liquid crystal display device and method for manufacturing the same
BRPI0405288A (pt) Módulo semicondutor de potência e processo para a sua fabricação
MY150130A (en) Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member
WO2009105367A3 (en) Integrated circuit package and method of manufacturing same
TW200737383A (en) Substrate with built-in chip and method for manufacturing substrate with built-in chip
SG170113A1 (en) Integrated circuit package with open substrate
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
TW200639952A (en) Surface roughing method for embedded semiconductor chip structure
TW200618289A (en) Integrated circuit and method for manufacturing
TW200721411A (en) Solder layer, heat-dissipating substrate using the same and manufacturing method thereof
EP1786034A3 (de) Leistungshalbleitermodul
DE102005054418A1 (de) Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte
PL1623369T3 (pl) Sposób montażu komponentu elektronicznego na substracie
WO2005006432A3 (de) Elektronisches bauelement und verfahren zur herstellung
SG129252A1 (en) Method for producing a semiconductor device and corresponding semiconductor device
WO2006066964A3 (en) An electronic device, a chip containing method and a contacting device
TW200520157A (en) Device and method for manufacturing the same
ATE254316T1 (de) Vorrichtung und herstellungsverfahren mit zumindest einem chip auf einem träger
TW200633096A (en) Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby
DE602006020179D1 (de) Ransponder

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20130824