DD131612A1 - Anordnung zur durchkontaktierung von leiterplatten - Google Patents

Anordnung zur durchkontaktierung von leiterplatten

Info

Publication number
DD131612A1
DD131612A1 DD7700198188A DD19818877A DD131612A1 DD 131612 A1 DD131612 A1 DD 131612A1 DD 7700198188 A DD7700198188 A DD 7700198188A DD 19818877 A DD19818877 A DD 19818877A DD 131612 A1 DD131612 A1 DD 131612A1
Authority
DD
German Democratic Republic
Prior art keywords
arrangement
contact
pcb conductors
pcb
conductors
Prior art date
Application number
DD7700198188A
Other languages
English (en)
Other versions
DD131612B1 (de
Inventor
Hermann Viehweger
Bernd Mai
Original Assignee
Hermann Viehweger
Bernd Mai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hermann Viehweger, Bernd Mai filed Critical Hermann Viehweger
Priority to DD19818877A priority Critical patent/DD131612B1/de
Priority to DE2813160A priority patent/DE2813160C2/de
Publication of DD131612A1 publication Critical patent/DD131612A1/de
Publication of DD131612B1 publication Critical patent/DD131612B1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
DD19818877A 1977-04-01 1977-04-01 Anordnung zur durchkontaktierung von leiterplatten DD131612B1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DD19818877A DD131612B1 (de) 1977-04-01 1977-04-01 Anordnung zur durchkontaktierung von leiterplatten
DE2813160A DE2813160C2 (de) 1977-04-01 1978-03-25 Anordnung zur Durchkontaktierung von Leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD19818877A DD131612B1 (de) 1977-04-01 1977-04-01 Anordnung zur durchkontaktierung von leiterplatten

Publications (2)

Publication Number Publication Date
DD131612A1 true DD131612A1 (de) 1978-07-05
DD131612B1 DD131612B1 (de) 1980-02-27

Family

ID=5507892

Family Applications (1)

Application Number Title Priority Date Filing Date
DD19818877A DD131612B1 (de) 1977-04-01 1977-04-01 Anordnung zur durchkontaktierung von leiterplatten

Country Status (2)

Country Link
DD (1) DD131612B1 (de)
DE (1) DE2813160C2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8910105U1 (de) * 1989-08-23 1990-12-20 Grote & Hartmann Gmbh & Co Kg, 5600 Wuppertal Kontaktelement für eine Leiterplatte
EP0568313A2 (de) * 1992-05-01 1993-11-03 Nippon CMK Corp. Verfahren zur Herstellung einer Mehrschichtleiterplatte
JPH05315760A (ja) * 1992-05-01 1993-11-26 Cmk Corp 多層プリント配線板の製造方法
DE19602832B4 (de) * 1996-01-26 2005-09-29 The Whitaker Corp., Wilmington Kontaktelement zum Durchkontaktieren einer Leiterplatte

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH411068A (de) * 1961-10-18 1966-04-15 Photocircuits Corp Verfahren zum Herstellen von Bauelementen nach Art gedruckter Schaltungen und nach diesem Verfahren hergestelltes Bauelement
US3281751A (en) * 1963-08-30 1966-10-25 Raymond H Blair Spring connector for printed circuit board
US3279040A (en) * 1963-12-23 1966-10-18 Ibm Wire installation
US3391375A (en) * 1965-10-23 1968-07-02 William D. Richards Lead connections in printed circuits
DE1690347A1 (de) * 1968-02-24 1971-05-13 Telefunken Patent Verfahren zur Herstellung einer Verdrahtungsplatte
US3616532A (en) * 1970-02-02 1971-11-02 Sperry Rand Corp Multilayer printed circuit electrical interconnection device
DE2643574A1 (de) * 1976-09-28 1978-03-30 Preh Elektro Feinmechanik Verfahren zur herstellung elektrischer leiterplatten

Also Published As

Publication number Publication date
DD131612B1 (de) 1980-02-27
DE2813160C2 (de) 1983-12-15
DE2813160A1 (de) 1978-10-12

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