JPS632673A - Super abrasive grain tip for turning - Google Patents

Abstract

PURPOSE:To improve a cutting property and an adhering property by laminatingly adhering with an adhesive, plural sheets which is formed by bonding super abrasive grains on both front and back sides of a small piece of meshed base material made of inorganic or organic synthetic fiber with a resin group adhesive. CONSTITUTION:Abrasive grains containing 20 wt% or more super abrasive grains 2 such as diamond, cubic system boron nitride, etc. are fixedly bonded on both front and back sides of a circular, triangular or square small piece of meshed base material 1 made of inorganic fiber or organic synthetic fiber, with an aperture of 0.4-1.5 mm, and with 10-30 mesh by means of a resin group adhesive 3 in such a way that a blind hole (clogging) is less than 75 % of the mesh. Then, plural sheets of meshed base materials 1 on which abrasive grains are fixedly bonded are laminatedly adhered into an integrated form, to obtain a circular, triangular, or square super abrasive grain tip on the surface of which a super grain layer 4 is exposed. Thereby, a good machining face which has a long lasting cutting property and which can elastically acts on a hard and brittle material can be obtained.

Description

[Detailed Description of the Invention] (Field of Industrial Application) The present invention is used for removing difficult-to-cut materials such as various ceramics, cemented carbide, heat-resistant steel, and high-speed steel, and can be attached to various cutting tools. This is used between the super abrasive chips used for milling.

(Prior Art) Conventionally, indexable inserts for milling have been made of materials such as cemented carbide, cermet, and sintered bodies of diamond, cubic boron nitride, alumina, and silicon nitride. These throw-away chips are used for milling of steel, special steel, various metals, etc., but these throw-away chips can also be used to machine so-called fine ceramic sintered bodies such as alumina, zirconia, silicon carbide, and silicon nitride. It is difficult to process these by turning, and currently, grinding wheels using diamond abrasive grains are widely used to process these materials. Grinding wheels using superabrasive grains such as diamond and cubic boron nitride are metal bonded,
There are those made by resin bond, vitrified bond, and electrodeposition, but these superabrasive grinding wheels, except for electrodeposition wheels, have abrasive grains embedded in the bond due to their structure. The protrusion of the grain cutting edge is small, and many of them are non-porous, meaning there are no chip pockets, and the removal of chips and coolant supply are not sufficient, resulting in deterioration of the abrasive grains and bond layer due to the generation of processing heat, and damage to the bond layer. A clogging phenomenon occurs, resulting in a decrease in sharpness, and it is necessary to frequently dress (dress) the blade during use. - On the other hand, electrodeposited whetstones can achieve slightly better sharpness by appropriately controlling the protrusion of the abrasive grain cutting edge from the bond layer, but since the abrasive grain layer is a single layer, compared to It reached the end of its service life in a relatively short period of time, and in any case, efficient grinding work could not be performed. In addition, although there are some differences depending on the material of the bond layer and the material of the alloy that supports the abrasive layer, superabrasive grinding wheels generally have high rigidity, so they have good processing accuracy. However, especially when machining hard and brittle materials such as ceramics, there are many cases in which chipping or microcracks are not produced on the machined surface, which often causes serious defects in the quality of the machined surface, and even slight damage to the machined surface can cause problems during machining. It is known that it leads to a significant reduction in the breaking stress of objects.
Cracks that occur during the grinding process using a diamond tool must be removed by lapping or boring as a post-process.

(Problems to be Solved by the Present Invention) The present invention makes it possible to remove various ceramics, cemented carbide, etc., which was impossible to perform by turning with a conventional throw-away tip, and moreover, The object of the present invention is to provide a superabrasive slow 7-way chip for milling that does not overcome the drawbacks of conventional superabrasive grinding wheels as described above and has good sharpness and durability.

(Means for Solving the Problems) The present invention is made of inorganic fibers or organic synthetic fibers, has a mesh size of 0.4 to 1.5 m++w, and has a mesh of circular, triangular or square pieces of 10 to 30 meshes. Two super abrasive grains such as diamond or cubic boron nitride are applied to both the front and back sides of the base material.
Abrasive grains containing 0% by mass or more are bonded and fixed using a resin adhesive so that the blind holes (occlusion) of the mesh are 75% or less of the mesh, and multiple sheets of this are laminated and bonded to integrate, as shown in Figure 1. It has a circular, triangular, or square shape as illustrated.

The superabrasive chip of the present invention can be manufactured, for example, as follows.

(1) Apply an undercoat of a liquid phenolic resin or other resin-based adhesive to both the front and back surfaces of a small piece of mesh base material shaped according to the purpose.

(2)! Abrasive grains are applied to the entire front and back surfaces of the M-striped base material or to both the front and back surfaces of an appropriate width from the outer edge, and the adhesive is dried by heating.

(3) The dried material is further coated with the above resin adhesive, and heated to dry and semi-cure the adhesive.

(4) l! Dry and semi-cured, either as is or newly impregnated and coated with a resin adhesive, stack multiple sheets with their outer edges aligned so that the width corresponds to the purpose, and use a mold. After applying hot pressure to completely cure and integrate the resin, it is removed from the mold and used as a chip.

Before the above process of applying an undercoat of adhesive to the base material,
If necessary, it is also effective to modify the base material by applying an adhesive of the same type for the purpose of sealing or imparting rigidity.

The state of adhesion of the abrasive grains to the base material before lamination and adhesion is determined by the second
As shown in Figures 3 and 3, a single layer or multiple layers of abrasive grains 2 are tightly bonded to the base material with an adhesive 3 so as to wrap the threads 1 constituting the mesh, with the cutting blades protruding. . It is desirable that the blockage of blind holes in the mesh of the abrasive grain fixing part by abrasive grains and adhesive is 75% or less in order to discharge chips and provide sufficient coolant. .

The fibers constituting the mesh base material used in the present invention include glass fibers, carbon fibers, silicon carbide fibers, alumina fibers, mullite fibers, and other nM high-strength fibers, aromatic polyamide fibers, nylon fibers, vinylon fibers, etc. The base material is selected from organic synthetic fibers such as , polyester a fiber, phenolic fiber, rayon fiber, etc., and a mesh base material of these alone, blended, or interwoven is used. ? ! The opening of the 4-eye base material is 0.
・4~1.5mm, the density of vertical and horizontal threads is 10~
30 meshes (pieces/25mm) are preferable. If the mesh size is coarser than 10 meshes and the opening is 1.5mm or more, the distribution of abrasive grains that adhere to the surface of the base material will be rough, resulting in a decrease in the sharpness of the chip. In addition, if the mesh size is smaller than 30 meshes or less than 0.4av, the meshes will be blocked by the abrasive grains and adhesive, making it difficult to achieve the desired effect of the present invention.

The abrasive grains used in the present invention are mainly so-called superabrasive grains such as diamond and cubic boron nitride, but depending on the material of the workpiece, some of the expensive superabrasive grains may be replaced with general abrasive grains.
By using a mixed abrasive grain containing at least 20% by mass of superabrasive grains, sufficient sharpness and durability can be exhibited. The general abrasive grains mentioned here are JIS R6111
In addition to artificial abrasives such as alumina abrasives, silicon carbide abrasives, alumina-zirconia abrasives, and boron carbide as specified in 2013, it also refers to natural abrasives such as silica, garnet, and corundum.

The resin adhesive used in the present invention is mainly a liquid type, selected from thermosetting resins such as phenol resin, epoxy resin, and polyimide resin, and heat-resistant resin adhesives. Used in conjunction with wood.

The shape of the superabrasive chip of the present invention is circular, triangular, or square, and if necessary, a circular hole for attachment is provided in the center. Furthermore, if necessary, a seven-ring ring may be provided in the center in advance for attachment.

(Function) The superabrasive chip of the present invention is used as a slow 7-way chip in a circumferential milling or face milling method, but the action of the chip on the machined surface is not a so-called cutting action, but an intermittent grinding action. I can say that.

The present invention is an embodiment in which a mesh base material is used as a supporting base material, and superabrasive grains are fixed so as to leave openings in the mesh, which are laminated and integrated. When used in the adhesive layer, the many tiny cutting edges of the superabrasive grains that protrude from the adhesive layer act on the workpiece, and a sufficient amount of coolant can be supplied through the open mesh, allowing for smooth discharge of chips. , no clogging, good sharpness and durability. In addition, the type of mesh base material, type of adhesive and coating 1E
By adjusting the balance such as coating density of abrasive grains,
The tips of the present invention can be obtained from those with high rigidity to those with a certain degree of flexibility, and even if they are highly rigid, unlike conventional cemented carbide tips, there is
It acts as a kind of buffer, allowing for smooth machining.

<Example> Outer diameter 2 (law
φ, hole diameter 6-+1φ, thickness 0.18mm, near 0.
91I11. A mesh base material made of vinylon fiber with a density of 20 mesh was coated with an adhesive of the same type as above, and diamond abrasive grains with a particle size of #80/100 were sprayed on both the front and back sides in a width of 2 mg from the outer edge, and dried by heating. Furthermore, an adhesive of the same type as above was applied as a top coat and dried by heating to a semi-cured state. At this time, the mesh occlusion caused by the abrasive grains and adhesive was approximately 50%, and the thickness of the abrasive grain fixed portion was 0.8 mm. 18 sheets of this were stacked with their outer edges aligned, placed in a mold, compressed under pressure until the thickness became 7s+m, and heat-treated as it was to completely harden the resin and turn it into a resin. The chip had a diameter of 20 mIIφ and a thickness of 7 mm.

The above 8 chips were attached to a face milling cutter, and silicon nitride ceramics with a thickness of 20 mm was machined using a vertical milling machine at a cutting depth of 3 mm, a feed rate of 3011 II, 1 layer of 1 nm, and a processing speed of 1300 m/win. It was also demonstrated that efficient machining is possible, which is not possible with conventional tools.

(Effects of the Invention) The superabrasive tip of the present invention makes it possible to machine various ceramics, cemented carbide, etc., which was impossible with conventional throw-away tips, and makes it possible to machine various types of ceramics, cemented carbide, etc. Efficient machining is now possible without the deterioration in sharpness that occurs when cutting.

In particular, when processing hard and brittle materials such as fine ceramics, the tip of the present invention using low-grain diamond acts more elastically on the processing surface than conventional diamond grinding wheels with high rigidity. It was possible to obtain a machined surface with no or very few defects without cracking or chipping.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of various embodiments of the superabrasive chip of the present invention, and FIG. 2 is a partially omitted plan view showing the state of adhesion of abrasive grains to the mesh base material before lamination of one embodiment of the present invention. Figure, 3rd
The figure is an enlarged sectional view showing the state of attachment of one grain of '6J to the threads constituting the network before lamination of the present invention. 1...Mesh base material 2...Super abrasive grain 3...Adhesive 4...Super abrasive layer Fig. 1 Fig. 2 Fig. 3 Procedure
Amendment January 22, 1986

Claims (5)

[Claims] (1) Abrasive grains containing 20% by mass or more of superabrasive grains such as diamond or cubic boron nitride are bonded with resin to both the front and back surfaces of a small piece of a circular, triangular or square mesh base material made of inorganic fibers or organic synthetic fibers. A super-abrasive chip for milling, characterized in that it is made by combining and fixing a plurality of chips with an adhesive, aligning their outer edges, and laminating and bonding them together using the adhesive or other resin-based adhesive. (2) The mesh base material has a mesh opening of 0.4 to 1.5 mm,
The superabrasive chip for milling according to claim 1, having a density of 10 to 30 mesh. (3) The superabrasive for milling according to claim 1, wherein the blind holes (occlusion) of the network by the resin adhesive and abrasive grains for bonding fixation and lamination adhesion are 75% or less of the network. Chip. (4) The abrasive grains are bonded and fixed to both the front and back sides of a small piece of the mesh base material having an appropriate width from the outer edge.
Super abrasive tip for milling as described in Section 1. (5) The superabrasive chip for milling according to claim 1, wherein a circular hole is provided in the center of each small piece of the mesh base material.