CS198477B1 - Polishinh tool with bonded polishing micrograins - Google Patents

Description

BACKGROUND OF THE INVENTION The present invention relates to a polishing tool with bonded polishing microsms for high-intensity precision polishing of brittle materials, particularly glass without the supply of free polishing powders.

The introduction of a fundamentally new modernization of precision optical elements machining with 0-bonded mesh and mlkron powder of synthetic diamond accelerates machine operations on individual machine spindles 5 to 10 times. At the same time, however, it raises the need to solve approximately the same effective modernization of their precision optical polishing process. The main brake to such polishing modernization is the use of techniques requiring suspensions of free polishing powders carried by so-called polishing tools, consisting of shaped metal tops covered on a functional surface with a plastics material consisting of conventional suitably filled polishing pitches or more preferably synthetic differently modified polishing foils.

Thus, there is a need to provide a highly efficient polishing tool with bound polishing microsms, and this object is solved by the object of the invention, which is a polishing tool for high intensity precision polishing of brittle materials, especially glass without supply of free polishing powders.

SUMMARY OF THE INVENTION The active tool layer is a homogeneous polycrystalline material with a micro-mosaic structure, formed by the interconnection of individual crystalline microsomes of brittle metal oxides, such as cerium oxide, zirconium oxide, iron oxide in polishes, for the active structural state.

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Crystalline microsms of medium size 2 to 5 microns are bonded therein either directly by sintering or via an ultra-thin bonding intermediate layer with selectable bond strength to an active layer compressive strength greater than 1Ma.

the polishing tool operates with a supply of clean water as a cutting fluid at a peripheral cutting speed of 2 to 5 m / β and at a working pressure of 3.10 * to 1.10 ^ Pa.

The individual microsma of polishing oxides in the surface and in the volume of the active tool layer according to the invention form a set of individual bound brittle tips without the formation of its undefined isolated hard conglomerates. The individual grains undergo mild wear and shredding during the polishing process and bind with their active surface in the presence of water as a cutting fluid to the glass surface, thereby conditional on the desorption and disintegration of the surface zone of the polished material. The resulting wear of the active layer is in the order of magnitude less than the volume of the polished material removed by polishing. During the polishing process, grains of polishing powders in the form of solid conglomerates must not be released from the active layer. Such released conglomerates or microheterogens in the surface of the active layer in the form of hard conglomerates cause deterioration of the polished optical surface by defects in the form of crystals. For this reason, the known bonded polishing tools produced by the high-fill technique of organo-organic resins, for example based on epoxy resins and phenolphosmaldehyde resins with polishing oxides as inorganic fillers, are not applicable for precise optical polishing. Thus, the present invention provides a different manufacturing technique and structure for the active polishing tool layer with bound polishing oxides.

The invention solves a new principle of polishing tool with high polishing efficiency and precision for brittle materials, especially glass, eliminating the need to supply an aqueous suspension of polishing oxides with all disadvantages.

Practical example

The convex faces of R - 31.19 mm of ten 19 mm optic-glass SK 18 optical lenses on a common support were polished with a tool whose homogeneous micro-tiny polycrystalline layer consisted of bonded fogs of polishing OeOg. The tool worked on a flying machine with a circumferential cutting speed of 4.3 m / β and a permanently centered constant pressure of 4.10 * *a. An opaque layer (relief layer, undercoat microtubes, and undercoat stress zone) was removed from the lens surface and thus polished the surface within 1.5 minutes.

rSedhSt vyhálezo

Claims (2)

rSedhSt vyhálezo 1. A polishing tool with bonded polishing micro-sounds for high-intensity precision polishing of brittle materials, particularly acne without the supply of suspensions of free polishing powders, characterized in that the active tool layer is a homogeneous polycrystalline material with micromosal structure formed by as Oric oxide, Zirconia, Iolezite in Their 188 477 for active structure polishing, A polishing tool according to claim 1, characterized in that crystalline Hiikroswa of medium size of 2 to 5 microns are joined in the cell directly by solar or through an ultra-thin bonding intermediate layer and an optional bond strength to an active layer of more than 1 MPa.