JP2001087943A - Composite rotary cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutter capable of cutting a siding material in good performance. SOLUTION: A composite rotary cutter is composed of a diamond abrasive grain layer and a sintered diamond or super-hard tip, and groove cutting is made by the abrasive grain layer whose height is made some higher than the tip, where the chips from machining are removed chiefly through the action of the tip. The width of the abrasive grain layer is made some larger than the tip so that the abrasive grain layer is allowed to make grinding of the cut wall surface, and the tip makes finishing work of the ground wall surface simultaneously with removal of the chips. Thus a high grade cut surface is produced with no loading and with a stable sharpness of cutting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an asbestos cement board,
The present invention relates to a calcium silicate board, a lightweight cement board, a wood cement board, a gypsum slag board, and a cutter suitable for cutting a composite board using the same.

[0002]

2. Description of the Related Art The cutting of a siding material as described above is performed by using a chip saw in which a cemented carbide chip is brazed to a substrate or a diamond cutting wheel in which diamond abrasive grains are electrodeposited on the outer peripheral edge of a steel disc. I have. However, when the siding material is cut with a carbide tip saw, the cutting edge is worn out in a short time, and the cutting edge needs to be polished and corrected again, which is inefficient. In addition, the diamond electrodeposition cutting grindstone is inferior in machinability and has poor discharge property of chips, so that clogging occurs, and there is a drawback that frequent dressing is required. Thus, neither was satisfactory for cutting the siding material.

Japanese Utility Model Publication No. 58-23546 proposes that a part of a cemented carbide tip constituting a cutting edge of a tip saw is a sintered diamond tip. Sintered diamond tips have abrasion resistance several tens of times higher than carbide tips, and even if the cutability of the carbide tips deteriorates, the cutability is guaranteed by the sintered diamond tips. However, in the present invention, although the cutting process is shared by a large number of carbide tips, the burden on the sintered diamond tips is reduced, but the carbide tips with poor wear resistance wear in a short time, and in fact, When the load on the cemented diamond tip begins to increase, the sintered diamond tip has a disadvantage that it is mechanically brittle and easily chipped. Machinability that makes full use of the features described above does not last so long.

Japanese Utility Model Application Laid-Open No. 2-97006 proposes a composite cutter of a tip saw made of a carbide tip or a sintered diamond tip and a diamond cutting whetstone. In the present invention, the height of the cutting edge of the tip saw is made higher than the cutting edge made of diamond abrasive, and the cutting operation is performed by the outer edge of the tip saw. Occurs and the cutting ability is reduced. Therefore, the width of the cutting edge made of diamond abrasive grains is made wider than the width of the tip cutting edge so that the cutting of the side face side of the cutting edge is burdened on the diamond abrasive blade, so that the cutting of the side face is shared by the side abrasive grains. To reduce shoulder droop. However, since the cutting action by the outer peripheral blade is performed by a tip saw, the wear of the cemented carbide tip is fast, and after the wear of the cemented carbide tip, the cutting action is allotted to the sintered diamond tip, and the cutting of the sintered diamond tip is performed. Blade chipping is inevitable.

[0005]

As described above, a tip saw is not suitable for cutting such a material, and if the effective cutting chips are removed in a diamond cutting whetstone, the sharpness and the life can be stabilized more than the tip saw. it can. In view of the above, the present invention shares the cutting action of the diamond abrasive blade, and removes the generated chips from the sintered diamond tip or the carbide tip, and serves to perform the cutting process of the cut surface by the diamond abrasive blade. Accordingly, it is an object of the present invention to provide a cutter capable of obtaining stable sharpness, long life, and good cut surface quality.

[0006]

A cutter according to the present invention is a cutter in which cutting blades made of a sintered diamond chip or a cemented carbide chip and a diamond abrasive layer are arranged at appropriate intervals on the outer periphery of a cutter substrate. The cutting edge height of the diamond abrasive layer is higher than the cutting edge height of the chip, and the former cutting edge width is wider than the latter cutting edge width. By having such a configuration, the outer peripheral cutting edge and the side blade of the diamond abrasive grains are directly involved in the processing of the drawing groove portion and the processing of the cutting wall surface which are directly involved in the cutting action, and the chip has passed the abrasive cutting edge. At the same time as the subsequent cutting of the cutting line is performed, the chips are scraped out by the chips, so that the chip removing operation can be performed.

When the diamond abrasive layer is formed by electrodeposition, the projection amount of the abrasive is preferably large, but a metal bond having an abrasive holding force may be used. The average diameter of the diamond abrasive grains is preferably 0.3 to 1 mm. Fine grains of less than 0.3 mm have poor sharpness, and coarse grains of more than 1 mm have a rough cut surface and poor quality.

It is important that the difference h between the height of the cutting edge of the diamond abrasive layer and the height of the cutting edge of the tip is 0.1 to 1.0 mm. By providing this difference, the chip plays a role of scraping off chips in the kerf portion generated by cutting the diamond abrasive layer by the outer peripheral blade. If h is less than 0.1 mm, the tips of the abrasive grains will be worn in a short time, and the chips will be involved in cutting, thus causing the above-mentioned problems.
In addition, if there is an interval exceeding 1.0 mm, the chip does not serve to remove chips.

In a conventional tip saw or cutting whetstone, chips are deposited on the cut wall surface of the work material and must be manually removed by a wire brush or the like in a later step. The present invention
If the difference t between the diamond abrasive grain layer width and the chip width is within a specific range, the diamond layer side blade grinds the cut wall surface of the work material, and the chip side blade only removes chips generated by the grinding action. However, it was found in actual processing that the cutting wall was not exposed to the above-mentioned cutting surface because the cutting wall was exposed to the cut wall surface of the work material. What is important is that the difference t between the diamond abrasive grain layer width and the tip width is 0.0
5 to 0.2 mm. Depending on the conditions such as the outer diameter of the cutter, thickness, cutting conditions, precision of the apparatus, rigidity, etc., if t is within the above range, the cutter side blade may come into contact with the cutting wall surface due to vibration during cutting, cutter deflection, etc. , Has the effect of removing the chips attached together with the removal of chips, the chips do not adhere to the cut surface, and if t is set to a small interval of less than 0.05 mm, the tip side blade performs a cutting action, Although there is no problem in removing chips, there is a case where a saw mark is put on the cut wall surface.On the other hand, if the interval exceeds 0.2 mm, the chips adhered to the cut wall surface are not completely removed and remain. There is.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the cutter of the present invention. Reference numeral 1 denotes a steel disk having a diamond abrasive grain layer 2 and a sintered diamond chip 3 provided on an outer periphery thereof. The diamond abrasive layer is formed by electrodepositing diamond abrasive particles having an average particle size of # 30 (about 600 μm), and the sintered diamond chip is brazed. The diamond abrasive layer is divided by the segment grooves 5, and tooth grooves 4 are provided between the sintered diamond chip and the diamond abrasive layer, and both serve to eliminate chips.

The outer diameter of the cutter, that is, the outermost diameter of the diamond abrasive layer is 390 mm. As shown in FIG. 2, the difference h between the cutting edge height of the abrasive layer and the tip is 0.5 mm. It was set to become. As shown in FIG. 3, the difference t (t = ｔ (w−c)) is set to 0 by setting the width w of the abrasive layer to 10.5 mm and the width c of the chip to 10.3 mm. .1m
m. In the embodiment, the cutting edge of the tip is shown as a flat blade, but may be a surface mounting blade or a staggered blade. Further, the blade width is the same width from the cutting edge to the cutting edge, but a trapezoidal tip may be used in which the cutting width decreases from the cutting edge to the cutting edge. In the embodiment, the number of expensive diamond chips is set to 4 chips. Therefore, in order to prevent the diamond abrasive layer from becoming longer, the elimination of chips and the clogging easily occurring, a large number of The structure provided with the segment groove 5 was adopted. The number of chips may be increased, the number of expensive sintered diamond chips may be reduced, and some may be replaced with carbide tips. In the present invention, since the chips do not directly participate in the cutting operation, all of the chips may be made of wear-resistant sintered diamond chips.

[0012]

As described above, the present invention comprises a diamond saw and a chip saw provided with a sintered diamond tip or a carbide tip on the outer periphery of a steel disc, and the cutting edge height of the diamond abrasive grain layer Is slightly higher than the height of the cutting edge of the tip saw so that the cutting groove is cut by the diamond abrasive layer, and the chip cutting edge removes chips. Furthermore, the diamond abrasive grain layer width is slightly wider than the chip width, and the diamond abrasive grain layer side blade grinds the cutting wall surface, and the chip side blade exposes the wall surface and completely removes cuttings adhering to the wall surface. It can be removed to obtain a good quality cut surface. In addition, the chip removes chips and performs cutting of the cut surface, and is not involved in the cutting, so that a cutter with stable sharpness and a long life can be provided.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a cutter according to the present invention.

FIG. 2 is a partial explanatory view showing a relationship between cutting edge heights in the cutter of the present invention.

FIG. 3 is a partial explanatory view showing a relationship between cutting edge widths in the cutter of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Steel disk 2 Diamond abrasive grain layer 3 Tip 4 Tooth groove 5 Segment groove h Difference in cutting edge height t Difference in cutting edge width

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kazushi Obata 2-80, Hokita-cho, Sakai-shi, Osaka F-term in Osaka Diamond Industry Co., Ltd. (reference) 3C058 AA03 AA09 CA01 CA04 CB10 3C069 AA01 BA04 BB01 BB02 CA08 EA02 EA03

Claims (3)

[Claims] 1. A rotary composite cutter provided with a cutting blade formed by brazing a sintered diamond tip and / or a carbide tip to the outer periphery of a steel disk and an abrasive layer formed by fixing a diamond abrasive layer. A rotary composite cutter, wherein the cutting edge height of the abrasive layer is higher than the cutting edge height of the tip, and the former cutting edge width is wider than the latter cutting edge width. 2. The difference h between the cutting edge height of the diamond abrasive layer and the cutting edge height of the tip is 0.1 to 1.0 mm, and the difference between the width of the diamond abrasive layer and the width of the tip is 2. 2. The rotary composite cutter according to claim 1, wherein t is 0.05 to 0.2 mm. 3. The rotary composite cutter according to claim 1, wherein the diamond abrasive layer has an average particle diameter of 0.3 to 1 mm.