CN203171384U - Point contact polishing device of aspheric surface optical element - Google Patents
Point contact polishing device of aspheric surface optical element Download PDFInfo
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- CN203171384U CN203171384U CN 201320123777 CN201320123777U CN203171384U CN 203171384 U CN203171384 U CN 203171384U CN 201320123777 CN201320123777 CN 201320123777 CN 201320123777 U CN201320123777 U CN 201320123777U CN 203171384 U CN203171384 U CN 203171384U
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- grinding
- dumping
- polishing
- polishing dish
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Abstract
The utility model discloses a point contact polishing device of an aspheric surface optical element. The point contact polishing device comprises a toolholder and a polish-grinding disk base body, wherein the toolholder is used for being connected with the polish-grinding disk base body and can be installed on a tool shaft of CNC machining equipment, or the polish-grinding disk base body and the toolholder are combined to be a whole to be used as an independent polishing device. Polishing membranes are adhered to the polish-grinding disk base body. The point contact polishing device of the aspheric surface optical element is applied to a grinding machine which is mentioned in the Chinese patent (ZL200810103309.8), is matched with exclusive technology software to be used, and can achieve the purposes of improving machining precision and machining efficiency and lowering production cost.
Description
Technical field
The utility model relates to a kind of some contact burnishing device of aspherical optical element.
Background technology
Aspherical optical element has huge advantage with respect to the spherical optics element, all aspherical optical element is had huge demand in the every field of modern society.Therefore, how high-accuracy high-efficiency rate ground carries out the current social problem demanding prompt solution of being processed into of non-spherical element.
At present, ripe aspherical optical element numerical control polishing technology is mainly used in the bigbore optical element processing, such as based on the numerical control optical surface forming technique of little polishing disc tool, strain disc polishing technology, ion beam polishing technology, Technique of Magnetorheological Finishing etc.Aforesaid Computerized Numerical Control processing technology, the surface figure accuracy of its processing is very high, all can reach the precision that is better than λ/10, but its processing cost but is unaffordable for range of application aspherical optical element processing more and more widely.The mode of manual processing has been broken away from the processing of aperture aspherical optical elements basically.
For in small-bore aspherical optical element, that present stage is still manual processing and digital control processing and deposit state.Manual processing has higher requirement to workman's experience, machining accuracy is higher, surface figure accuracy with element that the processing workman of rich experiences processes can reach the degree of λ/10 equally, but working (machining) efficiency is low, is difficult to adapt to society to the demand of aspherical optical element; And in the Computerized Numerical Control processing technology of small-bore aspherical optical element generally adopt technology such as die forming, injection molded, the working (machining) efficiency of these Numeric Control Technologies is quite high, but because its process principle all belongs to and copies the processing category, machining accuracy is the precision of limited mould to a great extent, and its machinable material also has certain limitation.
Summary of the invention
The utility model purpose is: a kind of grinding and polishing apparatus that is applicable to the processing of aspherical optical element numerical control polishing is provided, on the grinding machine of in Chinese patent (ZL 200810103309.8), mentioning, be used the purpose that to reach raising machining accuracy and working (machining) efficiency, reduces production costs with proprietary process software.
The technical solution of the utility model is: a kind of some contact burnishing device of aspherical optical element, comprise pad and grinding and polishing dish matrix, the tool spindle that described pad is used for connecting grinding and polishing dish matrix and can be installed in numerically controlled processing equipment, perhaps close grinding and polishing dish matrix and pad as a whole, as a burnishing device independently, be pasted with polished film on the described grinding and polishing dish matrix, described grinding and polishing dish matrix can be bowl mill matrix or the pot mill matrix of dumping of dumping.
Preferably, outstanding grinding and polishing brace rod is arranged at described pad bottom, be used for cooperating with the grinding and polishing dish locating interface of described grinding and polishing dish matrix top depression, after pad and grinding and polishing dish matrix be connected and fixed, described grinding and polishing brace rod is pressed in the grinding and polishing dish locating interface, does not occur the space between the two.Thereby guarantee the axiality of described grinding and polishing dish matrix, pad.
Preferably, all be provided with hickey on described pad and the grinding and polishing dish matrix, both are connected and fixed by screw.Described screw is preferably soket head cap screw.Both guarantee connection reliability between the two, made things convenient for installation and maintenance again.
Preferably, described grinding and polishing dish matrix can be the bowl mill matrix of dumping, and profile is cylindrical shape, and the bottom is circular-arc, the described bowl mill matrix of dumping comprises the top to the bowl mill of the lower recess locating interface of dumping, and the bowl mill matrix underpart circular arc place that dumps is used for pasting polished film; The dump radius of curvature of matrix bottom circular arc of described bowl mill is r
1
, the polished film surface sections curve after the finishing is an accurate circular arc, the circular arc radius of curvature is r
2
, polished film thickness is h, satisfies r
2
=r
1
+ h.
Preferably, described grinding and polishing dish matrix can be the pot mill matrix of dumping, and profile is sphere or the part of ball, and the described pot mill matrix of dumping comprises the top to the pot mill of the lower recess locating interface of dumping, and described polished film sticks on the sphere; The dump sphere curvature radius of matrix of described pot mill is r
3
, the polished film sphere curvature radius after the finishing is r
4
, polished film thickness is h, satisfies r
4
=r
3
+ h.
The utility model has the advantages that:
1. the radius of curvature on the polished film surface in the utility model device can be implemented in accurately finishing of position; The processing mode of some contact can guarantee that various curved surfaces all can process.
2. the utility model is controlled the feed speed of grinding and polishing dish matrix on each Working position and the rotating speed of workpiece to be processed by numerically controlled processing equipment, namely can guarantee the constant pressure that contacts between grinding and polishing dish on each Working position and workpiece, guarantee constant removal amount, and then realized determining amount processing.
In the utility model independently pad have versatility, thereby reduced the processing cost of device.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further described:
Fig. 1 is the structure chart of first embodiment of the utility model grinding and polishing apparatus;
Fig. 2 is the structure chart of pad;
Fig. 3 is the dump structure chart of matrix of bowl mill;
Fig. 4 is that bowl mill is dumped and carried out the schematic diagram of polished film finishing;
Fig. 5 adopts the concave curved component of first embodiment to carry out the outer schematic diagram of throwing processing;
Fig. 6 adopts the concave curved component of first embodiment to carry out the interior schematic diagram of throwing processing;
Fig. 7 adopts the concave surface element of first embodiment to carry out the schematic diagram of grinding and polishing processing;
Fig. 8 is the structure chart of second embodiment of the utility model grinding and polishing apparatus;
Fig. 9 is the dump structure chart of matrix of pot mill among Fig. 8;
Figure 10 adopts the concave curved component of second embodiment to carry out the schematic diagram of grinding and polishing processing;
Figure 11 adopts the concave surface element of second embodiment to carry out the schematic diagram of grinding and polishing processing.
Wherein: 1, pad; 11, grinding and polishing brace rod; 2, the bowl mill matrix of dumping; 21, the bowl mill locating interface of dumping; 3, polished film; 31, outer arc; 32, inner arc; 4, screw; 5, the pot mill matrix of dumping; 51, the pot mill locating interface of dumping; 6, trimming wheel; 7, workpiece to be processed; 100, grinding and polishing apparatus.
The specific embodiment
Embodiment one: as shown in Figure 1, pad 1 bottom is provided with grinding and polishing brace rod 11, can be pressed into the dump bowl mill on matrix 2 tops of bowl mill and dump in the locating interface 21.During installation, grinding and polishing brace rod 11 is pressed into bowl mill dumps in the locating interface 21, and fixing with the bowl mill matrix 2 of dumping, make grinding and polishing brace rod 11 and bowl mill dump and do not occur the gap between the locating interface 21.Wherein, pad 1 is by any one spanner interface, and is fastening as interior triangle, Nei Sijiao, interior hexagonal, diplopore interface etc. and the bowl mill matrix 2 of dumping, and both guaranteed connection reliability between the two thus, makes things convenient for installation and maintenance again.
Bowl mill is dumped circular arc place, matrix 2 bottom for pasting polished film 3.Polished film 3 can be chosen according to the material of workpiece to be processed 7, and polished film 3 cutting shapes can be any, with paste conveniently, fastening be criterion.Adopt binding agent that polished film 3 is pasted on the dump circular arc place of matrix 2 bottoms of bowl mill, pasting height is criterion to paste fastening.
During assembling, at first grinding and polishing brace rod 11 is pressed into bowl mill and dumps in the locating interface 21, preferably fixing by soket head cap screw and the bowl mill matrix 2 of dumping, make grinding and polishing brace rod 11 and bowl mill dump and do not occur the gap between the locating interface 21; Smear binding agent in the polished film that cuts 3 one sides again and be pasted on the dump circular arc place of matrix 2 bottoms of bowl mill, to be bonded dose solidify after, namely finish processing and prepare.
After said structure and assembling, can carry out the finishing of polished film 3 to grinding and polishing apparatus 100.Grinding and polishing apparatus 100 is installed on the workpiece spindle of numerically controlled processing equipment, trimming wheel 6 is installed on the tool spindle of numerically controlled processing equipment, adopt the some way of contact that polished film 3 circular arc radius of curvature are repaired.If workpiece to be processed 7 is for convex surface and adopt outer throwing mode to carry out grinding and polishing processing, then only need the outer arc 31 of polished film 3 is repaired; If workpiece to be processed 7 is for convex surface and adopt interior throwing mode to carry out grinding and polishing processing, then only need the inner arc 32 of polished film 3 is repaired; If workpiece to be processed 7 is concave surface, then only need the outer arc 31 of polished film 3 is repaired; Also can repair outer arc 31 and the inner arc 32 of polished film 3 simultaneously.Circular arc radius of curvature through the polished film 3 after the finishing is consistent everywhere, improved positioning accuracy and machining accuracy that grinding and polishing adds man-hour.
Be illustrated in figure 5 as and adopt a pair of concave curved component of present embodiment to carry out the outer schematic diagram of throwing processing.In use, grinding and polishing apparatus 100 is installed on the tool spindle of numerical control device, can rotate around the tool spindle axis, and around tool spindle oscillation center B spot wobble, and grinding and polishing apparatus 100 feeding in the horizontal direction; Workpiece to be processed 7 is installed on the workpiece spindle of numerical control device, can rotate around the workpiece spindle axis, but the feeding of workpiece in the vertical direction.In the processing mode of Paoing, the P point is positioned at polished film 3 exterior lateral area outside.In the process of grinding and polishing, at first the sized data of aspheric relevant parameter to be processed and grinding and polishing apparatus 100 is imported process software, and generation numerical control NC file, grinding and polishing apparatus 100 and workpiece to be processed 7 can be under the controls of numerical control device, make on any Working position, grinding and polishing apparatus 100 and workpiece to be processed 7 are all realized at P point place contacting, and the P point fits like a glove in aspheric meridian cross section curve to be processed with respect to the movement locus of workpiece.
Be illustrated in figure 6 as and adopt a pair of concave curved component of present embodiment to carry out the interior schematic diagram of throwing processing.Be that in the processing mode of interior throwing, the P point is positioned at the medial region of polished film 3 with outer throwing processing mode difference.
Be illustrated in figure 7 as the schematic diagram that adopts a pair of concave surface element of present embodiment to carry out grinding and polishing processing.
Embodiment two: as shown in Figure 8, the grinding and polishing apparatus 100 of present embodiment comprises pad 1 and the pot mill matrix 5 of dumping, identical among described pad 1 and the embodiment one, described pot mill is dumped matrix 5 as shown in Figure 9, and described pad 1 is used for installing the pot mill matrix 5 of dumping; Described pot mill is dumped matrix 5 for attaching polished film 3; Described polished film 3 is used for realizing grinding and polishing processing with the P point as specifying contact point to contact with the workpiece (not shown).The assemble flow of present embodiment and identical with first embodiment to the finishing of polished film.
In the present embodiment, the pot mill matrix 5 of dumping has adopted spherical design, and the advantage of this profile is to specify the position range of choice of contact point P big than first embodiment, so the linear velocity scope that P is ordered is also bigger, is conducive to grinding and polishing processing.Different with first embodiment is, adopts second embodiment to add man-hour, and concave curved component can only adopt outer mode of throwing to process.
As Figure 10, shown in Figure 11, be respectively and adopt two pairs of concave curved component of present embodiment, concave surface element to carry out the schematic diagram of grinding and polishing processing.
No matter be understandable that, be to adopt first embodiment or second embodiment, owing to be the processing mode of a contact, the wearing and tearing that the meeting appearance continues in specifying contact point P place and near zone thereof, after wearing and tearing occurring, decline will inevitably appear in machining accuracy.At this moment, can by change to specify contact point P on polished film 3 the position or again polished film 3 is repaired to recover machining accuracy.Preferably adopt the position of change contact point P, because by finishing, the circular shape of polished film 3 is circles of standard, P point optional position on circular arc, the distance relation of itself and center of arc all is well-determined.The finishing repeatedly to polished film 3 can be avoided in the position of change contact point P, improves the utilization rate of polished film 3.After repeatedly the position of contact point P is specified in change, in order to guarantee machining accuracy, then must repair again polished film 3.
Certainly above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the people who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection domain of the present utility model with this.All modifications of doing according to the spiritual essence of the utility model main technical schemes all should be encompassed within the protection domain of the present utility model.
Claims (5)
1. the point of an aspherical optical element contacts burnishing device, it is characterized in that: comprise pad (1) and grinding and polishing dish matrix, the tool spindle that described pad (1) is used for connecting grinding and polishing dish matrix and can be installed in numerically controlled processing equipment, be pasted with polished film (3) on the described grinding and polishing dish matrix, described grinding and polishing dish matrix can be bowl mill matrix (2) or the pot mill matrix (5) of dumping of dumping.
2. the point of a kind of aspherical optical element according to claim 1 contacts burnishing device, it is characterized in that: outstanding grinding and polishing brace rod (11) is arranged at described pad (1) bottom, be used for cooperating with the grinding and polishing dish locating interface of described grinding and polishing dish matrix top depression, after pad (1) and grinding and polishing dish matrix be connected and fixed, described grinding and polishing brace rod (11) is pressed in the grinding and polishing dish locating interface, does not occur the space between the two.
3. the point of a kind of aspherical optical element according to claim 1 contacts burnishing device, and it is characterized in that: all be provided with hickey on described pad (1) and the grinding and polishing dish matrix, both are connected and fixed by screw (4).
4. the point of a kind of aspherical optical element according to claim 1 contacts burnishing device, it is characterized in that: described grinding and polishing dish matrix can be the bowl mill matrix (2) of dumping, profile is cylindrical shape, the bottom is circular-arc, the described bowl mill matrix (2) of dumping comprises that the top is to the bowl mill of the lower recess locating interface (21) of dumping, polished film (3) be used for is pasted at the bowl mill circular arc place, matrix (2) bottom that dumps, and the dump radius of curvature of matrix (2) bottom circular arc of described bowl mill is r
1, the polished film after the finishing (3) surface sections curve is an accurate circular arc, the circular arc radius of curvature is r
2, polished film (3) thickness is h, satisfies r
2=r
1+ h.
5. the point of a kind of aspherical optical element according to claim 1 contacts burnishing device, it is characterized in that: described grinding and polishing dish matrix can be the pot mill matrix (5) of dumping, profile is sphere or the part of ball, the described pot mill matrix (5) of dumping comprises that the top is to the pot mill of the lower recess locating interface (51) of dumping, described polished film (3) sticks on the sphere, and the dump sphere curvature radius of matrix (5) of described pot mill is r
3, the polished film after the finishing (3) sphere curvature radius is r
4, polished film (3) thickness is h, satisfies r
4=r
3+ h.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320123777 CN203171384U (en) | 2013-03-19 | 2013-03-19 | Point contact polishing device of aspheric surface optical element |
| DE112014000978.4T DE112014000978T5 (en) | 2013-03-19 | 2014-04-24 | Polishing device for optical elements and corresponding method |
| PCT/CN2014/076076 WO2014146620A1 (en) | 2013-03-19 | 2014-04-24 | Optical element polishing device and method |
| US14/772,307 US20160008944A1 (en) | 2013-03-19 | 2014-04-24 | Polishing device for optical elements and method thereof |
| US16/261,582 US10967475B2 (en) | 2013-03-19 | 2019-01-30 | Polishing method for optical elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320123777 CN203171384U (en) | 2013-03-19 | 2013-03-19 | Point contact polishing device of aspheric surface optical element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203171384U true CN203171384U (en) | 2013-09-04 |
Family
ID=49068137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320123777 Expired - Fee Related CN203171384U (en) | 2013-03-19 | 2013-03-19 | Point contact polishing device of aspheric surface optical element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203171384U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192305A (en) * | 2013-03-19 | 2013-07-10 | 西安交通大学苏州研究院 | Point contact polishing device and method of aspheric-surface optical element |
| WO2014146620A1 (en) * | 2013-03-19 | 2014-09-25 | 西安交通大学 | Optical element polishing device and method |
| CN111376142A (en) * | 2019-12-25 | 2020-07-07 | 苏州大学 | Numerical control milling, grinding, forming and polishing method and device for large-aperture aspherical mirror |
-
2013
- 2013-03-19 CN CN 201320123777 patent/CN203171384U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192305A (en) * | 2013-03-19 | 2013-07-10 | 西安交通大学苏州研究院 | Point contact polishing device and method of aspheric-surface optical element |
| WO2014146620A1 (en) * | 2013-03-19 | 2014-09-25 | 西安交通大学 | Optical element polishing device and method |
| CN111376142A (en) * | 2019-12-25 | 2020-07-07 | 苏州大学 | Numerical control milling, grinding, forming and polishing method and device for large-aperture aspherical mirror |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130904 |