DD231453A1 - DEVICE FOR REMOVING SEMICONDUCTOR OR GLASS ELEMENTS - Google Patents

Abstract

Apparatus for removing semiconductor or glass elements from disks pre-machined by microabrasive saws adhered to flexible film. By a suitable design of the provided with translational or rotary drive device, in particular by changing the structural-geometric conditions at the working gap and by changing the direction of advance of the film, a reliable, serial release is possible. According to the invention, a terminal base body connected to a terminal and a clamping yoke are used, which have an elastic covering and which are movable below a plate provided with an edge specially designed for deflection. When using a non-transparent film, a transparent alignment rule with a cutting-like alignment edge and / or mark is used to position the saw lines, wherein a film holder is used for fixing the position and tightening the film with the possibility of magazineing. The device is used for the removal of elements, in particular for hybrid circuit production. Fig. 2

Description

Inventor: Dipl.-Ing. Rainer Hartmann Berlin, 25.07.83

Doris Lindner P 1383

Zustellungsbevollm. :

Institute of Control Engineering

in the combine VEB EAV / Berlin-Treptow

"Friedrich Ebert"

1055 Berlin, Storkower Str. 101

Office for Property Rights

Device for detaching semiconductor or glass components

H 01 L 21/00

Field of application of the invention

The invention relates to a device for detaching semiconductor or glass elements, for example single chips, from a flat disk pre-machined by micro-rotation, for example a semiconductor wafer, which adheres or sticks to a flexible film. The detached elements are then sorted during singulation and stored in magazines or storage units. The elements which are stored in this way are required for the production of hybrid circuits or semiconductor devices with a viewing window.

Characteristic of the Known Technical Solutions The well-known micro-separation as singulation method is used in large quantities as a productive process with almost 100% yield. · As a special case of this technology, it is known to singulate or adhere semiconductor wafers by means of automatic chip bonding. The disadvantage of this method is the separation of diodes, transistors and low-alloy circuits. The disadvantage here is the high adjustment effort, wear phenomena on the piercing needle and consequent retardation of film residues on the backside of the semiconductor elements

integrated process elements or relatively larger chips, the method has proven itself, wherein pasted on film or adhesive semiconductor wafers sawn, broken and then separated by stretching the film and collected by means of piercing. A disadvantage is the high technical-economic effort with a decrease in the yield per disc.

DD-WP H 01 L / 233 798 describes a method and an arrangement for detaching and conveying further foil or adhesive-adhering semiconductor or glass elements, wherein, for example, the semiconductor wafer is cut in a chip size corresponding to the notch , In this case, the semiconductor or glass elements can be detached from the film with a relatively low economic outlay and with a technology that is easy to control with almost 100% yield, separated, sorted and stored in magazines.

The disadvantage here is that during the Äblösevorganges a curvature of the sliding through the working gap film can not be excluded, causing edge damage and uncontrolled jumping of the elements to be replaced.

Furthermore, it has the disadvantage that only relatively long films can be processed. This eliminates the processing of the increasingly used, relatively short films. The film clamped between the transport rollers is usually drawn obliquely with increasing processing of the semiconductor wafer, that is to say that the sawing lines thereof do not run parallel to the detachment edge. This leads to the unwanted detachment of several rows of chips simultaneously obliquely from one side.

To streamline the film in order to maintain the alignment of the Sägelinienrasters and avoid unwanted curvature have known devices vacuum holes in the support surface. The disadvantage is that during operation of these devices complex equipment for vacuum generation must be present, with the Foliestraffen proved by suction in practice as complicated and relatively ineffective.

Therefore, the tightening of the film is done by hand, because during the removal process corrections to the alignment of the saw lines parallel to the working gap are required to a small extent. This often leads to the formation of undesirable diagonal folds, which have damage to the film when passing through the working gap and the entire amount of chips remaining on it committee, because further detachment is impossible.

If the deviation of the saw lines from parallelism to the working gap is too great, the film must be released from the pressure of the transport rollers and realigned. This is done by the trial-and-error method and is therefore too time consuming.

To control the detachment process and the quality of the detached semiconductor or glass elements, the aforementioned Torrichtungen are used under the microscope, wherein the optical axis of the lens is located directly above the working gap. The excessively long rocker arm, from which detached elements which have been separated by lateral lifting, are to be discharged, collides with the projecting edge, as a result of which either this or the cutting edge formed as a cutting edge can be damaged.

The transport of the film takes place between two pressed-together transport rollers, one of which can be moved only with difficulty by means of a handwheel.

Object of the invention

The object of the invention is to enable a reliable and universal row-by-line detachment of adhesive or adhesive semiconductor or glass elements by means of the device, to reduce the technical complexity by production-favorable design and to improve the handling by application-oriented design.

Explanation of the essence of the invention

Decisive deficiencies of the known technical solutions are due to the structural conditions in the working gap, through which the film slides during the detachment process almost no play, by the vertical direction of pulling the film with respect to the surface of the plate on which it slides along and thereby by suction by means of vacuum insufficient tightening, whereby the film can form a curvature, which causes the detached from the sawed disc semiconductor or glass elements are pulled almost perpendicular to the separation edge and damaged by the force of the stretched film either at the edges and / or suddenly release impulsively from the adhesive or adhesive film at high speed.

Another deficiency is that the sawing lines of the disc of semiconductor or glass material, adhering to the film, not exactly parallel to the working gap can be aligned and a fixation of the position of the saw lines during clamping and propulsion is not possible and the production-related Deviation of the line of contact of the rolls transporting the film from the parallel position to the release edge thus leads to oblique detachment of several rows of elements simultaneously. To prevent this effect, the parallel alignment of the saw lines with hand during film advance must be corrected, whereby the formation of diagonal folds when passing The sharp peel edge can lead to film damage can not be ruled out. If the deviation of the saw lines from the parallelism to the working gap is too great, the film must be removed by the time-consuming trial-and-error method and then clamped until a favorable alignment of the sawing lines is achieved.

Since the operation of the known devices must be done under the microscope, it comes with lateral lifting of the rocker arm to shed detached elements, due to its length, designed according to the relatively large diameter of the largest possible wafer to be processed, to collide with the microscope objective edge, whereby this or the sharpness. Detaching edge of the rocker arm can be damaged.

The detached semiconductor or glass elements are picked up by the contact surface located above the detachment edge, transported over relatively long distances and deposited in pallet-shaped magazines with corresponding receiving compartments. The restoration of local formations according to the conditions of the original disk structure can be transferred to the magazine only with great effort. This results in the technical problem, by appropriate design of the provided with translational or rotary drive device, in particular by changing the structural-geometric conditions at the working gap, by changing the Vortriebrichtung the film and the dependent realization of the film transport a reliable detachment of the adhesive on film or · To allow adhering semiconductor or glass elements and their subsequent storage. At the same time, the saw lines of the sheet adhering or adhering to the sheet should be aligned parallel to the working gap by suitable means and this orientation should be fixed and retained during the stripping process without the use of vacuum, the film constantly being uniformly streamlined.

According to the invention, this object is achieved in that using a known plate on which the film rests and slides and is pulled from there by a parallel, relatively narrow working gap, adhering to the film or adhesive semiconductor or glass components a known release edge of the film are replaced in rows. In this case, a terminal base body and a movable relative to him clamping yoke are used. The terminal base body and the clamping yoke have an elastic coating on one or both contact surfaces, between which positive and non-positive by clamping a clamping nut the end of the film is clamped.

Between the contact surfaces of the terminal base body and the clamping yoke, the film is clamped over its entire width and is pulled by movement of the terminal body under a plate by a hand or rotary stepper motor

driven spindle in conjunction with a mother connected to the terminal body, which is a spring nut according to the invention and together with the spindle is a hammer ·

If the clamped film is pulled by actuation of the spindle drive under the plate., Which consists of ferromagnetic material, it slides in the working gap on a bead-like edge of this plate and is thereby directed under a release edge ·

If the discs of sawn semiconductor or glass material are on transparent foils, the sawing lines can be aligned along alignment lines located on the plate exactly parallel to the edge which is one side of the working gap.

If semiconductor or glass panes are processed on non-transparent foils, an alignment ruler is placed over the pane on the plate · By defined placement on the plate, a cutting edge and / or parallel line mark is aligned exactly parallel to the working gap, which is why the Alignment of the saw line grid can take place exactly parallel to the edge ·

If the alignment process is completed, the position of the film is fixed by placing a film holder. According to the invention, the fixation is performed by force between the attached magnetic film holder and ferromagnetic plate. The pinned film lies with one end in the relatively large gap between the edge of the plate and the tappet tipped by the latter, is smoothed between the contact surfaces of the clamp body and the clamping yoke and clamped by turning the clamping nut between them. The release is now tilted to the edge of the plate, with the foil lying between its release edge and the edge.

When the drive is actuated, the film slides through the working gap and is tightened by the attached foil holder. The drive is interrupted when a series of semiconductor or glass components is detached by the detachment edge and on a

lying over her lying support surface remains. From there, sorted detached elements are pushed lying in Aufnabmefächer a magazine strip lying in a slope of the remover. The filled magazine strip is picked up on its handling surfaces and secured in position by pins of a pallet intended to hold a plurality of filled magazine strips. Before an empty magazine strip is inserted into the slope, unserviceable detached elements are placed on a tray of the stripper and tilted by the stripper is then folded back onto the film, drained off. This process is repeated for each row of the elements to be detached.

If a pallet is completely filled with filled magazine strips, an empty pallet can be placed on it until it is filled with filled magazine strips. Conveniently, up to five filled pallets are stacked on top of each other with a cover closed and fixed by placing a clamp together and put thus a self-contained magazine

The clamped on the side walls in height and longitudinal body in connection with the clamped by the Klemmj och film according to the invention instead of a spindle drive in conjunction with a spring nut appropriate with the aid of a traction mechanism, eg · belt or cable transmission, or a controlled pneumatic or Hydraulic cylinder or a flat linear stepping motor can be moved below the plate.

embodiment

The invention will be explained in more detail with reference to an exemplary embodiment. The accompanying drawings show:

Fig. = 1: Device with the functional elements according to the invention without the second side wall in the position that the film can be aligned, fixed in position and clamped

FIG. 2: device with the functional elements according to the invention without the second side wall during the detachment process. FIG

Fig. 3: foil holder Fig. 4: alignment ruler

Fig. 5: Magazine in fully stocked and self-contained state

Fig. 6: Pallet with inserted magazine strip

The device is manipulated under the microscope to observe the orientation of the film 1, the peeling process and to check the quality of the released elements 1b. The device consists of a plate 2 which is fastened on two side walls 10. Between the side walls 10 a transverse plate 20 is arranged, in which a spindle 8 is rotatably mounted underneath the plate 2 and can not be displaced in the longitudinal direction · into the thread groove of the spindle 8 engage the springs 7a of the spring nut, wherein the spring nut 7 is connected to the between the side walls 10 laterally guided by the handles 14 in height in the guideways 10a Klemmgrundkorper 4. The edge 2b forms, with the detaching edge 3a of the remover 3, the working gap through which the film 1 slides almost without play. The remover 3 is rotatably mounted in the side walls 10 and can thus be removed from the edge 2b.

To detach the adhering or adhesive on the film 1 semiconductor or glass elements, for example, of individual chips of a thin semiconductor wafer wafer, the device for clamping the film 1 must be prepared. 2, the clamping nut 5a is moved to the stop 5h by turning it counterclockwise, and the clamping yoke 5 "is pushed up to the wedge nut 5a, thus providing a relatively wide gap between the clamping yoke 5 and the elastic lining 4a of the terminal body 4 made.

The film 1 with a sawed in mutually perpendicular grid lines disc to be replaced elements 1a is deposited and aligned on the plate 2. Sticks or

adheres to the disc peel-off elements 1a on a transparent film 1 through the film 1 through the edge 2b parallel alignment lines 2a visible. If a coincidence of the course of a saw line on the disc to be detached elements 1a achieved with an alignment rule 2a, all sawing lines are aligned exactly parallel to edge 2b ·

If the elements to be detached stick or adhere to nontransparent film 1, a ruler 12 with guide rails 13 is used for the parallel alignment of the saw lines to edge. About the resting on the plate 2 slide 1, the ruler 12 is placed so that it is set with its guide rails 13 on the surface of the plate 2 and at the same time is guided laterally without play. So set up, the alignment edge 12a or bar mark 12b runs parallel to the edge 2b. Here, the transparent ruler 12 is located at a relatively small distance from the surface of the elements to be replaced 1a. By alignment can be made with careful manipulation of the film 1, a coincidence of the course of the saw lines with the alignment edge 12 a or line mark 12b, so that the saw lines are also parallel to the edge 2b.

After completion of the alignment process, the reached position by placing a film holder, consisting of a handle rail 11 and a magnet 11 a, fixed. In this case, the film 1 is pressed by the force effect of the flat magnet 11a on the ferromagnetic plate 2 on the surface and held. As a result, a condition is met that the elements to be replaced 1a are stripped exactly row by row and not obliquely at the separation edge.

When the alignment and fixing is completed, the hanging over the edge 2b end of the film 1 is smoothly placed between the elastic pad 4a and clamping yoke 5 and by Klennnjoch 5 Klennnjoch 5 on the terminal base 4 by means of elastic pad 4a form-fitting and non-positive by turning screw clamped. The prismatic shape of the contact surfaces of elastic pad 4a and clamping yoke 5 causes a secure terminals

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the film 1 over the entire width, thus wrinkling during the removal process is avoided · Due to the force of the magnet 11a on the film 1 this remains even during manipulation during the clamping process in its fixed position. After clamping the film 1, the release 3 is moved to the position shown in Fig. 1, whereby the film 1 is over its entire width in the working gap. Thereafter, a magazine strip 15 is inserted in the slope 3c, which was removed from a waiting, equipped with empty magazine strips 15 pallet 16. Thereafter, the replacement of the elements takes place. For this purpose, the spindle 8 is offset by the drive 9 either by hand or rotary stepper motor in a clockwise rotation, whereby the rigidly connected to the terminal body 4- spring nut 7 pulls this together with the clamped film 1 under the plate 2, wherein at the same time the elements to be replaced 1a be moved towards edge 2b. In the process, the film holder received on the handle rail 11 and placed on the film 1 and moving together tightens it, which is why at the edge 2b the film 1 can not form a curvature or diagonal folds. The edge 2b is formed so that the film 1 slides from the surface of the plate 2 only via a right-angled edge and then a protruding, rounded or bead-like edge under the plate 2 in the direction of the spindle drive. As a result, the film 1 is not pulled vertically downwards within the working gap, but is conducted under the detaching edge 3a, which is why the elements 1a to be detached can be easily and reliably released from the film 1. In addition, a film curvature at the edge 2b is prevented.

By turning the spindle 8 to the right, the front edge of the first row of the elements 1a to be detached reaches the vicinity of the detaching edge 3a only relatively slowly. If the first row is ready to be peeled off more quickly, the rapid advance can be actuated, which is realized by the fact that the spring nut 7 and the spindle 8 constitute a hammer. The spring nut 7 is designed so that the spindle 8 is movable with a very large clearance in a through hole. Perpendicular to holes are arranged in which two arranged at a distance of the thread pitch spring rods of small diameter, the springs 7a store. _K

Further, perpendicular to the plane of the through hole and the holes for the springs 7a is aittig a continuous franking, which determines the elastic length with their extension for the springs 7a. If the spring 8 is rigidly connected to the terminal body 4 and pushed over the spindle 8 with a certain amount of force on the handles 14 guided in both guideways 10a, both springs 7a slide into the thread groove via their threads for a short time. Is the first row of elements to be replaced 1a in the desired vicinity of the detaching edge 3a, the force is applied to the handles 14 is interrupted and the drive 9 is actuated, the springs 7a engage frictionally in the thread groove and the spring nut 7 functions like a conventional mother and the terminal body 4 moves and thus the film 1 further moved to the Äblösekante 3a, the first row of the elements to be replaced 1a is completely peeled off and rests on the support surface 3b.

The detached elements 1 b are examined for quality under the microscope, the usable elements according to their position within the detached row in the receiving compartments 15 a arranged, after which the filled magazine strip 15 taken at its' handling surfaces 15 b and secured in position by two pins 17 in the pallet sixteenth is filed. Row by row, all usable detached elements 1b are detached from the disc adhering to the film 1 in this way, then placed in the magazine strip 15 and placed in pallets 16, these being stacked with filled magazine strips 15 stacked one above the other. On the top pallet 16, a lid 18 is then placed and connected by means of the clip 19 to a self-contained magazine. The o. G. Manner of magazining, for example of transistor chips, allows for easy retention of local formations according to the ratios of the original arrangement of the individual chips on a previously electronically measured disk within the magazine. Therefore, individual chips of a particular district of the disc are easily recognizable by the location within the magazine. After the filled magazine strips 15 are stored in the pallet 15, the on

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The abutment surface 3b remaining, unused detachable elements 1b placed on the empty slope 3o or shelf 3d and poured off by tilting the remover 3. Thereafter, the remover 3 is folded against the foil 1 resting on the edge 2b, whereby the device with an empty magazine strip 15 inserted in the slope 3c is ready to detach another row of elements 1a to be detached.

When a slice of peelable elements 1a is completely collected, the stripper 3ϊώ is tilted to the position shown in the Pig ·1 and the clamp base 4 is moved below the edge 2b, either by the rapid advance by force on the handles 14, with the pedestals 7 Thereafter, the clamping yoke 5 is released from the terminal base body 4 by turning the screw nut 7, which is movable on the threaded tube, anticlockwise, thereby releasing the foil 1. The processed film 1 can then be removed and the detachment process repeated ·

Claims (2)

invention claim Device for detaching semiconductor or glass components using a support plate for film and two mutually aligned parallel spaced apart edges, characterized in that a Klemmgrundkorper (4) and a clamping yoke (5) is used, wherein the Klemmgrundkorper ( 4) and / or the clamping yoke (5) contains an elastic covering (4a), that the contact surfaces of these prismatic, for example v- or u-shaped, or cylindrical are formed, that the terminal base body (4) together with the clamping yoke (5) below a plate (2) is movable and the Klemmgrundkörp'er (4) with a hammer, consisting of a Federal utter (7) and spindle (8) is connected and that the spindle (8) by a drive (9) either of Hand or rotary stepper motor is driven, that consisting of ferromagnetic material plate (2) has a specially designed for deflecting edge (2b) that when using v on transparent film (1) the plate (2) for aligning the saw lines, the elements present as round disc elements (1a), for example, semiconductor chips, alignment lines (2a) and / or that when using non-transparent film (1) a ruler (12) is provided with a cutting-like alignment edge (12a) of non-transparent and / or transparent material with one or more markings (12b) and guide rails (13) for alignment, that for fixing the position of the oriented film (1) and for tightening the film ( 1) during the detachment of the elements to be detached (1a), a film holder, consisting of a handle rail (11) and a magnet (11a) is used, that a bevel (3c) on a known toggle lever with detaching edge for receiving a magazine strip ( 15) and for sorted detached elements (1 b), for example, individual chips, a tray (3d) has that the magazine strip (15) receiving compartments (15 a) for receiving contains me selected detached elements (1b) and two handle surfaces - 14 - aufnehaibar and in a palette (16) can be deposited, that the pallet (16) a plurality of pins (17) for receiving individual magazine strips (15) that several pallets (16) with filled magazine strips (15) "are stacked, with a lid (18) closable and lockable by means of a clip (19) to form a self-contained magazine 2. Device according to item 1, characterized in that instead of the spindle drive (7 »8, 9) ®in Zugmittelgetriebe, for example, a toothed belt or rope gear, a controlled pneumatic or hydraulic cylinder or a linear stepping motor used For this 4-page drawings